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公开(公告)号：US11799445B2
公开(公告)日：2023-10-24
申请号：US17364471
申请日：2021-06-30
Applicant: Skyworks Solutions, Inc.
Inventor： Tomoya Kodama , Shinichi Hakamada , Hironori Fukuhara , Yosuke Hamaoka
CPC classification number: H03H9/14541 , H03H9/02834 , H03H9/131 , H03H9/205 , H03H9/54 , H03H9/64
Abstract: Aspects of this disclosure relate to an acoustic wave device that includes a multi-layer interdigital transducer electrode. The acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode includes a first interdigital transducer electrode layer positioned between a second interdigital transducer electrode layer and the piezoelectric layer. The second interdigital transducer electrode layer can include aluminum and having a thickness of at least 200 nanometers. The acoustic wave device can include a temperature compensation layer arranged such that the interdigital transducer electrode is positioned between the piezoelectric layer and at least a portion of the temperature compensation layer. Related filters, modules, wireless communication devices, and methods are disclosed.
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公开(公告)号：US20220407496A1
公开(公告)日：2022-12-22
申请号：US17806365
申请日：2022-06-10
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Michael David Hill , Benjamin Paul Abbott , Yosuke Hamaoka , Hiroyuki Nakamura , Alan Sangone Chen
Abstract: A acoustic wave resonator comprises a piezoelectric substrate and a plurality of interdigital transducer (IDT) electrodes disposed on the piezoelectric substrate, the plurality of IDT electrodes formed of a mixture of tungsten and chromium to provide for reduction in size and increase in quality factor of the acoustic wave resonator.
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公开(公告)号：US20240258994A1
公开(公告)日：2024-08-01
申请号：US18427321
申请日：2024-01-30
Applicant: Skyworks Solutions, Inc.
Inventor： Kurt George Steiner , Alan Sangone Chen , Yosuke Hamaoka , Benjamin Paul Abbott , Michael David Hill , Kezia Cheng
CPC classification number: H03H9/25 , H03H9/02574 , H03H9/02834 , H03H9/6483
Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, and an interdigital transducer electrode formed with the piezoelectric layer. The interdigital transducer electrode includes a first layer, a second layer over the first layer, and a seed layer between the first layer and the piezoelectric layer. A combination of the first layer and the seed layer has a resistivity that is lower than a resistivity of the first layer alone.
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公开(公告)号：US20230101360A1
公开(公告)日：2023-03-30
申请号：US17936281
申请日：2022-09-28
Applicant: Skyworks Solutions, Inc.
Inventor： Joji Fujiwara , Riho Sasaki , Kyohei Kobayashi , Noriaki Amo , Yosuke Hamaoka
Abstract: An acoustic wave device is disclosed. The acoustic waved device can be a shear horizontal mode surface acoustic wave device. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a temperature compensation layer over the interdigital transducer electrode. The piezoelectric layer can be a lithium niobate layer with a cut angle in a range of −20° YX to 25° YX. The interdigital transducer electrode includes a first layer having a first thickness and a second layer having a second thickness. The first layer affects acoustic properties of the acoustic wave device and the second layer affects electrical properties of the acoustic wave device. The first layer is positioned between the piezoelectric layer and the second layer. The first thickness is configured such that a frequency response of the acoustic wave device includes a Rayleigh mode response at a frequency higher than a shear horizontal mode response resonance. The first thickness can be greater than the second thickness.
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公开(公告)号：US11082029B2
公开(公告)日：2021-08-03
申请号：US16580329
申请日：2019-09-24
Applicant: Skyworks Solutions, Inc.
Inventor： Tomoya Kodama , Shinichi Hakamada , Hironori Fukuhara , Yosuke Hamaoka
Abstract: Aspects of this disclosure relate to an acoustic wave device that includes a multi-layer interdigital transducer electrode. The acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode includes a first interdigital transducer electrode layer positioned between a second interdigital transducer electrode layer and the piezoelectric layer. The second interdigital transducer electrode layer can include aluminum and having a thickness of at least 200 nanometers. The acoustic wave device can include a temperature compensation layer arranged such that the interdigital transducer electrode is positioned between the piezoelectric layer and at least a portion of the temperature compensation layer. Related filters, modules, wireless communication devices, and methods are disclosed.
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Patent Agency Ranking
公开(公告)号：US20230048476A1
公开(公告)日：2023-02-16
申请号：US17885120
申请日：2022-08-10
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Kezia Cheng , Alan Sangone Chen , Benjamin Paul Abbott , Rei Goto , Yosuke Hamaoka , Michael David Hill
Abstract: A surface acoustic wave device includes a piezoelectric substrate and a multi-layer interdigital transducer electrode disposed on the piezoelectric substrate. The multi-layer interdigital transducer electrode includes a first electrode layer and a second electrode layer. The second electrode layer is disposed between the piezoelectric substrate and the first electrode layer. The first electrode layer has a higher density than a density of the second electrode layer. The second electrode layer has a higher conductivity than a conductivity of the first electrode layer. Related radio frequency modules and wireless communication devices are also provided.
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公开(公告)号：US20240348229A1
公开(公告)日：2024-10-17
申请号：US18750506
申请日：2024-06-21
Applicant: Skyworks Solutions, Inc.
Inventor： Keiichi Maki , Rei Goto , Gong Bin Tang , Yosuke Hamaoka
CPC classification number: H03H9/02574 , H03H9/02834 , H03H9/64 , H03H7/54 , H03H9/6413
Abstract: Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. The thermally conductive layer has a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer.
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8.发明授权公开(公告)号：US12047053B2
公开(公告)日：2024-07-23
申请号：US17329579
申请日：2021-05-25
Applicant: Skyworks Solutions, Inc.
Inventor： Keiichi Maki , Rei Goto , Gong Bin Tang , Yosuke Hamaoka
CPC classification number: H03H9/02574 , H03H9/02834 , H03H9/64 , H03H7/54 , H03H9/6413
Abstract: Aspects of this disclosure relate to a surface acoustic wave resonator having a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. Related surface acoustic wave filters, radio frequency modules, and wireless communication devices are also disclosed.
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9.发明申请公开(公告)号：US20210281239A1
公开(公告)日：2021-09-09
申请号：US17329579
申请日：2021-05-25
Applicant: Skyworks Solutions, Inc.
Inventor： Keiichi Maki , Rei Goto , Gong Bin Tang , Yosuke Hamaoka
Abstract: Aspects of this disclosure relate to a surface acoustic wave resonator having a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. Related surface acoustic wave filters, radio frequency modules, and wireless communication devices are also disclosed.
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10.发明公开公开(公告)号：US20240275363A1
公开(公告)日：2024-08-15
申请号：US18426707
申请日：2024-01-30
Applicant: Skyworks Solutions, Inc.
Inventor： Kurt George Steiner , Alan Sangone Chen , Yosuke Hamaoka , Benjamin Paul Abbott
CPC classification number: H03H9/706 , H03H9/02992 , H03H9/0576 , H03H9/6453
Abstract: Aspects and embodiments disclosed herein include an acoustic wave device comprising a substrate, a pair of inter-digital transducer (IDT) electrodes formed on the substrate, each of the pair of IDT electrodes including a bus bar and a plurality of fingers extending from the bus bar, fingers of one IDT electrode arranged interleaved with fingers of the other IDT electrode, each of the bus bars of the pair of IDT electrodes having a slotted portion configured on an upper surface of the bus bars opposite to a lower surface contacting the substrate such that at least one hollow within each of the bus bars is opened at least at the upper surface of each of the bus bars, and a dielectric film covering the pair of IDT electrodes, at least a portion of the dielectric film filling in the at least one hollow of each of the bus bars.
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