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公开(公告)号:US20060004537A1
公开(公告)日:2006-01-05
申请号:US10882546
申请日:2004-06-30
申请人: Sandeep Jain , George Vergis , Animesh Mishra , Jun Shi
发明人: Sandeep Jain , George Vergis , Animesh Mishra , Jun Shi
CPC分类号: G01K7/42
摘要: In one embodiment a memory controller is provided. The memory controller comprises a predictive logic circuit to predict an increase in a current operating temperature of a memory device coupled to the memory controller, based on memory cycles to be issued to the memory device; and a temperature control circuit to perform a temperature control operation wherein if the sum of the current operating temperature and the predicted increase in temperature is greater than a threshold temperature associated with the memory device, then the number of memory cycles issued to the memory device is reduced.
摘要翻译: 在一个实施例中,提供了存储器控制器。 存储器控制器包括预测逻辑电路,用于基于要发送到存储器件的存储器周期来预测耦合到存储器控制器的存储器件的当前工作温度的增加; 以及温度控制电路,用于执行温度控制操作,其中如果当前工作温度和预测的温度升高的总和大于与存储器件相关联的阈值温度,则发出到存储器件的存储器循环的数量是 减少
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公开(公告)号:US07099735B2
公开(公告)日:2006-08-29
申请号:US10882546
申请日:2004-06-30
申请人: Sandeep K. Jain , George Vergis , Animesh Mishra , Jun Shi
发明人: Sandeep K. Jain , George Vergis , Animesh Mishra , Jun Shi
CPC分类号: G01K7/42
摘要: In one embodiment a memory controller is provided. The memory controller comprises a predictive logic circuit to predict an increase in a current operating temperature of a memory device coupled to the memory controller, based on memory cycles to be issued to the memory device; and a temperature control circuit to perform a temperature control operation wherein if the sum of the current operating temperature and the predicted increase in temperature is greater than a threshold temperature associated with the memory device, then the number of memory cycles issued to the memory device is reduced.
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公开(公告)号:US20070005836A1
公开(公告)日:2007-01-04
申请号:US11148160
申请日:2005-06-07
申请人: Sandeep Jain , George Vergis , John Halbert , Nilesh Shah
发明人: Sandeep Jain , George Vergis , John Halbert , Nilesh Shah
IPC分类号: G06F13/38
CPC分类号: G06F13/4013 , G11C5/06 , G11C7/04 , G11C7/1006 , G11C8/20
摘要: Swizzle information for signal lines on a memory component may be stored on the memory component. The swizzle information may be transmitted to a memory controller which may include logic to receive the swizzle information which is then used to deswizzle data received from the memory component. Data may be transmitted from a memory device to a memory controller in a format that is tolerant of swizzling on signal lines between the device and the controller. The format may include codes having unique of numbers of values. Data may be sent in multi-code bursts that divide a data range into progressively smaller ranges. Other embodiments are described and claimed.
摘要翻译: 存储器组件上的信号线的交换信息可以存储在存储器组件上。 交换信息可以被发送到存储器控制器,存储器控制器可以包括用于接收转移信息的逻辑,然后用于去除从存储器组件接收的数据。 数据可以以容许在设备和控制器之间的信号线上进行转换的格式从存储器件发送到存储器控制器。 该格式可以包括具有唯一值的值的代码。 可以以将多个数字范围分割成逐渐变小的多码脉冲串来发送数据。 描述和要求保护其他实施例。
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公开(公告)号:US20140192607A1
公开(公告)日:2014-07-10
申请号:US13976791
申请日:2012-05-08
申请人: Kuljit Bains , George Vergis
发明人: Kuljit Bains , George Vergis
IPC分类号: G11C5/14
CPC分类号: G11C5/145 , G11C11/4074 , G11C29/021 , G11C29/028
摘要: A memory subsystem includes an adaptive output voltage to provide a voltage based on a power profile of a memory device of the memory subsystem. A charge pump increases the voltage to a level needed to write data to the memory device. The voltage provided is based on the power profile of the memory device, which indicates a voltage level that provides good efficiency for the charge pump, and is within maximum levels for the memory device. The voltage can be higher than a nominal voltage indicated for the memory device in a specification.
摘要翻译: 存储器子系统包括自适应输出电压,以基于存储器子系统的存储器件的功率曲线来提供电压。 电荷泵将电压提高到将数据写入存储器件所需的水平。 所提供的电压基于存储器件的功率曲线,其指示为电荷泵提供良好效率的电压电平,并且在存储器件的最大电平内。 电压可以高于规范中为存储器件指示的额定电压。
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公开(公告)号:US20140013168A1
公开(公告)日:2014-01-09
申请号:US13997850
申请日:2012-03-31
申请人: Kuljit Singh Bains , George Vergis
发明人: Kuljit Singh Bains , George Vergis
IPC分类号: G06F11/10
CPC分类号: G06F11/10 , G06F11/108 , G11C5/04 , G11C7/1063 , G11C29/42 , G11C29/44 , G11C2029/0409 , G11C2029/0411
摘要: A memory subsystem has multiple memory devices coupled to a command/address line and an error alert line, the error alert line delay-compensated to provide deterministic alert signal timing. The command/address line and the error alert line are connected between the memory devices and a memory controller that manages the memory devices. The command/address line is driven by the memory controller, and the error alert line is driven by the memory devices.
摘要翻译: 存储器子系统具有耦合到命令/地址线和错误警报线的多个存储器件,误差警报线被延迟补偿以提供确定性警报信号定时。 命令/地址线和错误警报线连接在存储器件和管理存储器件的存储器控制器之间。 命令/地址线由存储器控制器驱动,错误警报线由存储器件驱动。
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公开(公告)号:US20110252193A1
公开(公告)日:2011-10-13
申请号:US12758667
申请日:2010-04-12
申请人: Kuljit S. Bains , George Vergis
发明人: Kuljit S. Bains , George Vergis
IPC分类号: G06F12/00
CPC分类号: G11C11/406 , G11C11/40611
摘要: A system, device, and method for designating a first rank among a plurality of memory ranks of a Memory Module as a primary rank and a second one or more ranks as secondary ranks, triggering, via hardware logic internal to the Memory Module coupled with the plurality of memory ranks, a refresh of the primary rank at a first time (e.g., Time1), and triggering a non overlapping staggered refresh of each of the secondary ranks at a second one or more times (e.g., Time2 through Timen) corresponding to each of the respective memory ranks designated as the secondary ranks.
摘要翻译: 一种用于将作为主等级的存储器模块的多个存储器级别中的第一级指定为第二级别的第二级别的系统,设备和方法,并且经由与存储器模块耦合的存储器模块内部的硬件逻辑触发, 多个存储器等级,第一次刷新主等级(例如,Time1),并且在第二次或更多次(例如,Time2至Timen)触发每个次级队列的非重叠交错刷新,对应于 每个相应的记忆级别被指定为次级排名。
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公开(公告)号:US06453218B1
公开(公告)日:2002-09-17
申请号:US09280913
申请日:1999-03-29
申请人: George Vergis
发明人: George Vergis
IPC分类号: G05D2300
CPC分类号: G05D23/20 , G05D23/1917
摘要: A method and apparatus for the thermal sensing and regulating of a RAM device using temperature sensing circuitry, embedded directly in the device, is presented. A predetermined voltage is passed through a temperature sensitive diode to create an analog signal. The analog signal is converted into digital temperature data by a A/D converter. The digital temperature data is then transmitted to a controlling host, without interfering with the normal operation of the device, by either transmitting the data in an out-of-band signal or during the clock refresh cycle. The controlling host, upon receipt of the temperature data, checks to see if the temperature level of the device has exceeded a threshold value.
摘要翻译: 提出了一种用于使用直接嵌入设备中的温度感测电路对RAM器件的热感测和调节的方法和装置。 预定电压通过温度敏感二极管以产生模拟信号。 模拟信号由A / D转换器转换为数字温度数据。 然后,通过在带外信号中传输数据或在时钟刷新周期期间将数字温度数据发送到控制主机,而不干扰设备的正常操作。 控制主机在接收到温度数据后,检查设备的温度水平是否超过阈值。
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公开(公告)号:US20180247678A1
公开(公告)日:2018-08-30
申请号:US15718388
申请日:2017-09-28
申请人: George Vergis , Dat Le
发明人: George Vergis , Dat Le
IPC分类号: G11C5/14
CPC分类号: G11C5/147 , G11C5/04 , G11C5/063 , G11C5/14 , G11C7/1063 , G11C2207/10 , G11C2207/105
摘要: In one embodiment, an apparatus comprises a first connector to couple to a connector of a memory card, the memory card comprising a first sense node to sense a supply voltage at a first location of the memory card, the first connector comprising a voltage supply pin; a ground pin; and a sense pin to couple to the first sense node; a first sense line to couple to the first sense node through the sense pin; and a voltage regulator coupled to the first sense line, the voltage regulator to provide the supply voltage based on feedback received from the first sense node of the memory card via the first sense line.
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公开(公告)号:US09442871B2
公开(公告)日:2016-09-13
申请号:US13995477
申请日:2011-12-22
申请人: Kuljit S. Bains , Klaus J. Ruff , George Vergis , Suneeta Sah
发明人: Kuljit S. Bains , Klaus J. Ruff , George Vergis , Suneeta Sah
CPC分类号: G11C7/1072 , G06F11/073 , G06F11/0787 , G06F11/10 , G06F11/1004 , G06F11/1016 , G06F11/1612 , G06F13/16 , G06F13/28 , G11C7/1006 , G11C29/44 , G11C2029/0411 , G11C2029/4402
摘要: A register not connected to a data bus is read by transferring data across an address bus to a device connected to the data bus, from which the data is read by a device connected to the data bus. The register resides in a register device connected via the address bus to a memory device that is connected to both the address bus and the data bus. A host processor triggers the register device to transfer information over the address bus to a register on the memory device. The host processor then reads the information from the register of the memory device.
摘要翻译: 通过将地址总线上的数据传送到连接到数据总线的设备,可以读取未连接到数据总线的寄存器,数据由连接到数据总线的设备读取。 寄存器位于通过地址总线连接到连接到地址总线和数据总线两者的存储器件的寄存器中。 主处理器触发寄存器设备通过地址总线将信息传送到存储器设备上的寄存器。 然后主机处理器从存储器件的寄存器读取信息。
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10.
公开(公告)号:US20160183374A1
公开(公告)日:2016-06-23
申请号:US14575775
申请日:2014-12-18
申请人: Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
发明人: Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
CPC分类号: H05K1/181 , H01L23/00 , H01L23/498 , H01L2224/16225 , H01L2924/15311 , H01R12/712 , H01R12/79 , H05K2201/10159 , H05K2201/10325 , Y02P70/611
摘要: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
摘要翻译: 公开了可配置的中央处理单元(CPU)封装基板。 描述了包括处理设备接口的封装衬底。 封装衬底还包括设置在封装衬底上的存储器件电接口。 封装衬底还包括靠近存储器件电接口设置的可移除存储器机械接口。 可移除存储器机械接口是允许在将存储器件附接到封装衬底之后容易地从封装衬底移除存储器件。
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