公开(公告)号：US20180261567A1

公开(公告)日：2018-09-13

申请号：US15973782

申请日：2018-05-08

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Ruby Ann Maya Merto ,  Jerry Gomez Cayabyab ,  Edsel Gomez Balagtas

IPC分类号： H01L23/00

CPC分类号： H01L24/78 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/77 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/77704 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/78744 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/00015 ,  H01L2224/37099

摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.

公开(公告)号：US09997490B2

公开(公告)日：2018-06-12

申请号：US14663978

申请日：2015-03-20

申请人： Texas Instruments Incorporated

发明人： Ruby Ann Maya Merto ,  Jerry Gomez Cayabyab ,  Edsel Gomez Balagtas

IPC分类号： B23K37/00 ,  B23K37/04 ,  H01L23/00

CPC分类号： H01L24/78 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/77 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/77704 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2924/20751 ,  H01L2224/37099

摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.

公开(公告)号：US20180033758A1

公开(公告)日：2018-02-01

申请号：US15723724

申请日：2017-10-03

申请人： Texas Instruments Incorporated

发明人： Roxanna Bauzon Samson ,  Ruby Ann Maya Merto ,  Lorraine Rivera Duldulao ,  Jason Binay-an Colte

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L21/48 ,  H01L21/78

CPC分类号： H01L24/27 ,  H01L21/4839 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2741 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00012

摘要： A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.

公开(公告)号：US20150371930A1

公开(公告)日：2015-12-24

申请号：US14307880

申请日：2014-06-18

申请人： Texas Instruments Incorporated

发明人： Ruby Ann Maya Merto ,  Roxanna Bauzon Samson

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/91 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/16237 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32013 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/7565 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/8185 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2224/756 ,  H01L2224/45099

摘要： A method of making an IC package having a die and a substrate that are to be attached at an attachment station including providing the die and substrate and, at a location remote from the attachment station, coating at least one of the die and a die attachment portion of the substrate with attachment medium.

摘要翻译： 一种制造具有模具和基板的IC封装的方法，所述芯片和基板将被附接在附接站处，所述附接站包括提供所述管芯和基板，并且在远离所述附接站的位置处涂覆所述管芯和管芯附件中的至少一个 基底的一部分与附着介质。

公开(公告)号：US20150343572A1

公开(公告)日：2015-12-03

申请号：US14294671

申请日：2014-06-03

申请人： Texas Instruments Incorporated

发明人： Ruby Ann Maya Merto ,  Wilmar Estandian Subido

IPC分类号： B23K37/04 ,  H01L23/00

CPC分类号： B23K37/04 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/8385 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/37099

摘要： A wire bonding window clamp including a frame structure defining a central clamp opening that has a flat bottom surface adapted to engage a leadframe sheet and at least one elongate strand of material extending between opposed portions of the frame structure and adapted to engage the leadframe sheet.

摘要翻译： 一种引线接合窗夹具，其包括限定中心夹具开口的框架结构，所述框架结构具有适于接合引线框架片的平坦底表面和在所述框架结构的相对部分之间延伸并且适于接合所述引线框架片材的至少一条细长材料股线。

公开(公告)号：US11152324B2

公开(公告)日：2021-10-19

申请号：US15723724

申请日：2017-10-03

申请人： Texas Instruments Incorporated

发明人： Roxanna Bauzon Samson ,  Ruby Ann Maya Merto ,  Lorraine Rivera Duldulao ,  Jason Binay-an Colte

IPC分类号： H01L23/49 ,  H01L23/00 ,  H01L23/495 ,  H01L21/48

摘要： A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.

公开(公告)号：US20180261568A1

公开(公告)日：2018-09-13

申请号：US15978043

申请日：2018-05-11

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Ruby Ann Maya Merto ,  Jerry Gomez Cayabyab ,  Edsel Gomez Balagtas

IPC分类号： H01L23/00

CPC分类号： H01L24/78 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/77 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/77704 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/78744 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/00015 ,  H01L2224/37099

摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.

公开(公告)号：US20160276305A1

公开(公告)日：2016-09-22

申请号：US14663978

申请日：2015-03-20

申请人： Texas Instruments Incorporated

发明人： Ruby Ann Maya Merto ,  Jerry Gomez Cayabyab ,  Edsel Gomez Balagtas

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L21/687 ,  B23K1/00

CPC分类号： H01L24/78 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/77 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/77704 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2924/20751 ,  H01L2224/37099

摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.

摘要翻译： 线焊机窗夹组件。 组件包括适于支撑引线框条的支撑板。 组件还包括框架结构，该框架结构限定了适于暴露引线框架条的一部分的中心夹具开口。 框架结构包括至少一个细长框架构件，其具有适于接合引线框架条的顶表面的第一表面部分和适于接合安装在引线框条上的集成电路（“IC”）组件堆叠的上表面的第二表面部分 。

公开(公告)号：US20160276185A1

公开(公告)日：2016-09-22

申请号：US14660703

申请日：2015-03-17

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Roxanna Bauzon Samson ,  Ruby Ann Maya Merto ,  Lorraine Rivera Duldulao ,  Jason Binay-an Colte

IPC分类号： H01L21/67 ,  H01L23/32 ,  H01L23/00 ,  H01L23/495 ,  H01L21/683 ,  H01L21/78

CPC分类号： H01L24/27 ,  H01L21/4839 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2741 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00012

摘要： A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.

摘要翻译： 制造多个集成电路（“IC”）封装的方法包括拾取多个物理上未连接的IC部件; 并且同时将每个物理上未连接的IC部件放置在包含一片整体连接的引线框的未封装的IC封装条的相应部分上。