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公开(公告)号：US10811292B2
公开(公告)日：2020-10-20
申请号：US16128653
申请日：2018-09-12
IPC分类号： H01L21/00 , H01L21/673 , B65D85/30 , H01L21/268 , H01L21/78
摘要： Apparatus to store singulated wafers for transport, including multiple wafer assemblies stacked in the interior of a container housing, the individual wafer assemblies including an expanded laser diced wafer singulated into dies, a first frame spaced outward from the wafer on a carrier structure, a second frame spaced outward from the wafer and inward from the first frame on the carrier structure, and a foam structure that supports the second frame and the carrier structure.
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公开(公告)号：US20170278776A1
公开(公告)日：2017-09-28
申请号：US15078071
申请日：2016-03-23
发明人： Dolores Babaran Milo , Mark Gerald Rosario Pinlac , Bobby Johns Lansangan Villacarlos , Jerry Gomez Cayabyab , Juan Carlo Aro Rimando
IPC分类号： H01L23/495 , H01L23/29 , H01L21/48 , H01L23/00 , H01L23/31
CPC分类号： H01L23/49582 , H01L21/4853 , H01L23/293 , H01L23/3121 , H01L23/49541 , H01L24/05 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/04042 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48245 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/85464 , H01L2224/8582 , H01L2224/92247 , H01L2924/01028 , H01L2924/01046 , H01L2924/01079 , H01L2924/0132 , H01L2924/01403 , H01L2924/17724 , H01L2924/17747 , H01L2924/1776 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/01001 , H01L2924/01007 , H01L2924/01029 , H01L2924/00
摘要： A semiconductor device having a leadframe including a pad (101) surrounded by elongated leads (110) spaced from the pad by a gap (113) and extending to a frame, the pad and the leads having a first thickness (115) and a first and an opposite and parallel second surface; the leads having a first portion (112) of first thickness near the gap and a second portion (111) of first thickness near the frame, and a zone (114) of reduced second thickness (116) between the first and second portions; the second surface (112a) of the first lead portions is coplanar with the second surface (111a) of the second portions. A semiconductor chip (220) with a terminal is attached the pad. A metallic wire connection (230) from the terminal to an adjacent lead includes a stitch bond (232) attached to the first surface of the lead.
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3.发明授权公开(公告)号：US11276615B2
公开(公告)日：2022-03-15
申请号：US16573651
申请日：2019-09-17
IPC分类号： H01L23/495 , H01L23/043 , H01L23/31
摘要： A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
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公开(公告)号：US09997490B2
公开(公告)日：2018-06-12
申请号：US14663978
申请日：2015-03-20
CPC分类号： H01L24/78 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/77 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/77704 , H01L2224/78301 , H01L2224/78704 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/14 , H01L2924/00015 , H01L2924/20751 , H01L2224/37099
摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
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5.发明申请公开(公告)号：US20200013688A1
公开(公告)日：2020-01-09
申请号：US16573651
申请日：2019-09-17
IPC分类号： H01L23/043 , H01L23/495 , H01L23/31
摘要： A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
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公开(公告)号：US20180261567A1
公开(公告)日：2018-09-13
申请号：US15973782
申请日：2018-05-08
IPC分类号： H01L23/00
CPC分类号： H01L24/78 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/77 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/77704 , H01L2224/78301 , H01L2224/78704 , H01L2224/78744 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/14 , H01L2924/20751 , H01L2924/00015 , H01L2224/37099
摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
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公开(公告)号：US09824959B2
公开(公告)日：2017-11-21
申请号：US15078071
申请日：2016-03-23
发明人： Dolores Babaran Milo , Mark Gerald Rosario Pinlac , Bobby Johns Lansangan Villacarlos , Jerry Gomez Cayabyab , Juan Carlo Aro Rimando
IPC分类号： H01L23/495 , H01L23/00 , H01L23/31 , H01L21/48 , H01L23/29
CPC分类号： H01L23/49582 , H01L21/4853 , H01L23/293 , H01L23/3121 , H01L23/49541 , H01L24/05 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/04042 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48245 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/85464 , H01L2224/8582 , H01L2224/92247 , H01L2924/01028 , H01L2924/01046 , H01L2924/01079 , H01L2924/0132 , H01L2924/01403 , H01L2924/17724 , H01L2924/17747 , H01L2924/1776 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/01001 , H01L2924/01007 , H01L2924/01029 , H01L2924/00
摘要： A semiconductor device having a leadframe including a pad (101) surrounded by elongated leads (110) spaced from the pad by a gap (113) and extending to a frame, the pad and the leads having a first thickness (115) and a first and an opposite and parallel second surface; the leads having a first portion (112) of first thickness near the gap and a second portion (111) of first thickness near the frame, and a zone (114) of reduced second thickness (116) between the first and second portions; the second surface (112a) of the first lead portions is coplanar with the second surface (111a) of the second portions. A semiconductor chip (220) with a terminal is attached the pad. A metallic wire connection (230) from the terminal to an adjacent lead includes a stitch bond (232) attached to the first surface of the lead.
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公开(公告)号：US20200083076A1
公开(公告)日：2020-03-12
申请号：US16128653
申请日：2018-09-12
IPC分类号： H01L21/673 , H01L21/268 , H01L21/78 , B65D85/30
摘要： Apparatus to store singulated wafers for transport, including multiple wafer assemblies stacked in the interior of a container housing, the individual wafer assemblies including an expanded laser diced wafer singulated into dies, a first frame spaced outward from the wafer on a carrier structure, a second frame spaced outward from the wafer and inward from the first frame on the carrier structure, and a foam structure that supports the second frame and the carrier structure.
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9.发明授权公开(公告)号：US10418294B1
公开(公告)日：2019-09-17
申请号：US15980453
申请日：2018-05-15
IPC分类号： H01L23/495 , H01L23/043 , H01L23/31
摘要： A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
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公开(公告)号：US20180261568A1
公开(公告)日：2018-09-13
申请号：US15978043
申请日：2018-05-11
IPC分类号： H01L23/00
CPC分类号： H01L24/78 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/77 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/77704 , H01L2224/78301 , H01L2224/78704 , H01L2224/78744 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/14 , H01L2924/20751 , H01L2924/00015 , H01L2224/37099
摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
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