Abstract:
A computer implemented method for determining performance of a semiconductor device is provided. The method includes providing training data comprising input state values and training capacitance values to a neural network executing on a computer system; processing the input state values through the neural network to generate modeled charge values; converting the modeled charge values to modeled capacitance values; determining, by the computer system, whether the training capacitance values of the training data are within a threshold value of the modeled capacitance values utilizing a loss function that omits the modeled charge values; and in response to determining that the training capacitance values of the training data are within the threshold value of the modeled capacitance values, converting, by the computer system, the neural network to a circuit simulation code to generate a converted neural network.
Abstract:
A system for reconstructing wafer maps of semiconductor wafers includes: a processor; and memory having instructions stored thereon that, when executed by the processor, cause the processor to: receive test data of a wafer at sparse sampling locations of the wafer, the sparse sampling locations being selected based on a probing mask; and compute a reconstructed wafer map by performing compressed sensing with Zernike polynomials on the test data at sparse locations of the wafer.
Abstract:
Tunnel field effect transistors include a semiconductor substrate; a source region in the semiconductor substrate; a drain region in the semiconductor substrate; a channel region in the semiconductor substrate between the source region and the drain region; and a gate electrode on the semiconductor substrate above the channel region. The source region comprises a first region having a first conductivity type, a third region having a second conductivity type that is different from the first conductivity type, and a second region having an intrinsic conductivity type that is between the first region and the third region.
Abstract:
Neural signal amplifiers include an operational amplifier and a feedback network coupled between an output and an input thereof. The feedback network includes a tunnel field effect transistor (“TFET”) pseudo resistor that exhibits bi-directional conductivity. A drain region of the TFET may be electrically connected to the gate electrode thereof to provide a bi-directional resistor having good symmetry in terms of resistance as a function of voltage polarity.
Abstract:
Proposed are a catalyst for decomposing perfluorocompounds (PFCs) and a method of preparing the same. The provided catalyst for decomposing PFCs and the method of preparing the same are as follows. Zinc as an active component for performance improvement and tungsten (W) as an auxiliary component are added to alumina selected from at least one of gamma alumina, aluminum trihydroxide, boehmite, and pseudo-boehmite, and a weight ratio of Al, Zn, and W is at 100:30 to 100:1 to 11. The catalyst for decomposing PFCs not only has an effect of having durability against fluorine generated by decomposition of PFCs but also has a synergistic effect of improving reaction activity. Furthermore, the catalyst decomposes PFCs at a lower temperature than conventional catalysts for decomposing PFCs. Thus, it is possible to reduce operating costs and secure the durability of the system during continuous operation.
Abstract:
An integrated waste gas treatment system includes an adsorption/desorption device that receives a waste gas that includes an organic compound and an organic nitrogen compound exhausted from a semiconductor manufacturing facility, where the adsorption/desorption device adsorbs the organic compound and the organic nitrogen compound and concentrates and desorbs the organic compound and the organic nitrogen compound, and a catalytic decomposition device disposed adjacent to the adsorption/desorption device, where the catalytic decomposition device includes a catalytic chamber that provides a gas passage through which a gas desorbed from the adsorption/desorption device flows and an oxidation-reduction catalyst disposed in the gas passage that removes the organic compound and the organic nitrogen compound from the desorbed gas. The organic compound and the organic nitrogen compound are subjected to an oxidation treatment by the oxidation-reduction catalyst, and nitrogen oxides generated by the oxidation treatment are removed by a selective reduction reaction.
Abstract:
A system for reconstructing wafer maps of semiconductor wafers includes: a processor; and memory having instructions stored thereon that, when executed by the processor, cause the processor to: receive test data of a wafer at sparse sampling locations of the wafer, the sparse sampling locations being selected based on a probing mask; and compute a reconstructed wafer map by performing compressed sensing with Zernike polynomials on the test data at sparse locations of the wafer.
Abstract:
Neural signal amplifiers include an operational amplifier and a feedback network coupled between an output and an input thereof. The feedback network includes a tunnel field effect transistor (“TFET”) pseudo resistor that exhibits bi-directional conductivity. A drain region of the TFET may be electrically connected to the gate electrode thereof to provide a bi-directional resistor having good symmetry in terms of resistance as a function of voltage polarity.
Abstract:
Various embodiments of the present disclosure relate to a package structure capable of allowing a shield used for noise attenuation to be used for other purposes, in an electronic device in which components are arranged at high density, and an operation method for preventing/reducing noise radiation or detecting in advance defects in a manufacturing process using the same. For this, an electronic device may include: a printed circuit board (PCB), and a package disposed on the printed circuit board. The package may include: a ground pad and at least one shield pad connected to the printed circuit board, a laminated structure comprising a plurality of laminated ground layers electrically connected to the ground pad by at least one via hole, at least one electronic component disposed on an uppermost surface of the plurality of laminated ground layers, a shield covering the at least one electronic component, wherein the at least one component is not exposed to the outside, and at least one switch device comprising a switch including a first terminal electrically connected to the shield through a first conductor wiring, a second terminal electrically connected to one of the plurality of ground layers through a second conductor wiring, and a third terminal electrically connected to the shield pad through a third conductor wiring and disposed on the uppermost surface and configured to selectively connect the first terminal to the second terminal or the third terminal wherein the shield is connected to one of the one ground layer or the shield pad.
Abstract:
A method for generating a model of a transistor includes: initializing hyper-parameters; training the neural network in accordance with the hyper-parameters and training data relating transistor input state values to transistor output state values to compute neural network parameters; determining whether the transistor output state values of the training data match an output of the neural network; porting the neural network to a circuit simulation code to generate a ported neural network; simulating a test circuit using the ported neural network to simulate behavior of a transistor of the test circuit to generate simulation output; determining whether a turnaround time of the generation of the simulation output is satisfactory; in response to determining that the turnaround time is unsatisfactory, re-training the neural network based on updated hyper-parameters; and in response to determining that the turnaround time is satisfactory, outputting the ported neural network as the model of the transistor.