Abstract:
Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
Abstract:
Provided are an optical switch, an optical probe including the optical switch, and a medical imaging apparatus including the optical probe. The optical probe includes a probe body that is configured to be insertable into a body cavity, and an optical switch that is disposed in the probe body and includes a first region formed of a material having a first refractive index, and a second region that forms an interface with the first region and is configured to have a fluid is introduced into the second region, wherein the optical switch is configured to change a path of propagation of incident light according to a second refractive index of the second region.
Abstract:
An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.
Abstract:
A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
Abstract:
A variable liquid lens system is provided. The variable liquid lens system includes a lens barrel comprising a wall and first and second ends, wherein the first and second ends are substantially transparent, at least one liquid lens disposed in the lens barrel and contacting the wall, the at least one liquid lens comprising a droplet, and a plurality of spaces containing fluid positioned on opposite sides of the at least one liquid lens inside the lens barrel. A plurality of first holes are provided in the wall at a position corresponding to the plurality of spaces. The at least one liquid lens is configured so that a position of the at least one liquid lens within the lens barrel is adjustable by adjusting amounts of the fluid contained in the plurality of spaces via the plurality of first holes.
Abstract:
A fiber scanning projector includes a light source comprising a plurality of monochromatic light sources, a modulator providing a modulation signal according to image information to the light source, a scanner scanning a screen with a light emitted from the light source and controlled according to the modulation signal, the scanner including a fiber bundle and an actuator which 2-axis-drives the fiber bundle, and a synchronization controller synchronizing driving of the actuator and driving of the modulator.
Abstract:
A microfluidic device and a method of controlling a fluid included in the microfluidic device. The microfluidic device includes: a chamber; a first fluid that is disposed in the chamber and in which a hygroscopic material is dissolved; a second fluid that is disposed in the chamber and is immiscible with the first fluid; and an electrode portion provide in the chamber and is configured to form an electrical field in the chamber when a voltage is applied to the electrode portion, wherein an interface between the first and second fluids is varied according to the electrical field.
Abstract:
An optical zoom probe is disclosed. The optical zoom probe includes: at least one liquid lens having a focus which is configured to be adjusted according to a flow of a fluid through a flow path; and a barrel provided to form the flow path and including a narrowed first end part including a first opening through which an image is captured, the at least one liquid lens being provided inside the barrel.
Abstract:
Provided are a micro electric liquid device and an apparatus including the device. The micro electric liquid device includes a first fluid that is opaque, a second fluid that is transparent a first channel configured to have the first and second fluid flow therein without mixing, a second channel overlapped and spaced apart from the first channel, wherein the second channel is configured to have the first and second fluids flow therein, and a connection part connecting the first and second channels, wherein an aperture is adjusted by a positional change of an interface between the first and second fluids in the first and second channels, and wherein the second channel includes a first sub channel configured to have the first and second fluids flow therein and having a non-uniform height and a second sub channel configured to have the second fluid to flow therein and having a uniform height.
Abstract:
A micro optical switch device, an image display apparatus including the same, and a method of manufacturing the micro optical switch device are provided. The micro optical switch device includes a substrate; a first electrode disposed on the substrate and having a plurality of openings; a second electrode disposed above and spaced apart from the first electrode, and having a plurality of openings; and support units disposed on the substrate and configured to support the second electrode, wherein the support units include deformation preventing portions protruding beyond a top surface of the second electrode