公开(公告)号：US20230307398A1

公开(公告)日：2023-09-28

申请号：US17704341

申请日：2022-03-25

Applicant: Sensors Unlimited, Inc.

Inventor： Wei Huang ,  Sungjin Kim ,  Paul L. Bereznycky ,  Michael J. Evans ,  De Hsin Chang ,  Wei Zhang

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L24/16 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/81201

Abstract: A system includes a die with a first plurality of hybridization bumps extending therefrom, electrically connected to circuitry die. An external circuitry component with a second plurality of hybridization bumps extending therefrom, electrically connected to circuitry in the external circuitry component. The first plurality of hybridization bumps and the second plurality of hybridization bumps are pressed together for electrical communication between the die and the external circuitry component. The first plurality of hybridization bumps have a different material hardness from the second plurality of hybridization bumps. The first plurality of hybridization bumps have a different bump diameter from that of the second plurality of hybridization bumps.

公开(公告)号：US12051665B2

公开(公告)日：2024-07-30

申请号：US17704341

申请日：2022-03-25

Applicant: Sensors Unlimited, Inc.

Inventor： Wei Huang ,  Sungjin Kim ,  Paul L Bereznycky ,  Michael J. Evans ,  De Hsin Chang ,  Wei Zhang

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/81201

Abstract: A system includes a die with a first plurality of hybridization bumps extending therefrom, electrically connected to circuitry die. An external circuitry component with a second plurality of hybridization bumps extending therefrom, electrically connected to circuitry in the external circuitry component. The first plurality of hybridization bumps and the second plurality of hybridization bumps are pressed together for electrical communication between the die and the external circuitry component. The first plurality of hybridization bumps have a different material hardness from the second plurality of hybridization bumps. The first plurality of hybridization bumps have a different bump diameter from that of the second plurality of hybridization bumps.