Methods of forming an image sensor
    3.
    发明授权
    Methods of forming an image sensor 有权
    形成图像传感器的方法

    公开(公告)号:US09553119B2

    公开(公告)日:2017-01-24

    申请号:US14849187

    申请日:2015-09-09

    Abstract: Methods of forming an image sensor are provided. A method of forming an image sensor includes forming a trench in a substrate to define a unit pixel region of the substrate. The method includes forming an in-situ-doped passivation layer on an exposed surface of the trench. The method includes forming a capping pattern on the in-situ-doped passivation layer, in the trench. The method includes forming a photoelectric conversion region in the unit pixel region. Moreover, the method includes forming a floating diffusion region in the unit pixel region.

    Abstract translation: 提供了形成图像传感器的方法。 形成图像传感器的方法包括在衬底中形成沟槽以限定衬底的单位像素区域。 该方法包括在沟槽的暴露表面上形成原位掺杂的钝化层。 该方法包括在沟槽中的原位掺杂钝化层上形成封盖图案。 该方法包括在单位像素区域中形成光电转换区域。 此外,该方法包括在单位像素区域中形成浮动扩散区域。

    METHODS OF FORMING AN IMAGE SENSOR
    4.
    发明申请
    METHODS OF FORMING AN IMAGE SENSOR 有权
    形成图像传感器的方法

    公开(公告)号:US20160079288A1

    公开(公告)日:2016-03-17

    申请号:US14849187

    申请日:2015-09-09

    Abstract: Methods of forming an image sensor are provided. A method of forming an image sensor includes forming a trench in a substrate to define a unit pixel region of the substrate. The method includes forming an in-situ-doped passivation layer on an exposed surface of the trench. The method includes forming a capping pattern on the in-situ-doped passivation layer, in the trench. The method includes forming a photoelectric conversion region in the unit pixel region. Moreover, the method includes forming a floating diffusion region in the unit pixel region.

    Abstract translation: 提供了形成图像传感器的方法。 形成图像传感器的方法包括在衬底中形成沟槽以限定衬底的单位像素区域。 该方法包括在沟槽的暴露表面上形成原位掺杂的钝化层。 该方法包括在沟槽中的原位掺杂钝化层上形成封盖图案。 该方法包括在单位像素区域中形成光电转换区域。 此外,该方法包括在单位像素区域中形成浮动扩散区域。

    METHODS OF THERMALLY TREATING A SEMICONDUCTOR WAFER
    5.
    发明申请
    METHODS OF THERMALLY TREATING A SEMICONDUCTOR WAFER 有权
    热处理半导体波形的方法

    公开(公告)号:US20130171744A1

    公开(公告)日:2013-07-04

    申请号:US13715099

    申请日:2012-12-14

    Abstract: A method of thermally treating a wafer includes loading a wafer into a process chamber having one or more regions of uniform temperature gradient and one or more regions of non-uniform temperature gradient. A defect is detected in the wafer. The wafer is aligned to position the defect within one of the one or more regions of uniform temperature gradient. A rapid thermal process is performed on the wafer in the process chamber while the defect is positioned within one of the one or more regions of uniform temperature gradient.

    Abstract translation: 一种热处理晶片的方法包括将晶片装载到具有一个或多个均匀温度梯度区域和一个或多个不均匀温度梯度区域的处理室中。 在晶片中检测到缺陷。 将晶片对准以将缺陷定位在均匀温度梯度的一个或多个区域之一内。 在处理室中的晶片上执行快速热处理,同时将缺陷定位在均匀温度梯度的一个或多个区域之一内。

    Display apparatus and method of manufacturing the same

    公开(公告)号:US11069753B2

    公开(公告)日:2021-07-20

    申请号:US16881444

    申请日:2020-05-22

    Abstract: A display apparatus includes a light-source substrate portion which generates light; and a color control portion to which the generated light from the light-source substrate portion is incident and at which color of the generated light is adjusted to define a color-converted light having a color different from that of the generated light. The color control portion includes: an exit surface through which the color-converted light exits the color control portion; a substrate including a plurality of concave portions defined therein, each of the concave portions extended along a direction from the light-source substrate portion to the exit surface of the color control portion; and a plurality of color conversion members respectively in the plurality of concave portions, the color conversion members each including a color-converting material which converts the color of the generated light to the color of the color-converted light.

    Display apparatus and method of manufacturing the same

    公开(公告)号:US10707275B2

    公开(公告)日:2020-07-07

    申请号:US16134014

    申请日:2018-09-18

    Abstract: A display apparatus includes a light-source substrate portion which generates light; and a color control portion to which the generated light from the light-source substrate portion is incident and at which color of the generated light is adjusted to define a color-converted light having a color different from that of the generated light. The color control portion includes: an exit surface through which the color-converted light exits the color control portion; a substrate including a plurality of concave portions defined therein, each of the concave portions extended along a direction from the light-source substrate portion to the exit surface of the color control portion; and a plurality of color conversion members respectively in the plurality of concave portions, the color conversion members each including a color-converting material which converts the color of the generated light to the color of the color-converted light.

    Semiconductor devices and methods of fabricating the same

    公开(公告)号:US10128376B2

    公开(公告)日:2018-11-13

    申请号:US15613955

    申请日:2017-06-05

    Abstract: Semiconductor devices and methods of forming the semiconductor devices are provided. The semiconductor devices may include a substrate, a device isolation layer that defines an active region, an active fin vertically protruding from the active region of the substrate and extending in a horizontal direction, a gate structure traversing the active fin, and a source/drain contact on the active fin on a side of the gate structure. The gate structure may include a gate pattern and a capping pattern on the gate pattern, and the capping pattern may have impurities doped therein. The capping pattern may include a first part and a second part between the first part and the gate pattern. The first and second parts may have impurity concentrations different from each other.

    Methods of thermally treating a semiconductor wafer
    10.
    发明授权
    Methods of thermally treating a semiconductor wafer 有权
    热处理半导体晶片的方法

    公开(公告)号:US08854614B2

    公开(公告)日:2014-10-07

    申请号:US13715099

    申请日:2012-12-14

    Abstract: A method of thermally treating a wafer includes loading a wafer into a process chamber having one or more regions of uniform temperature gradient and one or more regions of non-uniform temperature gradient. A defect is detected in the wafer. The wafer is aligned to position the defect within one of the one or more regions of uniform temperature gradient. A rapid thermal process is performed on the wafer in the process chamber while the defect is positioned within one of the one or more regions of uniform temperature gradient.

    Abstract translation: 一种热处理晶片的方法包括将晶片装载到具有一个或多个均匀温度梯度区域和一个或多个不均匀温度梯度区域的处理室中。 在晶片中检测到缺陷。 将晶片对准以将缺陷定位在均匀温度梯度的一个或多个区域之一内。 在处理室中的晶片上执行快速热处理,同时将缺陷定位在均匀温度梯度的一个或多个区域之一内。

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