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53 条记录 (耗时 0.018 秒)

    Housing for accommodating an electric circuit board
    1.
    发明授权
    Housing for accommodating an electric circuit board 有权
    用于容纳电路板的外壳

    公开(公告)号：US09480181B2

    公开(公告)日：2016-10-25

    申请号：US14389844

    申请日：2013-03-14

    申请人： Harting Electronics GmbH

    发明人： Marc Lindkamp ,  Rainer Bussmann

    IPC分类号： H05K5/00 ,  H05K7/14

    CPC分类号： H05K7/1427 ,  H05K5/0047 ,  H05K5/0052 ,  H05K5/006 ,  H05K7/1417 ,  H05K7/142 ,  H05K2203/167 ,  Y10S174/34 ,  Y10S174/35

    摘要： In a housing 1 for receiving an electric circuit board 50 it is proposed to provide in a first housing half 2 of the housing 1 a plurality of bearing pads 20, 21 located at various levels. These bearing pads 20, 21 receive, together with counter bearing pads 30, 31 provided in a second housing half 30, the electric circuit board 50. A plurality of support points 55, 56 is provided on the electric circuit board 50, each of which support points 55, 56 is respectively associated with the bearing pads 20, 21 and counter bearing pads 30, 31. By removing individual support points 55, 56, the bearing pads 20, 21 and counter bearing pads 30, 31 are selected, on which the circuit board 50 is supposed to rest. By selecting the bearing pads 20, 21 and counter bearing pads 30, 31 lying at different levels, the level of the electric circuit board 50 in the housing 1 is determined.

    摘要翻译： 在用于接收电路板50的壳体1中，建议在壳体1的第一壳体半部2中设置多个位于各种水平的轴承瓦块20,21。 这些轴承座20,21与设置在第二壳体半部30（电路板50）中的反向轴承座30,31一起接收。多个支撑点55,56设置在电路板50上，每个支撑点 支撑点55,56分别与轴承瓦块20,21和反向轴承瓦块30,31相关联。通过移除单独的支撑点55,56，选择轴承瓦块20,21和反向轴承瓦块30,31， 假定电路板50休息。 通过选择位于不同水平的轴承瓦块20,21和反向轴承座30,31，确定壳体1中的电路板50的高度。

    RECEIVING DEVICE AND SHIELD CASE CONNECTION METHOD
    2.
    发明申请
    RECEIVING DEVICE AND SHIELD CASE CONNECTION METHOD 有权
    接收设备和屏蔽盒连接方法

    公开(公告)号：US20150181773A1

    公开(公告)日：2015-06-25

    申请号：US14527177

    申请日：2014-10-29

    申请人： Panasonic Intellectual Property Management Co., Ltd.

    发明人： Isao UEDA ,  Toshitaka SUMA ,  Akio TAKEUCHI

    IPC分类号： H05K9/00

    CPC分类号： H05K9/0028 ,  H05K9/0024 ,  H05K9/003 ,  H05K9/0037 ,  H05K2201/10371 ,  Y10S174/35 ,  Y10T29/49124

    摘要： A receiving device comprising: a shield case which is in a hollow box shape that is open on one side, the shield case reducing external interfering signals which interfere with an input signal of a broadcast wave; and a printed wiring board including a conductive portion that is electrically connected with an electronic component, wherein a soldered portion is formed along a side of an opening edge of the shield case, the soldered portion electrically connecting with solder the shield case and the conductive portion.

    摘要翻译： 一种接收装置，包括：屏蔽壳，其处于一侧开口的中空盒形状，所述屏蔽壳减少干扰广播波的输入信号的外部干扰信号; 以及印刷电路板，其包括与电子部件电连接的导电部，其中，沿着所述屏蔽壳的开口边缘的一侧形成焊接部，所述焊接部与所述屏蔽壳和所述导电部的焊料电连接 。

    Shielded electronic circuit
    3.
    发明授权
    Shielded electronic circuit 失效
    屏蔽电子电路

    公开(公告)号：US06590783B2

    公开(公告)日：2003-07-08

    申请号：US09864690

    申请日：2001-05-24

    申请人： Joachim Spratte ,  Jörg Reinhardt

    发明人： Joachim Spratte ,  Jörg Reinhardt

    IPC分类号： H05K900

    CPC分类号： H05K9/0024 ,  Y10S174/35

    摘要： An electronic circuit includes an outer shielding mounted on a main printed circuit board. To prevent electronic components from affecting one another, at least one inner shielding is arranged within the outer shielding. The outer shielding has an opening bounded by spring tongues which rest on the inner shielding.

    摘要翻译： 电子电路包括安装在主印刷电路板上的外屏蔽。 为了防止电子部件相互影响，至少一个内部屏蔽被布置在外部屏蔽内。 外屏蔽件具有由弹性舌片限定的开口，该弹簧舌片搁置在内屏蔽件上。

    Enclosure structure for electronic equipment
    4.
    发明授权
    Enclosure structure for electronic equipment 有权
    电子设备外壳结构

    公开(公告)号：US06369320B1

    公开(公告)日：2002-04-09

    申请号：US09660988

    申请日：2000-09-13

    申请人： Hiroshi Okamoto

    发明人： Hiroshi Okamoto

    IPC分类号： H02G308

    CPC分类号： H05K5/0017 ,  Y10S174/35

    摘要： In an enclosure structure for electronic equipment, operating parts of electronic components (3) operated from outside, an LCD panel (4), and connectors (5) are mounted to a printed circuit board (PCB) (1) on one and the same plane. The PCB (1) is installed within an outer enclosure formed by joining an upper housing (6) and a lower housing (7) which are formed as single elements by diecasting, the PCB (1) being mounted to lower housing (7) of the two housings. Cutouts (9a, 10a, 9b, 10b) are formed at the joining parts between the housings (6, 7), so that when the housings are joined, the operating parts of the electronic components (3) and the like are exposed to the outside at holes and windows formed by the cutouts (9a, 10a, 9b, 10b).

    摘要翻译： 在电子设备的外壳结构中，从外部操作的电子部件（3）的操作部件，LCD面板（4）和连接器（5）安装到印刷电路板（PCB）（1）上 飞机 PCB（1）安装在通过连接通过压铸形成为单个元件的上壳体（6）和下壳体（7）形成的外壳中，PCB（1）安装到下壳体（7）的下壳体 两个外壳。 切口（9a，10a，9b，10b）形成在壳体（6,7）之间的接合部分处，使得当壳体接合时，电子部件（3）等的操作部件暴露于 在由切口（9a，10a，9b，10b）形成的孔和窗外部。

    Method and a device for shielding electronic components
    5.
    发明授权
    Method and a device for shielding electronic components 失效
    方法和用于屏蔽电子部件的装置

    公开(公告)号：US06316721B1

    公开(公告)日：2001-11-13

    申请号：US09467014

    申请日：1999-12-20

    申请人： Evald Koitsalu ,  Lars Wallin ,  Michael Persson

    发明人： Evald Koitsalu ,  Lars Wallin ,  Michael Persson

    IPC分类号： H05K900

    CPC分类号： H05K9/0032 ,  Y10S174/35

    摘要： A shielding device is formed by a wall having a top edge arranged to fasten a foil comprising an electrically conducting material. In order to fasten the foil, the wall can be provided with teeth at its top section. Also the wall(s) can be formed with arbitrary angles with respect to each other when forming a whole shielding device. The cover can be formed by one large or several smaller pieces. The cover is fastened to the walls by means of an adhesive, glue or soldering and an electrical contact is provided by the teeth projecting from the wall(s).

    摘要翻译： 屏蔽装置由具有顶部边缘的壁形成，所述顶部边缘被布置成紧固包括导电材料的箔。 为了固定箔，壁可以在其顶部设有齿。 此外，当形成整个屏蔽装置时，壁可以相对于彼此形成任意角度。 盖可以由一个大的或几个较小的片形成。 通过粘合剂，胶水或焊接将盖子紧固到壁上，并且由从墙壁突出的齿提供电接触。

    Semiconductor insulation for optical devices
    7.
    发明授权
    Semiconductor insulation for optical devices 失效
    半导体绝缘用于光学器件

    公开(公告)号：US5302778A

    公开(公告)日：1994-04-12

    申请号：US937791

    申请日：1992-08-28

    申请人： Martin A. Maurinus

    发明人： Martin A. Maurinus

    IPC分类号： H01L23/02 ,  H01L25/16 ,  H01L27/14 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58 ,  H04N5/225

    CPC分类号： H01L33/58 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/0002 ,  Y10S174/35

    摘要： A method and apparatus for enclosing an optically active integrated circuit die mounted on a region of a printed circuit substrate within either a unitary optical plastic lens element and enclosure or a discrete lens element and enclosure formed with mechanical standoff tabs and positioning pins for attaching and securing the unitary or discrete enclosure to the circuit substrate. The mechanical tabs of the enclosure have catches that snap in place into receiving apertures in the substrate so as to position the molded plastic lens over the optically active integrated circuit device at a predetermined distance providing the desired focal length. The molded plastic lens of the optical plastic enclosure protects the optically active integrated circuit from damage and images light thereon or therefrom. In a preferred embodiment, the side walls of the plastic enclosure contact the surface of the substrate and enclose the die and the region that the die is mounted on. The remaining volume enclosed within the molded plastic enclosure and lens element may be filled with a transparent epoxy material to provide a unitary, sealed enclosure with the optically active integrated circuit die with the region on the substrate. Preferably, the optically active device is a photosensitive micro-electronic circuit element, e.g. a photosensor or a charge coupled device (CCD).

    摘要翻译： 一种用于封装安装在印刷电路基板的区域内的光学活性集成电路管芯的方法和装置，所述光学活性集成电路管芯在单一的光学塑料透镜元件和外壳内或独立的透镜元件和外壳内形成有机械支座和用于附接和固定的定位销 整体或离散的外壳到电路基板。 外壳的机械接头具有捕捉到基底中的接收孔中的卡子，以便将模制的塑料透镜定位在光学活动的集成电路装置上以预定距离提供期望的焦距。 光学塑料外壳的模制塑料透镜保护光学活动的集成电路免受损坏并在其上或其上形成图像。 在优选实施例中，塑料外壳的侧壁接触基板的表面并且封装模具和模具安装的区域。 包封在模制塑料外壳和透镜元件内的剩余体积可以填充有透明环氧树脂材料，以提供具有光学有源集成电路管芯的整体密封外壳，其中衬底上具有该区域。 优选地，光学活性器件是感光微电子电路元件，例如， 光电传感器或电荷耦合器件（CCD）。

    Module for supporting circuit boards
    8.
    发明授权
    Module for supporting circuit boards 失效
    支持电路板的模块

    公开(公告)号：US4004194A

    公开(公告)日：1977-01-18

    申请号：US508639

    申请日：1974-09-23

    申请人： Karl Doerflinger ,  Hermann Renner ,  Richard Theus

    发明人： Karl Doerflinger ,  Hermann Renner ,  Richard Theus

    IPC分类号： H05K5/02 ,  H05K7/14 ,  H05K7/18 ,  H05K7/20 ,  H05K9/00

    CPC分类号： H05K9/0062 ,  H05K7/1424 ,  H05K7/20 ,  Y10S174/35

    摘要： A plug-in module for supporting therein plug-in circuit boards incorporating electrical components, the module having on the inner surface of its side walls supporting rails for the plug-in circuit boards and suspension rails on one of the external sides for suspending the module in an assembly system, said moudle being a one piece integral unit made of a metalized synthetic material having good shielding characteristics and having the ability to dissipate heat.

    摘要翻译： 一种插入式模块，用于在其中支撑包含电气部件的插入式电路板，该模块在其侧壁的内表面上支撑用于插入式电路板的轨道和用于悬挂模块的一个外侧上的悬挂导轨 在组装系统中，所述毛坯是由具有良好屏蔽特性并具有散热能力的金属合成材料制成的一体式整体单元。