公开(公告)号：US20150118870A1

公开(公告)日：2015-04-30

申请号：US14065281

申请日：2013-10-28

申请人： Rajasekaran Swaminathan ,  Ram S. Viswanath ,  Sanka Ganesan ,  Gaurav Chawla ,  Joshua D. Heppner ,  Jeffory L. Smalley ,  Vijaykumar Krithivasan ,  David J. Llapitan ,  Neal E. Ulen ,  Donald T. Tran

发明人： Rajasekaran Swaminathan ,  Ram S. Viswanath ,  Sanka Ganesan ,  Gaurav Chawla ,  Joshua D. Heppner ,  Jeffory L. Smalley ,  Vijaykumar Krithivasan ,  David J. Llapitan ,  Neal E. Ulen ,  Donald T. Tran

IPC分类号： H01R12/71 ,  H01R43/00

CPC分类号： H05K7/10 ,  H01R12/00 ,  H01R12/716 ,  H01R13/2442 ,  H05K1/00 ,  Y10T29/49169

摘要： Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.

摘要翻译： 描述了与集成电路（IC）连接器相关的实施例。 在一些实施例中，IC组件可以包括IC封装衬底，中间构件和阳连接器。 IC封装基板可以在顶表面或底表面上具有第一信号触点，并且底表面可以具有用于与电路板上的插座耦合的第二信号触点。 中间构件可以具有联接到第一信号触头的第一端和延伸超过侧表面的第二端。 阳连接器可以设置在中间构件的第二端处，并且可以具有联接到中间构件的信号触点的信号触点。 当阴连接器沿平行于中间构件的轴线的方向接合时，阳连接器可与母连接器配合。 可以公开和/或要求保护其他实施例。

公开(公告)号：US20140092573A1

公开(公告)日：2014-04-03

申请号：US13631806

申请日：2012-09-28

申请人： David J. LLAPITAN ,  Neal E. ULEN ,  Jeffory L. SMALLEY

发明人： David J. LLAPITAN ,  Neal E. ULEN ,  Jeffory L. SMALLEY

IPC分类号： H05K1/18 ,  H01L23/544 ,  H01L21/02

CPC分类号： H05K3/301 ,  H05K7/1007 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/2018 ,  H05K2203/167

摘要： In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.

摘要翻译： 在一个实施例中，负载框架和集成电路装置与沿基板上承载的基架对准，沿着第一对准轴线，该第一对准轴线由第一对准柱限定，该第一对准轴线从基架延伸到负载框架，横向于 基板和承载在基架上的第一偏置装置被致动以将负载框架接合并偏压到与负载框架对准的基架，并将集成电路偏压到基板。 闩锁将负载和基架锁定在一起，与集成电路器件和衬底对齐并彼此偏置，并且彼此对齐并且彼此偏置。 还描述了其他方面和特征。

公开(公告)号：US09681556B2

公开(公告)日：2017-06-13

申请号：US13631806

申请日：2012-09-28

申请人： David J. Llapitan ,  Neal E. Ulen ,  Jeffory L. Smalley

发明人： David J. Llapitan ,  Neal E. Ulen ,  Jeffory L. Smalley

IPC分类号： H05K3/30 ,  H05K7/10

CPC分类号： H05K3/301 ,  H05K7/1007 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/2018 ,  H05K2203/167

摘要： In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.

公开(公告)号：US07042727B2

公开(公告)日：2006-05-09

申请号：US10672022

申请日：2003-09-26

申请人： Neal E. Ulen ,  David Shia ,  Sandeep Ahuja

发明人： Neal E. Ulen ,  David Shia ,  Sandeep Ahuja

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L23/42 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

摘要： In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted spring has a plurality of holes each of which is aligned with a respective one of the holes in the circuit board. Bosses of the spring are each sandwiched between a respective standoff on a chassis and a respective standoff on a heat sink. Holes in the circuit board at the locus of the standoffs are sized so that the circuit board is not sandwiched between the standoffs. The spring presses the circuit board upwardly to bring an integrated circuit in contact with the heat sink.

摘要翻译： 在一些实施例中，一种方法包括提供具有穿过其形成的多个孔的电路板，并将弹簧安装到电路板的下侧，使得安装的弹簧具有多个孔，每个孔与 电路板上的孔。 弹簧的凸起各自夹在底盘上的相应支座和散热器上的相应支架之间。 在电路板的座位的孔中的孔的尺寸使得电路板不夹在支架之间。 弹簧向上按压电路板，使集成电路与散热器接触。