摘要:
Systems, methods, and apparatuses are directed to optimizing turnaround timing of successive transactions between a host and a memory device. The host includes framing logic that generates a write frame that includes a plurality of data bits and an error bit checksum that is appended at the end of the data bits. The host further includes a bus infrastructure configured to accommodate the transfer of the write frame to the memory device and logic that defines the turnaround time to begin at a time instant that immediately follows the transfer of the data bits of the write frame. The turnaround time measures the time delay at which a succeeding write frame is to be transferred. In this manner, the turnaround time is optimized to enable the earlier initiation of successive data operations, thereby reducing the overall latency of successive back-to-back transactions.
摘要:
A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate. Other embodiments are also disclosed and claimed.
摘要:
A memory subsystem has multiple memory devices coupled to a command/address line and an error alert line, the error alert line delay-compensated to provide deterministic alert signal timing. The command/address line and the error alert line are connected between the memory devices and a memory controller that manages the memory devices. The command/address line is driven by the memory controller, and the error alert line is driven by the memory devices.
摘要:
A memory subsystem has multiple memory devices coupled to a command/address line and an error alert line, the error alert line delay-compensated to provide deterministic alert signal timing. The command/address line and the error alert line are connected between the memory devices and a memory controller that manages the memory devices. The command/address line is driven by the memory controller, and the error alert line is driven by the memory devices.
摘要:
Systems, methods, and apparatuses are directed to optimizing turnaround timing of successive transactions between a host and a memory device. The host includes framing logic that generates a write frame that includes a plurality of data bits and an error bit checksum that is appended at the end of the data bits. The host further includes a bus infrastructure configured to accommodate the transfer of the write frame to the memory device and logic that defines the turnaround time to begin at a time instant that immediately follows the transfer of the data bits of the write frame. The turnaround time measures the time delay at which a succeeding write frame is to be transferred. In this manner, the turnaround time is optimized to enable the earlier initiation of successive data operations, thereby reducing the overall latency of successive back-to-back transactions.
摘要:
A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate.
摘要:
Devices, systems, and methods include an active mode to accommodate read/write operations of a memory device and a self-refresh mode to accommodate recharging of voltage levels representing stored data when read/write operations are idle. At least one register source provides a first voltage level and a second voltage level that is less than the first voltage level. With such a configuration, during the active mode, the memory device operates at the first voltage level as provided by the at least one register source, and during the self-refresh mode, the memory device operates at the second voltage level as provided by the at least one register source.
摘要:
A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate. Other embodiments are also disclosed and claimed.
摘要:
A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate. Other embodiments are also disclosed and claimed.