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公开(公告)号：US20160190716A1
公开(公告)日：2016-06-30
申请号：US14583357
申请日：2014-12-26
申请人： Kuang Liu , Gregorio Murtagian , David J. Llapitan , Jeffory L. Smalley , Gaurav Chawla , Joshua D. Heppner , Vijaykumar Krithivasan , Jonathan W. Thibado
发明人： Kuang Liu , Gregorio Murtagian , David J. Llapitan , Jeffory L. Smalley , Gaurav Chawla , Joshua D. Heppner , Vijaykumar Krithivasan , Jonathan W. Thibado
CPC分类号： H01R12/89 , H01R12/716 , H05K7/1007
摘要： Some forms relate to a socket having a housing. A first receiving pin field is formed as part of the housing. The first pin receiving field includes a first plurality of electrical contacts. A second receiving pin field is formed as part of the housing. The second pin field includes a second plurality of electrical contacts. An actuation mechanism is configured to engage the first plurality electrical contacts with a first set of pins on a first electronic package and the second plurality electrical contacts with a second set of pins on a second electronic package.
摘要翻译： 一些形式涉及具有外壳的插座。 第一接收引脚字段形成为外壳的一部分。 第一引脚接收区域包括第一多个电触点。 第二接收引脚字段形成为外壳的一部分。 第二引脚字段包括第二多个电触点。 致动机构构造成使第一多个电触点与第一电子封装上的第一组引脚接合，而第二多个电触点与第二电子封装上的第二组引脚接合。
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公开(公告)号：US20100159730A1
公开(公告)日：2010-06-24
申请号：US12344173
申请日：2008-12-24
CPC分类号： H05K7/1061 , Y10T74/20612
摘要： Electronic assemblies are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a load mechanism including a first lever arm and a second lever arm. The load mechanism also includes a first axis portion extending from a first longitudinal end of the first lever arm, the first axis portion pivotally coupled to the circuit board, and a second axis portion extending from a first longitudinal end of the second lever arm, the second axis portion pivotally coupled to the circuit board. The load mechanism also includes a first load arm region extending from the first axis portion and the second axis portion and positioned between the first and second lever arms. The load mechanism also includes a first handle region at a second longitudinal end of the first lever arm, and a second handle region at a second longitudinal end of the second lever arm. The load mechanism also includes a second load arm region extending from the first handle region, and a third load arm region extending from the second handle region, the second and third load arm regions positioned between the first and second lever arms. The load mechanism also includes a gap positioned between an end of the second load arm and an end of the third load arm. The load mechanism is coupled to the circuit board. Other embodiments are described and claimed.
摘要翻译： 描述电子组件。 一个实施例包括电路板和耦合到电路板的插座。 组件还包括包括第一杠杆臂和第二杠杆臂的负载机构。 负载机构还包括从第一杠杆臂的第一纵向端部延伸的第一轴线部分，枢转地联接到电路板的第一轴线部分和从第二杠杆臂的第一纵向端部延伸的第二轴线部分， 枢转地联接到电路板的第二轴部分。 负载机构还包括从第一轴部分和第二轴部分延伸并且定位在第一和第二杠杆臂之间的第一负载臂区域。 负载机构还包括在第一杠杆臂的第二纵向端处的第一手柄区域和在第二杠杆臂的第二纵向端处的第二手柄区域。 负载机构还包括从第一手柄区域延伸的第二负载臂区域和从第二手柄区域延伸的第三负载臂区域，位于第一和第二杠杆臂之间的第二和第三负载臂区域。 负载机构还包括位于第二负载臂的端部和第三负载臂的端部之间的间隙。 负载机构耦合到电路板。 描述和要求保护其他实施例。
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公开(公告)号：US08081489B2
公开(公告)日：2011-12-20
申请号：US12344193
申请日：2008-12-24
IPC分类号： H05K7/18
CPC分类号： H05K7/1007
摘要： Electronic assemblies are described. One embodiment includes a circuit board, a socket coupled to the circuit board, and a device positioned in the socket. The embodiment also includes a load mechanism including first and second components, the first component pivotally coupled to the circuit board, the first component including first and second lever arms and an axle region therebetween, the first component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the first component lever arms. The load mechanism also includes a second component pivotally coupled to the circuit board, the second component including first and second lever arms and an axle region therebetween, the second wire component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the second wire component lever arms. The first and second wire components are positioned so that when a force is applied to the first component lever arms, the first lever arm of the first component engages the first lever arm of the second component and applies a force thereto, and the second lever arm of the first component engages the second lever arm of the second component and applies a force thereto. Other embodiments are described and claimed.
摘要翻译： 描述电子组件。 一个实施例包括电路板，耦合到电路板的插座和定位在插座中的装置。 该实施例还包括包括第一和第二部件的负载机构，第一部件枢转地联接到电路板，第一部件包括第一和第二杠杆臂及其间的轴区域，第一部件还包括从 轴区域，并且当力施加到第一部件杆臂时适于传递负载。 负载机构还包括枢转地联接到电路板的第二部件，第二部件包括第一和第二杠杆臂及其间的轴区域，第二线部件还包括从轴区域延伸的负载臂区域， 当力施加到第二线部件杆臂时的负载。 第一和第二线组件被定位成使得当力施加到第一部件杆臂时，第一部件的第一杠杆臂接合第二部件的第一杠杆臂并向其施加力，并且第二杠杆臂 的第一部件接合第二部件的第二杠杆臂并向其施加力。 描述和要求保护其他实施例。
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4.发明授权Electronic assemblies with high capacity heat sinks and methods of manufacture 有权具有高容量散热器的电子组件和制造方法公开(公告)号：US07200934B2
公开(公告)日：2007-04-10
申请号：US10656968
申请日：2003-09-05
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.
摘要翻译： 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片，其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中，翅片是弯曲的。 在另一个实施例中，翅片弯曲。 在另一个实施例中，翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法，以及将散热器应用于电子组件和电子系统。
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公开(公告)号：US06327147B1
公开(公告)日：2001-12-04
申请号：US09475710
申请日：1999-12-30
IPC分类号： H05K720
CPC分类号： H05K7/1431 , Y10S174/35 , Y10S439/947
摘要： A retention mechanism is formed of a molded plastic member having a base portion with at least one through-hole and a first through-slot adjacent thereto. The plastic member includes a card receiving structure having an open side, and a second receiving structure having an open side with a second through-slot through a wall of the receiving structure perpendicular to the base portion. Inserted in the plastic member is an elongate metal member having a base portion and a distal end. The metal member extends through the first and second through-slots with the base portion positioned adjacent the base portion and the distal portion positioned within the second receiving structure. The distal portion of the metal member is formed to provide spring action against a member inserted into the second receiving structure.
摘要翻译： 保持机构由具有至少一个通孔的基部和与其相邻的第一通孔的模制塑料构件形成。 塑料构件包括具有开口侧的卡片接收结构和具有开口侧的第二接收结构，第二接收结构具有穿过接收结构垂直于基部的壁的第二通孔。 插入在塑料构件中的是具有基部和远端的细长金属构件。 金属构件延伸穿过第一和第二通孔，基部邻近基部定位，远侧部定位在第二接收结构内。 金属构件的远端形成为对插入第二接收结构中的构件提供弹簧作用。
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公开(公告)号：US20160190717A1
公开(公告)日：2016-06-30
申请号：US14583372
申请日：2014-12-26
申请人： David J. Llapitan , Jeffory L. Smalley , Gaurav Chawla , Joshua D. Heppner , Vijaykumar Krithivasan , Jonathan W. Thibado , Kuang Liu , Gregorio Murtagian
发明人： David J. Llapitan , Jeffory L. Smalley , Gaurav Chawla , Joshua D. Heppner , Vijaykumar Krithivasan , Jonathan W. Thibado , Kuang Liu , Gregorio Murtagian
CPC分类号： H05K7/1084
摘要： Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.
摘要翻译： 一些形式涉及包括多个电子封装的电子组件。 电子组件包括安装在框架上的框架和第一电子封装件。 第一电子封装包括第一引脚格栅阵列。 电子组件还包括安装在框架上的第二电子封装。 第二电子封装包括第二引脚格栅阵列。 电子组件还包括在框架上的致动机构。 致动机构构造成在致动机构的操作期间相对于框架移动第一电子封装和第二电子封装。
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公开(公告)号：US20150118870A1
公开(公告)日：2015-04-30
申请号：US14065281
申请日：2013-10-28
申请人： Rajasekaran Swaminathan , Ram S. Viswanath , Sanka Ganesan , Gaurav Chawla , Joshua D. Heppner , Jeffory L. Smalley , Vijaykumar Krithivasan , David J. Llapitan , Neal E. Ulen , Donald T. Tran
发明人： Rajasekaran Swaminathan , Ram S. Viswanath , Sanka Ganesan , Gaurav Chawla , Joshua D. Heppner , Jeffory L. Smalley , Vijaykumar Krithivasan , David J. Llapitan , Neal E. Ulen , Donald T. Tran
CPC分类号： H05K7/10 , H01R12/00 , H01R12/716 , H01R13/2442 , H05K1/00 , Y10T29/49169
摘要： Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.
摘要翻译： 描述了与集成电路（IC）连接器相关的实施例。 在一些实施例中，IC组件可以包括IC封装衬底，中间构件和阳连接器。 IC封装基板可以在顶表面或底表面上具有第一信号触点，并且底表面可以具有用于与电路板上的插座耦合的第二信号触点。 中间构件可以具有联接到第一信号触头的第一端和延伸超过侧表面的第二端。 阳连接器可以设置在中间构件的第二端处，并且可以具有联接到中间构件的信号触点的信号触点。 当阴连接器沿平行于中间构件的轴线的方向接合时，阳连接器可与母连接器配合。 可以公开和/或要求保护其他实施例。
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公开(公告)号：US20140092573A1
公开(公告)日：2014-04-03
申请号：US13631806
申请日：2012-09-28
IPC分类号： H05K1/18 , H01L23/544 , H01L21/02
CPC分类号： H05K3/301 , H05K7/1007 , H05K7/1061 , H05K2201/10325 , H05K2201/2018 , H05K2203/167
摘要： In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.
摘要翻译： 在一个实施例中，负载框架和集成电路装置与沿基板上承载的基架对准，沿着第一对准轴线，该第一对准轴线由第一对准柱限定，该第一对准轴线从基架延伸到负载框架，横向于 基板和承载在基架上的第一偏置装置被致动以将负载框架接合并偏压到与负载框架对准的基架，并将集成电路偏压到基板。 闩锁将负载和基架锁定在一起，与集成电路器件和衬底对齐并彼此偏置，并且彼此对齐并且彼此偏置。 还描述了其他方面和特征。
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公开(公告)号：US06585534B2
公开(公告)日：2003-07-01
申请号：US09137520
申请日：1998-08-20
IPC分类号： H01R1362
CPC分类号： H05K7/1405 , H01L23/4093 , H01L2924/0002 , H01R12/7047 , H01L2924/00
摘要： A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
摘要翻译： 一种用于具有基板和散热器的电子组件的保持机构。 保持机构包括接收基板的基板槽和接收散热器的散热槽。 可能有两个固定机构连接到与电连接器相邻的印刷电路板。 可能有两个对准地位于基板槽周围的散热槽，使得该机构可以安装在连接器的左侧或右侧。 对称槽消除了对左侧机构和右侧机构的需要。 保持器机构还可以具有螺母保持器，其捕获用于将机构附接到印刷电路板的螺母。 螺母固定器允许螺母在组装过程中与保持器机构一起运输。
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公开(公告)号：US20160183374A1
公开(公告)日：2016-06-23
申请号：US14575775
申请日：2014-12-18
申请人： Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
发明人： Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
CPC分类号： H05K1/181 , H01L23/00 , H01L23/498 , H01L2224/16225 , H01L2924/15311 , H01R12/712 , H01R12/79 , H05K2201/10159 , H05K2201/10325 , Y02P70/611
摘要： Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
摘要翻译： 公开了可配置的中央处理单元（CPU）封装基板。 描述了包括处理设备接口的封装衬底。 封装衬底还包括设置在封装衬底上的存储器件电接口。 封装衬底还包括靠近存储器件电接口设置的可移除存储器机械接口。 可移除存储器机械接口是允许在将存储器件附接到封装衬底之后容易地从封装衬底移除存储器件。
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