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公开(公告)号：US20240380376A1
公开(公告)日：2024-11-14
申请号：US18783009
申请日：2024-07-24
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Viktor PLESSKI , Soumya YANDRAPALLI , Robert B. HAMMOND , Bryant GARCIA , Patrick TURNER , Jesson JOHN , Ventsislav YANTCHEV
Abstract: An acoustic resonator is provided that includes a piezoelectric plate and an interdigital transducer (IDT) including interleaved fingers on the piezoelectric plate. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic resonator further includes a front-side dielectric layer on the piezoelectric plate between the fingers of the IDT, wherein a resonance frequency of the acoustic resonator device has an inverse dependence on a thickness of the front-side dielectric layer.
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公开(公告)号：US20240022233A1
公开(公告)日：2024-01-18
申请号：US18364911
申请日：2023-08-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ventsislav YANTCHEV
CPC classification number: H03H9/568 , H03H9/02228 , H03H9/02031 , H03H9/132 , H03H9/174 , H03H9/562 , H03H3/02 , H03H9/176 , H03H9/02015 , H03H9/02062 , H03H9/564 , H03H9/02039 , H03H2003/023 , H10N30/877
Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal lithium niobate (LN) plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the LN plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the LN plate such that interleaved fingers of the IDT are disposed on the diaphragm. A half-lambda dielectric layer is formed on one of the front surface and back surface of the diaphragm. Euler angles of the LN plate are [0°, β, 0°], where 20°≤β≤25°.
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公开(公告)号：US20250055441A1
公开(公告)日：2025-02-13
申请号：US18925553
申请日：2024-10-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Patrick TURNER , Mike EDDY , Andrew KAY , Ventsislav YANTCHEV
Abstract: A radio frequency filter includes bulk acoustic resonator chips that each include a substrate; a piezoelectric plate that includes multiple separate plates; and a conductor pattern on the piezoelectric layer and including an interdigitated transducer (IDT) with interleaved fingers on the piezoelectric layer opposite the substrate. The filter further includes an interposer having a surface facing the piezoelectric layer of each of the plurality of bulk acoustic resonator chips; a conductor pattern on the surface of the interposer; a conductive metal bump between the piezoelectric layer and the interposer that electrically connects the plurality of bulk acoustic resonator chips to the interposer; and a cover bonded to the substrates of the plurality of bulk acoustic resonator chips and to the interposer, wherein the cover seals an interior of the plurality bulk acoustic resonator chips.
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公开(公告)号：US20250023539A1
公开(公告)日：2025-01-16
申请号：US18900008
申请日：2024-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ventsislav YANTCHEV
Abstract: An acoustic filter is provide that includes a substrate; a piezoelectric plate attached to the substrate; and a plurality of bulk acoustic resonators including one or more shunt resonators and one or more series resonators. One or more of the shunt resonators includes an interdigital transducer having interdigital fingers on the piezoelectric plate; a front-side frequency setting layer at least partially on a front side of the at least one shunt resonator; and a back-side frequency setting layer on a back side of the at least one shunt resonator. Moreover, a thickness of the back-side frequency setting layer is at least 30% of a total thickness of the front-side frequency setting layer and the back-side frequency setting layer.
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5.发明公开公开(公告)号：US20240022234A1
公开(公告)日：2024-01-18
申请号：US18476865
申请日：2023-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Viktor PLESSKI , Soumya YANDRAPALLI , Robert B. HAMMOND , Bryant GARCIA , Patrick TURNER , Jesson JOHN , Ventsislav YANTCHEV
CPC classification number: H03H9/568 , H03H9/02228 , H03H9/02031 , H03H9/132 , H03H9/174 , H03H9/562 , H03H3/02 , H03H9/176 , H03H9/02015 , H03H9/02062 , H03H9/564 , H03H9/02039 , H03H2003/023 , H10N30/877
Abstract: Filter devices are disclosed. A filter device includes a piezoelectric plate comprising a supported portion, a first diaphragm, and a second diaphragm. The supported portion is attached to a substrate and the first and second diaphragms spans respective cavities in the substrate. A first interdigital transducer (IDT) has interleaved fingers on the first diaphragm. A second interdigital transducer (IDT) has interleaved fingers on the second diaphragm. A first dielectric layer is between the interleaved fingers of the first IDT, and a second dielectric layer is between the interleaved fingers of the second IDT. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. The piezoelectric plate and the first and second IDTs are configured such that radio frequency signals applied to first and second IDTs excite primary shear acoustic modes in the respective diaphragms.
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Patent Agency Ranking
公开(公告)号：US20240186984A1
公开(公告)日：2024-06-06
申请号：US18417972
申请日：2024-01-19
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Ventsislav YANTCHEV
CPC classification number: H03H9/568 , H03H9/02015 , H03H9/02031 , H03H9/02062 , H03H9/02228 , H03H9/132 , H03H9/174 , H03H9/176 , H03H9/562 , H03H9/564 , H03H3/02 , H03H2003/023 , H03H9/02039 , H10N30/877
Abstract: There are disclosed acoustic resonators and method of fabricating acoustic resonators. An acoustic resonator includes a single-crystal piezoelectric plate having front and back surfaces, the back surface attached to a surface of a substrate except for portions of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern on the front surface includes an interdigital transducer (IDT) with interleaved fingers of the IDT disposed on the diaphragm. A periodic array of holes is provided in the diaphragm.
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7.发明公开公开(公告)号：US20240030892A1
公开(公告)日：2024-01-25
申请号：US18478406
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Bryant GARCIA , Robert B. HAMMOND , Patrick TURNER , Viktor PLESSKI , Ventsislav YANTCHEV , Neal FENZI
Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a piezoelectric plate having front and back surfaces, a portion of the piezoelectric plate forming a diaphragm, and a conductor pattern on the front surface, the conductor pattern including an interdigital transducer (IDT), fingers of the IDT on the diaphragm. A thickness of the interleaved fingers is greater than or equal to 0.85 times a thickness of the piezoelectric plate and less than or equal to 2.5 times the thickness of the piezoelectric plate. The IDT comprises a first portion having a first pitch and a first mark and a second portion having a second pitch and a second mark not equal to the first pitch and first mark.
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公开(公告)号：US20230283258A1
公开(公告)日：2023-09-07
申请号：US18193043
申请日：2023-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ventsislav YANTCHEV , Sho NAGATOMO , Kazunori INOUE
CPC classification number: H03H9/205 , H03H9/02015 , H03H9/02157 , H03H9/54 , H03H9/02228
Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface. A back surface of a single-crystal piezoelectric plate is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on a front surface of the piezoelectric plate with interleaved IDT fingers of the IDT disposed on the diaphragm. Back-side fingers are formed the back surface of the diaphragm.
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公开(公告)号：US20250007482A1
公开(公告)日：2025-01-02
申请号：US18829076
申请日：2024-09-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Patrick TURNER , Mike EDDY , Andrew KAY , Ventsislav YANTCHEV
Abstract: A bulk acoustic resonator device is provided that includes a bulk acoustic resonator chip having a substrate; a piezoelectric layer attached to the substrate either directly or via one or more intermediate layers; and a first conductor pattern on the piezoelectric layer, the first conductor pattern comprising an interdigitated transducer (IDT). Moreover, an interposer is provided having a surface facing the piezoelectric layer and having a second conductor pattern on the surface of the interposer. A conductive metal bump is between the piezoelectric layer and the interposer that electrically connects the first conductor pattern to the second conductor pattern; and a cover is bonded both to the substrate and to a portion of the surface of the interposer. The cover seals an interior of the bulk acoustic resonator chip.
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公开(公告)号：US20240097649A1
公开(公告)日：2024-03-21
申请号：US18510873
申请日：2023-11-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Sho NAGATOMO , Bryant GARCIA , Ventsislav YANTCHEV , Patrick TURNER , Robert B. HAMMOND , Douglas JACHOWSKI
CPC classification number: H03H9/205 , H03H9/02015 , H03H9/02157
Abstract: An acoustic wave device is provided that includes a piezoelectric layer and first and second resonators. The first resonator includes a first functional electrode and a first dielectric film on the piezoelectric layer. The second resonator includes a second functional electrode and a second dielectric film on the piezoelectric layer. The piezoelectric layer includes first and second resonator portions respectively including portions of the first and second resonators. Moreover, a resonant frequency of the first resonator is lower than that of the second resonator. A thickness of the first resonator portion is greater than that of the second resonator portion, and ts1/tp1≤ts2/tp2 is satisfied, where tp1, tp2, ts1, and ts2 are respectively thicknesses of the first and second resonator portions and the first and second dielectric films.
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