公开(公告)号：US20230327630A1

公开(公告)日：2023-10-12

申请号：US18131044

申请日：2023-04-05

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Rei Goto ,  Hironori Fukuhara ,  Benjamin Paul Abbott

IPC: H03H3/08

CPC classification number: H03H3/08 ,  H03H9/25

Abstract: A method of manufacturing an acoustic wave device is provided. The method of manufacturing the acoustic wave device comprises providing a layer of piezoelectric material, disposing a pair of interdigital transducer electrodes on an upper surface of the layer of piezoelectric material, each interdigital transducer electrode including a bus bar and a plurality of electrode fingers extending from the bus bar towards an edge region of the interdigital transducer electrode at the distal ends of the electrode fingers, and etching trench portions into the upper surface of the layer of piezoelectric material, the trench portions overlapping with the edge regions of the interdigital transducer electrodes. The formation of the trench portions through etching results in an easier fabrication, that is less likely to damage the interdigital transducer electrodes.

公开(公告)号：US20220407496A1

公开(公告)日：2022-12-22

申请号：US17806365

申请日：2022-06-10

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Michael David Hill ,  Benjamin Paul Abbott ,  Yosuke Hamaoka ,  Hiroyuki Nakamura ,  Alan Sangone Chen

IPC: H03H9/02 ,  H03H9/25 ,  H03H9/145 ,  H03H9/64

Abstract: A acoustic wave resonator comprises a piezoelectric substrate and a plurality of interdigital transducer (IDT) electrodes disposed on the piezoelectric substrate, the plurality of IDT electrodes formed of a mixture of tungsten and chromium to provide for reduction in size and increase in quality factor of the acoustic wave resonator.

公开(公告)号：US20220271734A1

公开(公告)日：2022-08-25

申请号：US17651300

申请日：2022-02-16

Applicant: Skyworks Solutions, Inc.

Inventor： Benjamin Paul Abbott ,  Gong Bin Tang ,  Rei Goto ,  Keiichi Maki

IPC: H03H9/145 ,  H03H3/10 ,  H03H9/02 ,  H03H9/25 ,  H03H9/64

Abstract: An acoustic wave filter includes a piezoelectric layer. A first acoustic wave device includes a portion of the piezoelectric layer and a first multi-layer interdigital transducer electrode disposed over the first portion of the piezoelectric layer. Additional acoustic wave devices are coupled to the first acoustic wave device, the additional acoustic wave devices including a second portion of the piezoelectric layer and a plurality of multi-layer interdigital transducer electrodes disposed over the second portion of the piezoelectric layer. At least one of the plurality of multi-layer interdigital transducer electrodes includes a layer that is thinner than a corresponding layer of the same material of the first multi-layer interdigital transducer electrode of the first acoustic wave device.

公开(公告)号：US20240243720A1

公开(公告)日：2024-07-18

申请号：US18410258

申请日：2024-01-11

Applicant: Skyworks Solutions, Inc.

Inventor： Joshua James Caron ,  Rei Goto ,  Benjamin Paul Abbott ,  Hiroyuki Nakamura

IPC: H03H9/02 ,  H03F3/24 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64 ,  H04B1/40

CPC classification number: H03H9/02685 ,  H03F3/245 ,  H03H9/02574 ,  H03H9/02834 ,  H03H9/02842 ,  H03H9/145 ,  H03H9/25 ,  H03H9/6406 ,  H03H9/6483 ,  H04B1/40 ,  H03F2200/451

Abstract: Aspects of this disclosure relate to a surface acoustic wave filter with an acoustic velocity adjustment structure. The surface acoustic wave filter can include a first interdigital transducer electrode disposed on a piezoelectric layer, an acoustic reflector disposed on the piezoelectric layer, and a second interdigital transducer electrode disposed on the piezoelectric layer. The second interdigital transducer electrode is longitudinally coupled to the first interdigital transducer electrode and positioned between the first interdigital transducer electrode and the acoustic reflector. The acoustic velocity adjustment structure can be positioned over at least a gap between the first interdigital transducer electrode and the second interdigital transducer electrode. The acoustic velocity adjustment structure can be arranged to increase an acoustic wave propagation velocity in a first region that includes the gap relative to a second region over at least a portion of the first interdigital transducer electrode.

公开(公告)号：US11909378B2

公开(公告)日：2024-02-20

申请号：US17099603

申请日：2020-11-16

Applicant: Skyworks Solutions, Inc.

Inventor： Joshua James Caron ,  Rei Goto ,  Benjamin Paul Abbott ,  Hiroyuki Nakamura

IPC: H03H9/145 ,  H03H9/64 ,  H03H9/25 ,  H03H9/02 ,  H03F3/24 ,  H04B1/40

CPC classification number: H03H9/02685 ,  H03F3/245 ,  H03H9/02574 ,  H03H9/02834 ,  H03H9/02842 ,  H03H9/145 ,  H03H9/25 ,  H03H9/6406 ,  H03H9/6483 ,  H04B1/40 ,  H03F2200/451

Abstract: Aspects of this disclosure relate to a surface acoustic wave device that includes a first reflector over a piezoelectric layer, a second reflector over the piezoelectric layer, and an interdigital transducer electrode structure over the piezoelectric layer and positioned between the first reflector and the second reflector. The surface acoustic wave device includes a velocity adjustment layer arranged to adjust acoustic velocity in a region of the surface acoustic wave device. The velocity adjustment layer can be a high speed layer or a low speed layer.

公开(公告)号：US20230336147A1

公开(公告)日：2023-10-19

申请号：US18299618

申请日：2023-04-12

Applicant: Skyworks Solutions, Inc.

Inventor： David Albert Feld ,  Michael David Hill ,  Benjamin Paul Abbott ,  Cedric Olivier Poirel ,  Rei Goto

IPC: H03H9/02

CPC classification number: H03H9/02834 ,  H03H9/02102

Abstract: Aspects of this disclosure relate to an acoustic wave device with a silicon oxycarbide layer over a trap rich layer. The acoustic wave device can include a piezoelectric layer over the silicon oxycarbide. The acoustic wave device can be a surface acoustic wave device in certain applications. The acoustic wave device can be a bulk acoustic wave device in some other applications. Related acoustic wave filters, radio frequency modules, wireless communication devices, and methods are disclosed.

公开(公告)号：US20230318570A1

公开(公告)日：2023-10-05

申请号：US18193029

申请日：2023-03-30

Applicant: Skyworks Solutions, Inc.

Inventor： Benjamin Paul Abbott ,  Mats Erik Fredriksson ,  Renfeng Jin

IPC: H03H9/56

CPC classification number: H03H9/568 ,  H03H9/564

Abstract: A first acoustic wave device can have a piezoelectric layer between a first electrode and a second electrode. The first acoustic wave device can have a first shape and a first area. A second acoustic wave device can be coupled to the first acoustic wave device to at least partially cancel a second harmonic response of the first acoustic wave device. The second acoustic wave device can have a piezoelectric layer between a first electrode and a second electrode. The second acoustic wave device can have a second shape that is different from the first shape and a second area that is within a threshold amount of the first area.

公开(公告)号：US20220271733A1

公开(公告)日：2022-08-25

申请号：US17651289

申请日：2022-02-16

Applicant: Skyworks Solutions, Inc.

Inventor： Benjamin Paul Abbott ,  Gong Bin Tang ,  Rei Goto ,  Keiichi Maki

IPC: H03H9/145 ,  H03H3/10 ,  H03H9/02 ,  H03H9/25 ,  H03H9/64

Abstract: An acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode disposed over the piezoelectric layer. The interdigital transducer electrode is thicker in a center region of the interdigital transducer electrode than in a gap region of the interdigital transducer electrode to thereby reduce a mass loading of the interdigital transducer electrode in the gap region. The interdigital transducer electrode has a layer of less dense material disposed of a layer of more dense material.

公开(公告)号：US11177787B2

公开(公告)日：2021-11-16

申请号：US16287909

申请日：2019-02-27

Applicant: Skyworks Solutions, Inc.

Inventor： Joshua James Caron ,  Toru Jibu ,  Benjamin Paul Abbott

IPC: H03H9/02 ,  H03H9/56 ,  H03H9/17 ,  H03H9/70 ,  H03H9/13 ,  H03H9/205 ,  H03H9/60 ,  H03H9/58 ,  H01Q1/50 ,  H03F3/21 ,  H04B1/40 ,  H03H9/46

Abstract: Aspects of this disclosure relate to acoustic wave filters that include a Lamb wave resonator and a second acoustic wave resonator that is a different type of acoustic wave resonator than the Lamb wave resonator. The different type of resonator can be a film bulk acoustic wave resonator for example. Some embodiments of this disclosure relate to an acoustic wave filter that includes the Lamb wave resonator and the second acoustic wave resonator. Some embodiments of this disclosure related to different respective acoustic wave filters including the Lamb wave resonator and the second acoustic wave resonator, in which the Lamb wave resonator and the second acoustic wave resonator are implemented on a common substrate.

公开(公告)号：US20240364290A1

公开(公告)日：2024-10-31

申请号：US18655877

申请日：2024-05-06

Applicant: Skyworks Solutions, Inc.

Inventor： Benjamin Paul Abbott ,  Rei Goto

IPC: H03H3/08 ,  H03H3/04 ,  H10N30/40 ,  H10N30/50

CPC classification number: H03H3/08 ,  H10N30/40 ,  H03H2003/0435 ,  H10N30/50

Abstract: A surface acoustic wave device is disclosed. The surface acoustic wave device can include a single crystal support layer, an intermediate single crystal layer positioned over the single crystal support layer, a lithium based piezoelectric layer positioned over the intermediate single crystal layer, and an interdigital transducer electrode positioned over the lithium based piezoelectric layer, the surface acoustic wave device configured to generate a surface acoustic wave. The single crystal layer can be a quartz layer, such as a z-propagation quartz layer. A thermal conductivity of the single crystal support layer is greater than a thermal conductivity of the intermediate single crystal layer, and the thermal conductivity of the single crystal support layer is greater than a thermal conductivity of the lithium based piezoelectric layer.