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    MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
    2.
    发明申请
    MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION 审中-公开

    公开(公告)号：US20200052012A1

    公开(公告)日：2020-02-13

    申请号：US16057191

    申请日：2018-08-07

    Applicant: Sensors Unlimited, Inc.

    Inventor： Wei Zhang ,  Michael J. Evans ,  Douglas Stewart Malchow ,  Paul L. Bereznycky ,  Namwoong Paik

    IPC: H01L27/146

    Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection.

    PIN DIODES WITH OVER-CURRENT PROTECTION
    3.
    发明申请
    PIN DIODES WITH OVER-CURRENT PROTECTION 有权

    公开(公告)号：US20210249455A1

    公开(公告)日：2021-08-12

    申请号：US16785065

    申请日：2020-02-07

    Applicant: Sensors Unlimited, Inc.

    Inventor： Wei Huang ,  Douglas Stewart Malchow ,  Michael J. Evans ,  John Liobe ,  Wei Zhang

    IPC: H01L27/146

    Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. A transparent conductive oxide (TCO) is electrically connected to the diffusion layer. An overflow contact is in electrical communication with the TCO. The overflow contact can be spaced apart laterally from the diffusion layer. The pixel can be one of a plurality of similar pixels arranged in a grid pattern, wherein each pixel has a respective overflow contact, forming an overflow contact grid offset from the grid pattern.

    SYSTEMS AND METHODS FOR MARKING PLASTICS
    4.
    发明申请
    SYSTEMS AND METHODS FOR MARKING PLASTICS 审中-公开

    公开(公告)号：US20190256685A1

    公开(公告)日：2019-08-22

    申请号：US16400868

    申请日：2019-05-01

    Applicant: Sensors Unlimited, Inc.

    Inventor： Douglas Stewart Malchow

    IPC: C08K11/00 ,  C08J3/22 ,  C08J3/20 ,  G01N21/64 ,  G01N21/3563 ,  G01N21/25 ,  G01N21/63 ,  G01N21/31

    Abstract: A method of determining the composition of a polymeric body includes applying electromagnetic radiation to the polymeric body, modulating the electromagnetic radiation using a tagant disposed within a polymer composition forming the polymeric body, and receiving the modulated electromagnetic radiation from the tagant at an infrared detector. The electromagnetic radiation received from the tagant has a signature corresponding to the polymer composition forming the polymeric body. A method of making a polymeric body and system for determining composition of a polymeric body are also described.

    INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
    6.
    发明申请
    INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS 审中-公开

    公开(公告)号：US20200312900A1

    公开(公告)日：2020-10-01

    申请号：US16902318

    申请日：2020-06-16

    Applicant: Sensors Unlimited, Inc.

    Inventor： Wei Zhang ,  Douglas Stewart Malchow ,  Michael J. Evans ,  Wei Huang ,  Paul L. Bereznycky ,  Namwoong Paik

    IPC: H01L27/146 ,  H01L23/00 ,  H01L25/16

    Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.

    Interconnect bump structures for photo detectors
    7.
    发明授权
    Interconnect bump structures for photo detectors 有权

    公开(公告)号：US10727267B2

    公开(公告)日：2020-07-28

    申请号：US16129402

    申请日：2018-09-12

    Applicant: Sensors Unlimited, Inc.

    Inventor： Wei Zhang ,  Douglas Stewart Malchow ,  Michael J. Evans ,  Wei Huang ,  Paul L. Bereznycky ,  Namwoong Paik

    IPC: H01L27/146 ,  H01L25/16 ,  H01L23/488 ,  H01L23/00

    Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.

    INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
    8.
    发明申请
    INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS 审中-公开

    公开(公告)号：US20200083272A1

    公开(公告)日：2020-03-12

    申请号：US16129402

    申请日：2018-09-12

    Applicant: Sensors Unlimited, Inc.

    Inventor： Wei Zhang ,  Douglas Stewart Malchow ,  Michael J. Evans ,  Wei Huang ,  Paul L. Bereznycky ,  Namwoong Paik

    IPC: H01L27/146 ,  H01L23/00

    Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.

    VISUALIZATION FOR FLUORESCENT GUIDED IMAGING
    10.
    发明申请
    VISUALIZATION FOR FLUORESCENT GUIDED IMAGING 有权

    公开(公告)号：US20220079447A1

    公开(公告)日：2022-03-17

    申请号：US17471991

    申请日：2021-09-10

    Applicant: Sensors Unlimited, Inc.

    Inventor： Douglas Stewart Malchow ,  John Liobe ,  Thuc-Uyen Nguyen ,  Brendan Mc Granaghan Murphy

    IPC: A61B5/00 ,  G06T7/73

    Abstract: A method of medical imaging is provided. The method includes receiving pulsed light emissions from fluoroscopic material in a target field of a patient, wherein the target field was treated with fluoroscopic material that emitted the pulsed light emissions in response to a pulsed laser signal. The pulsed laser signal has a wavelength that was selected to excite the fluoroscopic material. The method further includes capturing a passive image of the target field and asynchronously detecting pulses of the pulsed light emissions. The method further includes determining pulse-source coordinates in the image, wherein the pulse-source coordinates correspond to a location of the fluoroscopic material that emitted the pulsed light emissions.

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