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公开(公告)号：US11876111B2
公开(公告)日：2024-01-16
申请号：US17205192
申请日：2021-03-18
Applicant: Sensors Unlimited, Inc.
Inventor： John Angelo Wieners
IPC: H01L27/146 , G01S7/4863 , G01S17/08 , H04N5/33 , H04N25/76 , G01S7/4865 , H04N23/45
CPC classification number: H01L27/14649 , G01S7/4863 , G01S17/08 , H01L27/14634 , H01L27/14643 , H04N5/33 , H04N25/76 , G01S7/4865 , H04N23/45
Abstract: A sensor includes a sensor array. The sensor array includes a plurality of passive imaging pixels and a plurality of time of flight (TOF) imaging pixels. A method of imaging includes collecting passive imaging data from a sensor array and collecting time of flight (TOF) imaging data from the sensor array. Collecting passive imaging data and collecting TOF imaging data can be performed at least partially at the same time and along a single optical axis without parallax.
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公开(公告)号：US20230307398A1
公开(公告)日：2023-09-28
申请号：US17704341
申请日：2022-03-25
Applicant: Sensors Unlimited, Inc.
Inventor： Wei Huang , Sungjin Kim , Paul L. Bereznycky , Michael J. Evans , De Hsin Chang , Wei Zhang
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L24/14 , H01L24/81 , H01L24/16 , H01L2224/13005 , H01L2224/13014 , H01L2224/1403 , H01L2224/16225 , H01L2224/81201
Abstract: A system includes a die with a first plurality of hybridization bumps extending therefrom, electrically connected to circuitry die. An external circuitry component with a second plurality of hybridization bumps extending therefrom, electrically connected to circuitry in the external circuitry component. The first plurality of hybridization bumps and the second plurality of hybridization bumps are pressed together for electrical communication between the die and the external circuitry component. The first plurality of hybridization bumps have a different material hardness from the second plurality of hybridization bumps. The first plurality of hybridization bumps have a different bump diameter from that of the second plurality of hybridization bumps.
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公开(公告)号：US11495631B2
公开(公告)日：2022-11-08
申请号：US16785098
申请日：2020-02-07
Applicant: Sensors Unlimited, Inc.
Inventor： Wei Huang , Douglas Stewart Malchow , Michael J. Evans , John Liobe , Wei Zhang
IPC: H01L27/146
Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. The diffusion layer and absorption layer are in contact with one another along an interface that is inside of a mesa. A trench is defined in the absorption layer surrounding the mesa. An overflow contact is seated in the trench.
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公开(公告)号：US11359888B1
公开(公告)日：2022-06-14
申请号：US17315157
申请日：2021-05-07
Applicant: Sensors Unlimited, Inc.
Inventor： Andrew Eckhardt , Mark Aguilar-Aasted
Abstract: A system comprises a photodetector array (PDA) including a plurality of imaging pixels configured to generate electrical signals indicative of an imaged scene, and an integrated circuit (IC) operatively connected to the PDA to receive the electrical signals from the imaging pixels to form image data.
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公开(公告)号：US20200312900A1
公开(公告)日：2020-10-01
申请号：US16902318
申请日：2020-06-16
Applicant: Sensors Unlimited, Inc.
Inventor： Wei Zhang , Douglas Stewart Malchow , Michael J. Evans , Wei Huang , Paul L. Bereznycky , Namwoong Paik
IPC: H01L27/146 , H01L23/00 , H01L25/16
Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
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Patent Agency Ranking
公开(公告)号：US10727267B2
公开(公告)日：2020-07-28
申请号：US16129402
申请日：2018-09-12
Applicant: Sensors Unlimited, Inc.
Inventor： Wei Zhang , Douglas Stewart Malchow , Michael J. Evans , Wei Huang , Paul L. Bereznycky , Namwoong Paik
IPC: H01L27/146 , H01L25/16 , H01L23/488 , H01L23/00
Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
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公开(公告)号：US20200083272A1
公开(公告)日：2020-03-12
申请号：US16129402
申请日：2018-09-12
Applicant: Sensors Unlimited, Inc.
Inventor： Wei Zhang , Douglas Stewart Malchow , Michael J. Evans , Wei Huang , Paul L. Bereznycky , Namwoong Paik
IPC: H01L27/146 , H01L23/00
Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
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公开(公告)号：US10587824B2
公开(公告)日：2020-03-10
申请号：US15672045
申请日：2017-08-08
Applicant: Sensors Unlimited, Inc.
Inventor： Curt Dvonch , Albert P. Allard
Abstract: An imaging method includes imaging a scene having a pulsed light source and associating a symbol with the light source. The image is enhanced by inserting a symbol into the image indicative of location of the pulsed light source in the scene. The symbol overlays the image in spatial registration with the location of the pulsed light source in the scene to augment indication of the location provided by the pulsed light source. Imaging systems are also described.
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公开(公告)号：US10566371B2
公开(公告)日：2020-02-18
申请号：US16126314
申请日：2018-09-10
Applicant: Sensors Unlimited, Inc.
Inventor： Namwoong Paik , Wei Huang
IPC: H01L23/48 , H01L27/146 , H01L23/00
Abstract: A method of forming bump structures for interconnecting components includes dry etching a layer of insulating material to create a pattern for bump structures. A seed layer is deposited on the insulating material over the pattern. The seed layer is patterned with a photo resist material. The method also includes forming bump structures over the seed layer and the photo resist material with a plating material to form bump structures in the pattern, wherein the bump structures are isolated from one another.
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公开(公告)号：US10539464B2
公开(公告)日：2020-01-21
申请号：US15890263
申请日：2018-02-06
Applicant: Sensors Unlimited, Inc.
Inventor： Joshua Lund , John Liobe
Abstract: An imaging method includes assigning pixels within the extent of a focal plane array active area to a first readout range and a second readout range. Image data is read out from the pixels assigned to the first readout range and the second readout range. Pixels located within the extend of the focal plane array active area and not assigned to the first readout range or the second readout range are left unread. Imaging systems and hyperspectral imaging arrangements are also described.
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