公开(公告)号：US20160204073A1

公开(公告)日：2016-07-14

申请号：US14991800

申请日：2016-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： O-hyun BEAK ,  Keon KUK ,  Yong-chul KO ,  Woon-bae KIM

IPC: H01L23/552 ,  H05K1/18 ,  H01L21/56 ,  H01L21/02 ,  H01L23/48 ,  B05C5/00 ,  H01L23/29 ,  H01L21/3205 ,  H04W4/00 ,  H01L21/67 ,  B05C5/02 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/552 ,  B05C5/001 ,  B05C5/027 ,  H01L21/02255 ,  H01L21/32051 ,  H01L21/56 ,  H01L21/67115 ,  H01L23/291 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/15331 ,  H04W4/50 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract translation: 半导体封装包括安装在基板上的半导体芯片，覆盖半导体芯片的至少一部分并且包括触变材料或热熔材料的绝缘层，以及覆盖半导体芯片的至少一部分的屏蔽层和 绝缘层。 制造半导体封装的方法包括通过使用三维打印机形成具有高纵横比的绝缘层和屏蔽层。