Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
-
Application No.: US14991800Application Date: 2016-01-08
-
Publication No.: US10937738B2Publication Date: 2021-03-02
- Inventor: O-hyun Beak , Keon Kuk , Young-chul Ko , Woon-bae Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye P.C.
- Priority: KR10-2015-0003469 20150109,KR10-2015-0088717 20150622
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H04W4/50 ; H01L23/29 ; B05C5/00 ; B05C5/02 ; H01L21/02 ; H01L21/3205 ; H01L21/67 ; H01L23/48 ; H01L23/00 ; H05K1/18 ; H01L23/31 ; H01L25/10 ; H01L21/56 ; H01L25/065
Abstract:
A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.
Public/Granted literature
- US20160204073A1 Semiconductor Package and Method of Manufacturing the Same Public/Granted day:2016-07-14
Information query
IPC分类:
