- 专利标题： Semiconductor package and method of manufacturing the same
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申请号： US14991800申请日： 2016-01-08
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公开(公告)号： US10937738B2公开(公告)日： 2021-03-02
- 发明人: O-hyun Beak , Keon Kuk , Young-chul Ko , Woon-bae Kim
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Nixon & Vanderhye P.C.
- 优先权： KR10-2015-0003469 20150109,KR10-2015-0088717 20150622
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H04W4/50 ; H01L23/29 ; B05C5/00 ; B05C5/02 ; H01L21/02 ; H01L21/3205 ; H01L21/67 ; H01L23/48 ; H01L23/00 ; H05K1/18 ; H01L23/31 ; H01L25/10 ; H01L21/56 ; H01L25/065
摘要：
A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.
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