Invention Application
- Patent Title: Semiconductor Package and Method of Manufacturing the Same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US14991800Application Date: 2016-01-08
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Publication No.: US20160204073A1Publication Date: 2016-07-14
- Inventor: O-hyun BEAK , Keon KUK , Yong-chul KO , Woon-bae KIM
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2015-0003469 20150109; KR10-2015-0088717 20150622
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H05K1/18 ; H01L21/56 ; H01L21/02 ; H01L23/48 ; B05C5/00 ; H01L23/29 ; H01L21/3205 ; H04W4/00 ; H01L21/67 ; B05C5/02 ; H01L25/065 ; H01L23/00
Abstract:
A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.
Public/Granted literature
- US10937738B2 Semiconductor package and method of manufacturing the same Public/Granted day:2021-03-02
Information query
IPC分类:
