公开(公告)号：US20150194756A1

公开(公告)日：2015-07-09

申请号：US14419415

申请日：2013-07-24

Applicant: Robert Bosch GmbH

Inventor： Friedhelm Guenter ,  Reiner Ramsayer ,  Andreas Fix ,  Michael Guyenot ,  Roumen Ratchev

IPC: H01R13/03 ,  H01R43/16

CPC classification number: H01R13/03 ,  H01R12/585 ,  H01R43/16

Abstract: The invention relates to a contact element (10) with a plug side (14) and a solder side (16) to be contacted with a circuit board or a carrier substrate. The contact element (10) is produced from an Al/Cu material composite (36), the Cu portion (42) of which forms the plug side (14) and the Al portion (44) of which forms the solder side (16) of the contact element (10).

Abstract translation: 本发明涉及具有插头侧（14）和与电路板或载体衬底接触的焊料侧（16）的接触元件（10）。 接触元件（10）由Al / Cu材料复合体（36）制成，其Cu部分（42）形成插塞侧（14），并且其中Al部分（44）形成焊料侧（16） 的接触元件（10）。

公开(公告)号：US09177934B2

公开(公告)日：2015-11-03

申请号：US14377895

申请日：2013-01-25

Applicant: Robert Bosch GmbH

Inventor： Christiane Frueh ,  Andreas Fix

IPC: H01L23/00

CPC classification number: H01L24/32 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/025 ,  B23K35/3006 ,  B23K2103/08 ,  B23K2103/56 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/26125 ,  H01L2224/26155 ,  H01L2224/27013 ,  H01L2224/2732 ,  H01L2224/29016 ,  H01L2224/29105 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/30515 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8392 ,  H01L2224/83948 ,  H01L2224/83951 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The connection arrangement (100, 200, 300, 400) comprises at least one electric and/or electronic component (1). The at least one electric and/or electronic component (10) has at least one connection face (11), which is connected in a bonded manner to a join partner (40) by means of a connection layer (20). The connection layer (20) can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer (30′) is arranged adjacent to the connection layer (20) in a bonded manner. The reinforcement layer (30′) has a higher modulus of elasticity than the connection layer (20). A particularly good protective effect is achieved if the reinforcement layer (30′) is formed in a frame-like manner by an outer and an inner boundary (36, 35) and, at least with the outer boundary (36) thereof, encloses the connection face (11) of the at least one electric and/or electronic component (10).

Abstract translation: 连接装置（100,200,300,400）包括至少一个电气和/或电子部件（1）。 所述至少一个电和/或电子部件（10）具有至少一个连接面（11），所述至少一个连接面（11）通过连接层（20）以接合方式连接到接合对象（40）。 连接层（20）可以例如是形成材料连接的粘合剂，焊接，焊接，烧结连接或连接连接伙伴的另一已知连接。 此外，加强层（30'）以接合的方式邻近连接层（20）布置。 加强层（30'）具有比连接层（20）更高的弹性模量。 如果加强层（30'）通过外边界和内边界（36,35）以框架状的方式形成，并且至少其外边界（36）包围 所述至少一个电和/或电子部件（10）的连接面（11）。

公开(公告)号：US20160064350A1

公开(公告)日：2016-03-03

申请号：US14834569

申请日：2015-08-25

Applicant: Robert Bosch GmbH

Inventor： Christiane Frueh ,  Andreas Fix

IPC: H01L23/00 ,  B23K35/30 ,  B23K35/02 ,  B23K1/00 ,  B23K1/19

CPC classification number: H01L24/32 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/025 ,  B23K35/3006 ,  B23K2103/08 ,  B23K2103/56 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/26125 ,  H01L2224/26155 ,  H01L2224/27013 ,  H01L2224/2732 ,  H01L2224/29016 ,  H01L2224/29076 ,  H01L2224/29105 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/30515 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8392 ,  H01L2224/83948 ,  H01L2224/83951 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A connection arrangement includes at least one electric and/or electronic component. The at least one electric and/or electronic component has at least one connection face, which is connected in a bonded manner to a join partner by means of a connection layer. The connection layer can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer is arranged adjacent to the connection layer in a bonded manner. The reinforcement layer has a higher modulus of elasticity than the connection layer. A particularly good protective effect is achieved if the reinforcement layer is formed in a frame-like manner by an outer and an inner boundary and, at least with the outer boundary thereof, encloses the connection face of the at least one electric and/or electronic component.

Abstract translation: 连接装置包括至少一个电和/或电子部件。 所述至少一个电气和/或电子部件具有至少一个连接面，所述至少一个连接面通过连接层以接合的方式连接到连接对象。 连接层可以例如是形成材料连接的粘合剂，焊接，焊接，烧结连接或连接连接伙伴的另一已知连接。 此外，加强层以接合的方式邻近连接层设置。 加强层具有比连接层更高的弹性模量。 如果加强层通过外边界和内边界以框架形式形成，并且至少其外边界包围至少一个电和/或电子的连接面，则获得了特别好的保护效果 零件。

公开(公告)号：US20150014865A1

公开(公告)日：2015-01-15

申请号：US14377895

申请日：2013-01-25

Applicant: Robert Bosch GmbH

Inventor： Christiane Frueh ,  Andreas Fix

IPC: H01L23/00

CPC classification number: H01L24/32 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/025 ,  B23K35/3006 ,  B23K2103/08 ,  B23K2103/56 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/26125 ,  H01L2224/26155 ,  H01L2224/27013 ,  H01L2224/2732 ,  H01L2224/29016 ,  H01L2224/29105 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/30515 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8392 ,  H01L2224/83948 ,  H01L2224/83951 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The connection arrangement (100, 200, 300, 400) comprises at least one electric and/or electronic component (1). The at least one electric and/or electronic component (10) has at least one connection face (11), which is connected in a bonded manner to a join partner (40) by means of a connection layer (20). The connection layer (20) can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer (30′) is arranged adjacent to the connection layer (20) in a bonded manner. The reinforcement layer (30′) has a higher modulus of elasticity than the connection layer (20). A particularly good protective effect is achieved if the reinforcement layer (30′) is formed in a frame-like manner by an outer and an inner boundary (36, 35) and, at least with the outer boundary (36) thereof, encloses the connection face (11) of the at least one electric and/or electronic component (10).

Abstract translation: 连接装置（100,200,300,400）包括至少一个电和/或电子部件（1）。 所述至少一个电和/或电子部件（10）具有至少一个连接面（11），所述至少一个连接面（11）通过连接层（20）以接合方式连接到接合对象（40）。 连接层（20）可以例如是形成材料连接的粘合剂，焊接，焊接，烧结连接或连接连接伙伴的另一已知连接。 此外，加强层（30'）以接合的方式邻近连接层（20）布置。 加强层（30'）具有比连接层（20）更高的弹性模量。 如果加强层（30'）通过外边界和内边界（36,35）以框架状的方式形成，并且至少其外边界（36）包围着，则实现特别好的保护效果 所述至少一个电和/或电子部件（10）的连接面（11）。

公开(公告)号：US20140234649A1

公开(公告)日：2014-08-21

申请号：US14348408

申请日：2012-09-21

Applicant: Robert Bosch GmbH

Inventor： Thomas Kalich ,  Frank Wetzl ,  Bernd Hohenberger ,  Rainer Holz ,  Christiane Frueh ,  Andreas Fix ,  Michael Guyenot ,  Andrea Feiock ,  Martin Rittner ,  Michael Guenther

IPC: B23K35/02 ,  B32B15/06 ,  B23K1/00 ,  B32B15/16

CPC classification number: B23K35/0238 ,  B23K1/0008 ,  B23K1/0016 ,  B32B15/06 ,  B32B15/16 ,  B32B2264/105 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/27505 ,  H01L2224/278 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29395 ,  H01L2224/32503 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3478 ,  H05K2203/0405 ,  H05K2203/1131 ,  Y10T428/12049 ,  Y10T428/12063 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01013 ,  H01L2924/01031 ,  H01L2924/0132 ,  H01L2924/00

Abstract: The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.

Abstract translation: 本发明涉及一种分层复合材料（10），特别是用于连接作为接合伙伴的电子部件，包括至少一个基底膜（11）和施加到基底膜上的层组件（12）。 层组件包括施加到基底膜（11）并且包含至少一种金属粉末的至少一个可烧结层（13）和施加到可烧结层（13）的焊料层（14）。 本发明还涉及一种用于形成层状复合材料的方法，包括根据本发明的层状复合材料（10）的电路组件，以及在电子部件的接合方法中使用层状复合材料（10）。

公开(公告)号：US09630379B2

公开(公告)日：2017-04-25

申请号：US14348747

申请日：2012-09-21

Applicant: Robert Bosch GmbH

Inventor： Thomas Kalich ,  Christiane Frueh ,  Franz Wetzl ,  Bernd Hohenberger ,  Rainer Holz ,  Andreas Fix ,  Michael Guyenot ,  Andrea Feiock ,  Michael Guenther ,  Martin Rittner

IPC: B22F7/00 ,  B32B15/01 ,  B23K1/00 ,  B23K35/30 ,  B23K35/02 ,  H01L23/00 ,  B23K1/19 ,  B23K101/42

CPC classification number: B32B15/01 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/30 ,  B23K2101/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8382 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/12063 ,  Y10T428/12222 ,  H01L2924/00

Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.

公开(公告)号：US20140248505A1

公开(公告)日：2014-09-04

申请号：US14348747

申请日：2012-09-21

Applicant: Robert Bosch GmbH

Inventor： Thomas Kalich ,  Christiane Frueh ,  Franz Wetzl ,  Bernd Hohenberger ,  Rainer Holz ,  Andreas Fix ,  Michael Guyenot ,  Andrea Feiock ,  Michael Guenther ,  Martin Rittner

IPC: B32B15/01 ,  B23K1/00

CPC classification number: B32B15/01 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/30 ,  B23K2101/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8382 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/12063 ,  Y10T428/12222 ,  H01L2924/00

Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.

Abstract translation: 包括至少一个电子基板（11）和由至少第一金属和/或第一金属合金的第一层（20）和第二金属合金构成的层（20,30）的布置的层压复合材料（10） 与第一层（20）相邻的第二金属和/或第二金属合金的层（30），其中第一和第二层的熔化温度不同，并且其中在层的布置（ 20,30），在第一层和第二层之间形成具有至少一个金属间相（40）的区域，其中第一层（20）或第二层（30）由反应焊料形成，反应焊料由 碱性焊料与AgX，CuX或NiX合金的混合物，其中AgX，CuX或NiX合金的组分X选自B，Mg，Al，Si，Ca，Se，Ti，V， Cr，Mn，Fe，Co，Ni，Cu，Zn，Ga，Ge，Y，Zr，Nb，Mo，Ag，In，Sn，Sb，Ba，Hf，Ta，W，Au，Bi，La，Ce， Pr，Nd，Gd，Dy，Sm，Er，Tb，Eu，Ho，Tm，Yb等 Lu，其中AgX，CuX或NiX合金的熔融温度大于碱性焊料的熔融温度。 本发明还涉及层压复合材料（10）的形成方法和包含根据本发明的叠层复合材料（10）的电路装置。