公开(公告)号：US12237827B2

公开(公告)日：2025-02-25

申请号：US17563936

申请日：2021-12-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ventsislav Yantchev ,  Patrick Turner ,  Robert B. Hammond

IPC: H03H9/56 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02 ,  H03H9/17 ,  H03H9/205 ,  H03H9/54

Abstract: Filters and methods of making filters are disclosed. A filter device includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between a surface of the substrate and a back surface of the piezoelectric plate. A first portion of the piezoelectric plate has a first thickness, and a second portion of the piezoelectric plate has a second thickness less than the first thickness. A conductor pattern on front surfaces of the first and second portions of the piezoelectric plate includes a first interdigital transducer (IDT) with interleaved fingers on the first portion, and a second IDT with interleaved fingers on the second portion.

公开(公告)号：US12212306B2

公开(公告)日：2025-01-28

申请号：US17542295

申请日：2021-12-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Chris O'Brien ,  Andrew Kay ,  Albert Cardona ,  Ventsislav Yantchev ,  Patrick Turner ,  Robert B. Hammond ,  Dylan Kelly

IPC: H03H9/56 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02 ,  H03H9/17 ,  H03H9/205 ,  H03H9/54

Abstract: Methods of fabricating filter devices are disclosed. A back surface of a piezoelectric plate having a first thickness is attached to a substrate. The front surface of the piezoelectric plate is selectively etched to thin a portion of the piezoelectric plate from the first thickness to a second thickness less than the first thickness. Cavities are formed in the substrate such that portions of the piezoelectric plate form a plurality of diaphragms spanning respective cavities. A conductor pattern is formed on the front surface. The conductor pattern includes a first interdigital transducer (IDT) with interleaved fingers on a first diaphragm having the first thickness and a second IDT with interleaved fingers on a second diaphragm having the second thickness.

公开(公告)号：US12212299B2

公开(公告)日：2025-01-28

申请号：US17799446

申请日：2022-01-19

Applicant: SEMICONDUCTOR MANUFACTURING ELECTRONICS (SHAOXING) CORPORATION

Inventor： Xueli Feng ,  Shaohua Xiang ,  Chong Wang ,  Weizhong Shan

IPC: H03H3/04 ,  H03H9/10 ,  H03H9/56

Abstract: An electronic device and a method of forming the same are disclosed. An emitter resonator and a reception cap cavity are formed on and in a first wafer, and an emitter cap cavity and a reception resonator are formed in and on a second wafer. After bonding together the first and second wafers, an emitter filter is formed in an emission region, and a reception filter is formed in a receiving region. The method provided in the present invention not only can simplify the fabrication process of the device and improve its accuracy and stability, but also facilitates integration of the emitter and receives filters in a same chip, which results in a higher degree of integration of the device and a more compact package size thereof.

公开(公告)号：US20250023539A1

公开(公告)日：2025-01-16

申请号：US18900008

申请日：2024-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ventsislav YANTCHEV

IPC: H03H9/02 ,  H03H3/02 ,  H03H3/04 ,  H03H9/13 ,  H03H9/17 ,  H03H9/56

Abstract: An acoustic filter is provide that includes a substrate; a piezoelectric plate attached to the substrate; and a plurality of bulk acoustic resonators including one or more shunt resonators and one or more series resonators. One or more of the shunt resonators includes an interdigital transducer having interdigital fingers on the piezoelectric plate; a front-side frequency setting layer at least partially on a front side of the at least one shunt resonator; and a back-side frequency setting layer on a back side of the at least one shunt resonator. Moreover, a thickness of the back-side frequency setting layer is at least 30% of a total thickness of the front-side frequency setting layer and the back-side frequency setting layer.

公开(公告)号：US12160221B2

公开(公告)日：2024-12-03

申请号：US17349083

申请日：2021-06-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takeya Matsumura ,  Shinsuke Kawamori

IPC: H03H9/13 ,  H03H3/02 ,  H03H3/04 ,  H03H9/10 ,  H03H9/19

Abstract: A method of manufacturing a piezoelectric resonator unit that includes mounting a piezoelectric resonator on a base member, the piezoelectric resonator including a piezoelectric element and a pair of excitation electrodes facing each other with the piezoelectric element interposed therebetween, each of the pair of excitation electrodes including an underlying layer containing chromium and a surface layer on the underlying layer; forming chromium oxide on the surface layer of each of the pair of excitation electrodes by oxidizing chromium diffused from the underlying layer such that an amount of the chromium oxide is larger on the surface layer of the excitation electrode on a base member side than on the surface layer of the excitation electrode on a lid member side among the pair of excitation electrodes; and joining a lid member to the base member such that the piezoelectric resonator is between the base member and the lid member.

公开(公告)号：US12119798B2

公开(公告)日：2024-10-15

申请号：US18153741

申请日：2023-01-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Patrick Turner ,  Mike Eddy ,  Andrew Kay ,  Ventsislav Yantchev ,  Charles Chung

IPC: H03H9/25 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02 ,  H03H9/10 ,  H03H9/58 ,  H03H9/64

CPC classification number: H03H3/02 ,  H03H3/04 ,  H03H9/02228 ,  H03H9/02992 ,  H03H9/105 ,  H03H9/1085 ,  H03H9/25 ,  H03H9/586 ,  H03H9/6406 ,  H03H2003/023

Abstract: Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the base.

公开(公告)号：US12088278B2

公开(公告)日：2024-09-10

申请号：US17219525

申请日：2021-03-31

Applicant: Skyworks Global Pte. Ltd.

Inventor： Kwang Jae Shin ,  Jiansong Liu ,  Jong Duk Han ,  Jae Hyung Lee ,  Yiliu Wang ,  Yosuke Hamaoka ,  Alexandre Augusto Shirakawa ,  Benfeng Zhang

IPC: H03H9/205 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02 ,  H03H9/17 ,  H03H9/54 ,  H03H9/56 ,  H04B1/40

CPC classification number: H03H9/205 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02015 ,  H03H9/02086 ,  H03H9/173 ,  H03H9/175 ,  H03H9/54 ,  H03H9/564 ,  H03H9/568 ,  H04B1/40 ,  H03H2003/0442

Abstract: Aspects of this disclosure relate bulk acoustic wave resonators with a patterned mass loading layer at least contributing to a difference in mass loading between a main acoustically active region of the bulk acoustic wave resonator and a recessed frame region of the bulk acoustic wave resonator. Related methods of manufacturing can involve forming the patterned mass loading layer in the main acoustically active region and the recessed frame region in a common processing step such that the patterned mass loading layer has a higher density in the main acoustically active region than in the recessed frame region.

公开(公告)号：US12088270B2

公开(公告)日：2024-09-10

申请号：US17067418

申请日：2020-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Patrick Turner ,  Mike Eddy ,  Andrew Kay ,  Ventsislav Yantchev ,  Charles Chung

IPC: H03H9/02 ,  H03H3/02 ,  H03H3/04 ,  H03H9/10 ,  H03H9/25 ,  H03H9/58 ,  H03H9/64

CPC classification number: H03H3/02 ,  H03H3/04 ,  H03H9/02228 ,  H03H9/02992 ,  H03H9/105 ,  H03H9/1085 ,  H03H9/25 ,  H03H9/586 ,  H03H9/6406 ,  H03H2003/023

Abstract: Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the base.

公开(公告)号：US12081187B2

公开(公告)日：2024-09-03

申请号：US17463322

申请日：2021-08-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Viktor Plesski ,  Soumya Yandrapalli ,  Robert B. Hammond ,  Bryant Garcia ,  Patrick Turner ,  Jesson John ,  Ventsislav Yantchev

IPC: H03H9/02 ,  H03H3/04 ,  H03H9/13 ,  H03H9/17 ,  H03H9/56 ,  H03H3/02

CPC classification number: H03H9/02228 ,  H03H3/04 ,  H03H9/02031 ,  H03H9/132 ,  H03H9/174 ,  H03H9/176 ,  H03H9/562 ,  H03H9/564 ,  H03H9/568 ,  H03H2003/023 ,  H03H2003/0442

Abstract: Acoustic resonator devices and filters, and methods of making the same. An acoustic resonator includes a piezoelectric plate and an interdigital transducer (IDT) including interleaved fingers on the piezoelectric plate. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic resonator further includes a front-side dielectric layer on the piezoelectric plate between the fingers of the IDT, wherein a resonance frequency of the acoustic resonator device has an inverse dependence on a thickness of the front-side dielectric layer.

公开(公告)号：US11984872B2

公开(公告)日：2024-05-14

申请号：US17364778

申请日：2021-06-30

Applicant: MURATA MANUFACTURING CO., LTD

Inventor： Robert B. Hammond ,  Patrick Turner ,  Ventsislav Yantchev

IPC: H03H9/205 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02 ,  H03H9/56

CPC classification number: H03H9/205 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02015 ,  H03H9/02157 ,  H03H9/02228 ,  H03H9/568

Abstract: Methods of fabricating acoustic filters are disclosed. The back of a piezoelectric plate is bonded to a surface of a substrate. The thickness of the piezoelectric plate is measured at a plurality of positions. Excess material is removed from the front surface of the piezoelectric plate in accordance with the thickness measurements to improve the thickness uniformity of the piezoelectric plate. After removing the excess material, a conductor pattern including a plurality of ladder filter circuits is formed on the front surface. Each ladder filter circuit includes at least one shunt resonator and at least one series resonator, each of which has an interdigital transducer (IDT). Cavities are formed in the substrate such that portions of the piezoelectric plate form a plurality of diaphragms spanning respective cavities. After the cavities are formed, interleaved fingers of each IDT are on a respective one of the plurality of diaphragms.