Semiconductor device
    2.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US09305921B2

    公开(公告)日:2016-04-05

    申请号:US14565903

    申请日:2014-12-10

    Abstract: A semiconductor device including: a first gate pattern disposed in a peripheral region of a substrate; a second gate pattern disposed in a cell region of the substrate; a first insulator formed on sidewalls of the first gate pattern; and a second insulator formed on sidewalls of the second gate pattern, wherein a dielectric constant of the first insulator is different from a dielectric constant of the second insulator, and wherein a height of the second insulator is greater than a height of the second gate pattern.

    Abstract translation: 一种半导体器件,包括:设置在衬底的周边区域中的第一栅极图案; 设置在所述基板的单元区域中的第二栅极图案; 形成在第一栅极图案的侧壁上的第一绝缘体; 以及形成在所述第二栅极图案的侧壁上的第二绝缘体,其中所述第一绝缘体的介电常数不同于所述第二绝缘体的介电常数,并且其中所述第二绝缘体的高度大于所述第二栅极图案的高度 。

    SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20150145056A1

    公开(公告)日:2015-05-28

    申请号:US14565903

    申请日:2014-12-10

    Abstract: A semiconductor device including: a first gate pattern disposed in a peripheral region of a substrate; a second gate pattern disposed in a cell region of the substrate; a first insulator formed on sidewalls of the first gate pattern; and a second insulator formed on sidewalls of the second gate pattern, wherein a dielectric constant of the first insulator is different from a dielectric constant of the second insulator, and wherein a height of the second insulator is greater than a height of the second gate pattern.

    Abstract translation: 一种半导体器件,包括:设置在衬底的周边区域中的第一栅极图案; 设置在所述基板的单元区域中的第二栅极图案; 形成在第一栅极图案的侧壁上的第一绝缘体; 以及形成在所述第二栅极图案的侧壁上的第二绝缘体,其中所述第一绝缘体的介电常数不同于所述第二绝缘体的介电常数,并且其中所述第二绝缘体的高度大于所述第二栅极图案的高度 。

    Methods of fabricating semiconductor devices

    公开(公告)号:US10522401B2

    公开(公告)日:2019-12-31

    申请号:US16237948

    申请日:2019-01-02

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

    Methods of fabricating semiconductor devices

    公开(公告)号:US10186457B2

    公开(公告)日:2019-01-22

    申请号:US15794107

    申请日:2017-10-26

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

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