SEMICONDUCTOR DEVICE
    1.
    发明申请

    公开(公告)号:US20200373402A1

    公开(公告)日:2020-11-26

    申请号:US16732520

    申请日:2020-01-02

    Abstract: A semiconductor device having a gate-all-around structure includes a first fin pattern and a second fin pattern separated by a first trench and extending in a first direction, a first nanosheet on the first fin pattern, a second nanosheet on the second fin pattern, a first fin liner extending along at least a portion of a sidewall and a bottom surface of the first trench, a first field insulation layer disposed on the first fin liner and filling a portion of the first trench, and a first gate structure overlapping an end portion of the first fin pattern and including a first gate spacer. A height from the bottom surface of the first trench to a lower surface of the first gate spacer is greater than a height from the bottom surface of the first trench to an upper surface of the first field insulation layer.

    SEMICONDUCTOR DEVICE
    4.
    发明申请

    公开(公告)号:US20220208967A1

    公开(公告)日:2022-06-30

    申请号:US17388225

    申请日:2021-07-29

    Abstract: A semiconductor device includes a substrate, an active pattern extending in a first direction on the substrate, first and second nanosheets stacked on the active pattern to be spaced apart from each other in a vertical direction, a gate electrode that extends in a second direction the active pattern, the gate electrode surrounding each of the first and second nanosheets, a source/drain region on at least one side of the gate electrode, and inner spacers between the gate electrode and the source/drain region, the inner spacers including a first inner spacer between the active pattern and the first nanosheet, and a second inner spacer between the first nanosheet and the second nanosheet, the second inner spacer having a first portion adjacent to the first nanosheet, and a second portion adjacent to the second nanosheet, the first portion being wider than the second portion.

    SEMICONDUCTOR DEVICE
    5.
    发明申请

    公开(公告)号:US20220231127A1

    公开(公告)日:2022-07-21

    申请号:US17715273

    申请日:2022-04-07

    Abstract: Provided is a semiconductor device comprising an active region on a substrate and including first and second sidewalls extending in a first direction and an epitaxial pattern on the active region, wherein the epitaxial pattern includes first and second epitaxial sidewalls extending from the first and second sidewalls, respectively, the first epitaxial sidewall includes a first epitaxial lower sidewall, a first epitaxial upper sidewall, and a first epitaxial connecting sidewall connecting the first epitaxial lower sidewall and the first epitaxial upper sidewall, the second epitaxial sidewall includes a second epitaxial lower sidewall, a second epitaxial upper sidewall, and a second epitaxial connecting sidewall connecting the second epitaxial lower sidewall and the second epitaxial upper sidewall, a distance between the first and second epitaxial upper sidewalls decreases away from the active region, and the first and second epitaxial lower sidewalls extend in parallel to a top surface of the substrate.

    SEMICONDUCTOR DEVICE
    6.
    发明申请

    公开(公告)号:US20210399108A1

    公开(公告)日:2021-12-23

    申请号:US17467660

    申请日:2021-09-07

    Abstract: A semiconductor device having a gate-all-around structure includes a first fin pattern and a second fin pattern separated by a first trench and extending in a first direction, a first nanosheet on the first fin pattern, a second nanosheet on the second fin pattern, a first fin liner extending along at least a portion of a sidewall and a bottom surface of the first trench, a first field insulation layer disposed on the first fin liner and filling a portion of the first trench, and a first gate structure overlapping an end portion of the first fin pattern and including a first gate spacer. A height from the bottom surface of the first trench to a lower surface of the first gate spacer is greater than a height from the bottom surface of the first trench to an upper surface of the first field insulation layer.

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