公开(公告)号：US12062633B2

公开(公告)日：2024-08-13

申请号：US17551387

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joungphil Lee ,  Yeongseok Kim

IPC: H01L23/00 ,  C08K3/013 ,  C08K5/00 ,  C08L63/00 ,  H01L21/66 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L24/29 ,  C08K3/013 ,  C08K5/0041 ,  C08L63/00 ,  H01L22/30 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0652 ,  H01L2224/16147 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/27515 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33055 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06589 ,  H01L2924/16251 ,  H01L2924/182

Abstract: Provided is a semiconductor package including: at least one semiconductor device on a first substrate; a non-conductive film (NCF) on the at least one semiconductor device and comprising an irreversible thermochromic pigment; and a molding member on the at least one semiconductor device in a lateral direction, wherein a content of the irreversible thermochromic pigment in the NCF is about 0.1 wt % to about 5 wt % with respect to a weight of the NCF.

公开(公告)号：US10553546B2

公开(公告)日：2020-02-04

申请号：US16037226

申请日：2018-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil Lee ,  Yeongseok Kim

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/367

Abstract: Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.

公开(公告)号：US20180174979A1

公开(公告)日：2018-06-21

申请号：US15895411

申请日：2018-02-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/544 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/544 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

公开(公告)号：US12057425B2

公开(公告)日：2024-08-06

申请号：US17540519

申请日：2021-12-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunyeong Kim ,  Yeongseok Kim ,  Jihwan Hwang

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L24/17 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/95001 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/3511

Abstract: A semiconductor package including a base chip; a semiconductor chip having a lower surface on which connection pads are disposed, the semiconductor chip being mounted on an upper surface of the base chip; a plurality of bumps on the connection pads and electrically connecting the base chip to the semiconductor chip; an adhesive film between the base chip and the semiconductor chip and fixing the semiconductor chip to the base chip; and an encapsulant on the base chip and encapsulating the semiconductor chip, wherein the semiconductor chip includes a central portion spaced apart from the upper surface of the base chip by a first distance, and an edge portion spaced apart from the upper surface of the base chip by a second distance, the edge portion being outside of the central portion, and a ratio of the second distance to the first distance is about 0.8 to about 1.0.

公开(公告)号：US10147713B2

公开(公告)日：2018-12-04

申请号：US15889957

申请日：2018-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyein Yoo ,  Yeongseok Kim

IPC: H01L25/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L25/065 ,  H01L23/552

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor chips on a substrate in a stripped state, forming a mold layer to cover the semiconductor chips, cutting the mold layer and the substrate to form unit packages separated from each other, and forming a shielding layer on the mold layer of each of the unit packages, wherein each of the unit packages includes a corresponding one of the semiconductor chips, wherein the mold layer in each of the unit packages includes side surfaces, a top surface, and corner regions, and wherein each of the corner regions of the mold layer includes a first corner, which is connected to a corresponding one of the side surfaces and has a first curvature radius, and a second corner, which is connected to the top surface and has a second curvature radius smaller than the first curvature radius.

公开(公告)号：US20180226354A1

公开(公告)日：2018-08-09

申请号：US15942994

申请日：2018-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/544 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/544 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

公开(公告)号：US11355413B2

公开(公告)日：2022-06-07

申请号：US16540495

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil Lee ,  Myung-Sung Kang ,  Yeongseok Kim ,  Gwangsun Seo ,  Hyein Yoo ,  Yongwon Choi

IPC: C09J7/28 ,  C09J11/04 ,  H01L23/373 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/367

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US10211163B2

公开(公告)日：2019-02-19

申请号：US15895411

申请日：2018-02-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/544 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

公开(公告)号：US09418943B2

公开(公告)日：2016-08-16

申请号：US14739060

申请日：2015-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/52 ,  H01L23/544 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/544 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/564 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

Abstract translation: 提供一种包括标记膜的半导体封装及其制造方法，其中可以将包括热反应层的标记膜施加到成型层，以保护模制层下的半导体芯片并有效地执行标记处理。 因此可以减小成型层的厚度，从而减小半导体封装的整体厚度。 此外，可以防止半导体封装通过标记膜的翘曲，从而为半导体封装的表面提供光泽并自由地调节半导体封装的表面的颜色。

公开(公告)号：US20160079178A1

公开(公告)日：2016-03-17

申请号：US14739060

申请日：2015-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/544 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/544 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/564 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

Abstract translation: 提供一种包括标记膜的半导体封装及其制造方法，其中可以将包括热反应层的标记膜施加到成型层，以保护模制层下的半导体芯片并有效地执行标记处理。 因此可以减小成型层的厚度，从而减小半导体封装的整体厚度。 此外，可以防止半导体封装通过标记膜的翘曲，从而为半导体封装的表面提供光泽并自由地调节半导体封装的表面的颜色。