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公开(公告)号：US11251219B2
公开(公告)日：2022-02-15
申请号：US16814179
申请日：2020-03-10
发明人： Wei Zhang , Douglas Stewart Malchow , John Liobe , Michael J. Evans , Wei Huang
IPC分类号： H01L27/146 , H01L31/02 , H01L31/0216 , H01L31/0224 , H01L31/0304 , H01L31/105 , H01L31/107 , H01L31/18
摘要： A system includes a pixel having a diffusion layer within a cap layer. The diffusion layer defines a front side and an illumination side opposite the front side with an absorption layer operatively connected to the illumination side as well as the diffusion and cap layers. A set of alternating oxide and nitride layers are deposited on the front side of the cap and diffusion layers.
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公开(公告)号：US11251210B2
公开(公告)日：2022-02-15
申请号：US16785065
申请日：2020-02-07
发明人： Wei Huang , Douglas Stewart Malchow , Michael J. Evans , John Liobe , Wei Zhang
IPC分类号： H01L27/146
摘要： A system includes a pixel including a diffusion layer in contact with an absorption layer. A transparent conductive oxide (TCO) is electrically connected to the diffusion layer. An overflow contact is in electrical communication with the TCO. The overflow contact can be spaced apart laterally from the diffusion layer. The pixel can be one of a plurality of similar pixels arranged in a grid pattern, wherein each pixel has a respective overflow contact, forming an overflow contact grid offset from the grid pattern.
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公开(公告)号：US20210249462A1
公开(公告)日：2021-08-12
申请号：US16785098
申请日：2020-02-07
发明人： Wei Huang , Douglas Stewart Malchow , Michael J. Evans , John Liobe , Wei Zhang
IPC分类号： H01L27/146
摘要： A system includes a pixel including a diffusion layer in contact with an absorption layer. The diffusion layer and absorption layer are in contact with one another along an interface that is inside of a mesa. A trench is defined in the absorption layer surrounding the mesa. An overflow contact is seated in the trench.
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公开(公告)号：US10957733B2
公开(公告)日：2021-03-23
申请号：US16902318
申请日：2020-06-16
发明人： Wei Zhang , Douglas Stewart Malchow , Michael J. Evans , Wei Huang , Paul L. Bereznycky , Namwoong Paik
IPC分类号： H01L27/146 , H01L25/16 , H01L23/00
摘要： A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
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公开(公告)号：US20190006409A1
公开(公告)日：2019-01-03
申请号：US16126314
申请日：2018-09-10
发明人： Namwoong Paik , Wei Huang
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14634 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L27/14605 , H01L27/14636 , H01L27/14643 , H01L27/1469 , H01L2224/034 , H01L2224/03622 , H01L2224/03912 , H01L2224/05571 , H01L2224/10145 , H01L2224/1145 , H01L2224/1146 , H01L2224/1147 , H01L2224/1184 , H01L2224/119 , H01L2224/13007 , H01L2224/13021 , H01L2224/13022 , H01L2924/00012 , H01L2924/00014
摘要： A method of forming bump structures for interconnecting components includes dry etching a layer of insulating material to create a pattern for bump structures. A seed layer is deposited on the insulating material over the pattern. The seed layer is patterned with a photo resist material. The method also includes forming bump structures over the seed layer and the photo resist material with a plating material to form bump structures in the pattern, wherein the bump structures are isolated from one another.
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公开(公告)号：US09716123B2
公开(公告)日：2017-07-25
申请号：US14931543
申请日：2015-11-03
发明人： Prabhu Mushini , Wei Huang
IPC分类号： H01L31/0232 , H01L31/102 , H01L27/148 , H01L31/00 , H01L27/146
CPC分类号： H01L27/1463 , H01L27/1446 , H01L27/1462 , H01L27/14623 , H01L27/14634 , H01L27/14643
摘要： A photodiode includes a cap layer defining an inboard side and an outboard side. A plurality of pixels are formed in the cap layer extending from the inboard side to the outboard side. At least a portion of the cap layer is defined in between the pixels. A metal barrier is in between the pixels and is operatively connected to the inboard side of the cap layer in between the pixels to reflect light rays into the cap layer reducing the leakage of photons between the pixels.
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公开(公告)号：US20170125460A1
公开(公告)日：2017-05-04
申请号：US14931543
申请日：2015-11-03
发明人： Prabhu Mushini , Wei Huang
IPC分类号： H01L27/146
CPC分类号： H01L27/1463 , H01L27/1446 , H01L27/1462 , H01L27/14623 , H01L27/14634 , H01L27/14643
摘要： A photodiode includes a cap layer defining an inboard side and an outboard side. A plurality of pixels are formed in the cap layer extending from the inboard side to the outboard side. At least a portion of the cap layer is defined in between the pixels. A metal barrier is in between the pixels and is operatively connected to the inboard side of the cap layer in between the pixels to reflect light rays into the cap layer reducing the leakage of photons between the pixels.
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公开(公告)号：US12051665B2
公开(公告)日：2024-07-30
申请号：US17704341
申请日：2022-03-25
发明人： Wei Huang , Sungjin Kim , Paul L Bereznycky , Michael J. Evans , De Hsin Chang , Wei Zhang
IPC分类号： H01L23/00
CPC分类号： H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L2224/13005 , H01L2224/13014 , H01L2224/1403 , H01L2224/16225 , H01L2224/81201
摘要： A system includes a die with a first plurality of hybridization bumps extending therefrom, electrically connected to circuitry die. An external circuitry component with a second plurality of hybridization bumps extending therefrom, electrically connected to circuitry in the external circuitry component. The first plurality of hybridization bumps and the second plurality of hybridization bumps are pressed together for electrical communication between the die and the external circuitry component. The first plurality of hybridization bumps have a different material hardness from the second plurality of hybridization bumps. The first plurality of hybridization bumps have a different bump diameter from that of the second plurality of hybridization bumps.
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公开(公告)号：US20210288100A1
公开(公告)日：2021-09-16
申请号：US16814179
申请日：2020-03-10
发明人： Wei Zhang , Douglas Stewart Malchow , John Liobe , Michael J. Evans , Wei Huang
IPC分类号： H01L27/146 , H01L31/105 , H01L31/107 , H01L31/0224 , H01L31/0304 , H01L31/0216 , H01L31/02 , H01L31/18
摘要： A system includes a pixel having a diffusion layer within a cap layer. The diffusion layer defines a front side and an illumination side opposite the front side with an absorption layer operatively connected to the illumination side as well as the diffusion and cap layers. A set of alternating oxide and nitride layers are deposited on the front side of the cap and diffusion layers.
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公开(公告)号：US20230307398A1
公开(公告)日：2023-09-28
申请号：US17704341
申请日：2022-03-25
发明人： Wei Huang , Sungjin Kim , Paul L. Bereznycky , Michael J. Evans , De Hsin Chang , Wei Zhang
IPC分类号： H01L23/00
CPC分类号： H01L24/13 , H01L24/14 , H01L24/81 , H01L24/16 , H01L2224/13005 , H01L2224/13014 , H01L2224/1403 , H01L2224/16225 , H01L2224/81201
摘要： A system includes a die with a first plurality of hybridization bumps extending therefrom, electrically connected to circuitry die. An external circuitry component with a second plurality of hybridization bumps extending therefrom, electrically connected to circuitry in the external circuitry component. The first plurality of hybridization bumps and the second plurality of hybridization bumps are pressed together for electrical communication between the die and the external circuitry component. The first plurality of hybridization bumps have a different material hardness from the second plurality of hybridization bumps. The first plurality of hybridization bumps have a different bump diameter from that of the second plurality of hybridization bumps.
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