公开(公告)号：US10953357B2

公开(公告)日：2021-03-23

申请号：US16053143

申请日：2018-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-ku Jeong ,  Young-chul Ko ,  Hyun-joo Kim ,  Jeong-su Han

IPC: B01D50/00 ,  B01D45/08 ,  F24C15/20 ,  B01D46/10 ,  B01D46/16 ,  B01D46/00 ,  B01D46/42 ,  B01D46/40 ,  F24F13/28

Abstract: An air cleaner and an oil mist filter are disclosed. The air cleaner includes a main body, and a filter device. The filter device includes at least one dust filter configured to filter external air and an oil mist filter configured to filter oil mist. The oil mist filter includes a stationary filter including a plurality of first baffles, and a movable filter including a plurality of second baffles respectively corresponding to the plurality of first baffles. The movable filter is movably disposed on one side of the stationary filter to be moved to first or second position. The oil mist filter is provided with a first air path in the first position, the first and second baffles are positioned closest to each other. The oil mist filter is provided with a second air path in the second position, the first and second baffles are farthest away from each other.

公开(公告)号：US10937738B2

公开(公告)日：2021-03-02

申请号：US14991800

申请日：2016-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： O-hyun Beak ,  Keon Kuk ,  Young-chul Ko ,  Woon-bae Kim

IPC: H01L23/552 ,  H04W4/50 ,  H01L23/29 ,  B05C5/00 ,  B05C5/02 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/67 ,  H01L23/48 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L25/10 ,  H01L21/56 ,  H01L25/065

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

公开(公告)号：US11607638B2

公开(公告)日：2023-03-21

申请号：US16630263

申请日：2018-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-woo Shin ,  Sang-hoon Lee ,  Young-chul Ko ,  Hyun-joo Kim

IPC: B01D46/00 ,  B01D46/52 ,  B01D39/20 ,  B01D46/58 ,  B01D46/62

Abstract: A filter assembly is provided. The filter assembly includes a plurality of filter modules each filled with activated carbon and continuously connected; and a frame to which the plurality of filter modules are fixed, wherein the plurality of filter modules are disposed at predetermined angles relative to each other.