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公开(公告)号：US20240213955A1
公开(公告)日：2024-06-27
申请号：US18436660
申请日：2024-02-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Patrick TURNER , Doug JACHOWSKI , Bryant GARCIA
CPC classification number: H03H9/205 , H03H3/02 , H03H9/02015 , H03H9/02157 , H03H9/02228 , H03H9/588 , H03H9/605
Abstract: An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first piezoelectric plate is planarized to a first thickness. A bonding layer is formed on the first piezoelectric plate and spans the first and second cavity locations. A second piezoelectric plate is bonded to the bonding layer and spans the first and second cavity locations. A portion of the second piezoelectric plate spanning the second cavity location is etched away to form a first membrane over the first cavity location and a second membrane over the second cavity location. Interdigital transducers are formed on the first and second membranes over the first and second cavity location to form a first and second resonator on the same die.
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2.发明公开公开(公告)号：US20240030892A1
公开(公告)日：2024-01-25
申请号：US18478406
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Bryant GARCIA , Robert B. HAMMOND , Patrick TURNER , Viktor PLESSKI , Ventsislav YANTCHEV , Neal FENZI
Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a piezoelectric plate having front and back surfaces, a portion of the piezoelectric plate forming a diaphragm, and a conductor pattern on the front surface, the conductor pattern including an interdigital transducer (IDT), fingers of the IDT on the diaphragm. A thickness of the interleaved fingers is greater than or equal to 0.85 times a thickness of the piezoelectric plate and less than or equal to 2.5 times the thickness of the piezoelectric plate. The IDT comprises a first portion having a first pitch and a first mark and a second portion having a second pitch and a second mark not equal to the first pitch and first mark.
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公开(公告)号：US20250023540A1
公开(公告)日：2025-01-16
申请号：US18904039
申请日：2024-10-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Patrick TURNER
Abstract: An acoustic resonator device is provided that includes a substrate comprising a base and an intermediate layer, the intermediate layer comprising a silicon nitride trap-rich layer: a dielectric layer adjacent to the silicon nitride trap-rich layer; a piezoelectric layer having front and back surfaces, the back surface facing the dielectric layer; and an interdigital transducer (IDT) on the piezoelectric layer such that interleaved fingers of the IDT extend on the piezoelectric layer.
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公开(公告)号：US20240396526A1
公开(公告)日：2024-11-28
申请号：US18797327
申请日：2024-08-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Patrick TURNER
Abstract: A bulk acoustic resonator is provided that includes a substrate including a plurality of materials and a cavity disposed therein; a piezoelectric layer attached to the substrate by a first dielectric layer; an interdigital transducer (IDT) on a surface of the piezoelectric layer and having interleaved fingers on a portion of the piezoelectric layer that is over the cavity; and a second dielectric layer disposed over and between the interleaved fingers,
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公开(公告)号：US20240380376A1
公开(公告)日：2024-11-14
申请号：US18783009
申请日：2024-07-24
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Viktor PLESSKI , Soumya YANDRAPALLI , Robert B. HAMMOND , Bryant GARCIA , Patrick TURNER , Jesson JOHN , Ventsislav YANTCHEV
Abstract: An acoustic resonator is provided that includes a piezoelectric plate and an interdigital transducer (IDT) including interleaved fingers on the piezoelectric plate. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic resonator further includes a front-side dielectric layer on the piezoelectric plate between the fingers of the IDT, wherein a resonance frequency of the acoustic resonator device has an inverse dependence on a thickness of the front-side dielectric layer.
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Patent Agency Ranking
公开(公告)号：US20240113681A1
公开(公告)日：2024-04-04
申请号：US18538939
申请日：2023-12-13
Applicant: MURATA MANUFACTURING CO., LTD
Inventor： Andrew GUYETTE , Neal FENZI , Patrick TURNER
CPC classification number: H03H9/132 , H03H3/02 , H03H9/02031 , H03H9/02228 , H03H9/174 , H03H9/176 , H03H9/562 , H03H9/564 , H03H9/568 , H03H2003/023
Abstract: Filter devices and methods are disclosed. A single-crystal piezoelectric plate is attached to substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate defines a low band filter including low band shunt resonators and low band series resonators and a high band filter including high band shunt resonators and high band series resonators. Interleaved fingers of interdigital transducers (IDTs) of the low band shunt resonators are disposed on respective diaphragms having a first thickness, interleaved fingers of IDTs of the high band series resonators are disposed on respective diaphragms having a second thickness less than the first thickness, and interleaved fingers of IDTs of the low band series resonators and the high band shunt resonators are disposed on respective diaphragms having thicknesses intermediate the first thickness and the second thickness.
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公开(公告)号：US20250055441A1
公开(公告)日：2025-02-13
申请号：US18925553
申请日：2024-10-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Patrick TURNER , Mike EDDY , Andrew KAY , Ventsislav YANTCHEV
Abstract: A radio frequency filter includes bulk acoustic resonator chips that each include a substrate; a piezoelectric plate that includes multiple separate plates; and a conductor pattern on the piezoelectric layer and including an interdigitated transducer (IDT) with interleaved fingers on the piezoelectric layer opposite the substrate. The filter further includes an interposer having a surface facing the piezoelectric layer of each of the plurality of bulk acoustic resonator chips; a conductor pattern on the surface of the interposer; a conductive metal bump between the piezoelectric layer and the interposer that electrically connects the plurality of bulk acoustic resonator chips to the interposer; and a cover bonded to the substrates of the plurality of bulk acoustic resonator chips and to the interposer, wherein the cover seals an interior of the plurality bulk acoustic resonator chips.
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8.发明公开公开(公告)号：US20240195384A1
公开(公告)日：2024-06-13
申请号：US18524193
申请日：2023-11-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Douglas JACHOWSKI , Patrick TURNER , Chris O'BRIEN
CPC classification number: H03H9/174 , H03H3/02 , H03H9/02228 , H03H9/13 , H03H9/205 , H03H2003/023
Abstract: An acoustic resonator is provided that includes a substrate; a first piezoelectric layer having first and second surfaces that oppose each other, with the second surface coupled to the substrate directly or via one or more intermediate layers; a second piezoelectric layer having first and second opposing surfaces, with the first surface coupled to the first surface of the first piezoelectric layer and opposite to the substrate; an etch stop layer disposed between the respective first surfaces of the first and second piezoelectric layers; and first and second interdigital transducers (IDTs) on at least one of the first and second piezoelectric layers, respectively. Moreover, a portion of one of the first and second piezoelectric layers is removed between the second surface of the respective piezoelectric layer and the etch stop.
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9.发明公开公开(公告)号：US20240022234A1
公开(公告)日：2024-01-18
申请号：US18476865
申请日：2023-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Viktor PLESSKI , Soumya YANDRAPALLI , Robert B. HAMMOND , Bryant GARCIA , Patrick TURNER , Jesson JOHN , Ventsislav YANTCHEV
CPC classification number: H03H9/568 , H03H9/02228 , H03H9/02031 , H03H9/132 , H03H9/174 , H03H9/562 , H03H3/02 , H03H9/176 , H03H9/02015 , H03H9/02062 , H03H9/564 , H03H9/02039 , H03H2003/023 , H10N30/877
Abstract: Filter devices are disclosed. A filter device includes a piezoelectric plate comprising a supported portion, a first diaphragm, and a second diaphragm. The supported portion is attached to a substrate and the first and second diaphragms spans respective cavities in the substrate. A first interdigital transducer (IDT) has interleaved fingers on the first diaphragm. A second interdigital transducer (IDT) has interleaved fingers on the second diaphragm. A first dielectric layer is between the interleaved fingers of the first IDT, and a second dielectric layer is between the interleaved fingers of the second IDT. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. The piezoelectric plate and the first and second IDTs are configured such that radio frequency signals applied to first and second IDTs excite primary shear acoustic modes in the respective diaphragms.
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10.发明申请公开(公告)号：US20230051876A1
公开(公告)日：2023-02-16
申请号：US17975749
申请日：2022-10-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Bryant GARCIA , Patrick TURNER , Robert HAMMOND , Minefumi OUCHI
Abstract: Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a piezoelectric plate having opposed front and back surfaces. A first electrode and a second electrode are formed on the front surface of the piezoelectric plate, the first and second electrodes and the piezoelectric plate configured such that a radio frequency signal applied between the first and second electrodes excites a shear primary acoustic mode in the piezoelectric plate. The first electrode and the second electrode have trapezoidal cross-sectional shapes. A sidewall angle of at least one side surface of the first electrode and a sidewall angle of at least one side surface of the second electrode are greater than or equal to 70 degrees and less than or equal to 110 degrees.
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