公开(公告)号：US5587620A

公开(公告)日：1996-12-24

申请号：US171227

申请日：1993-12-21

申请人： Richard C. Ruby ,  Paul P. Merchant

发明人： Richard C. Ruby ,  Paul P. Merchant

IPC分类号： H03H3/04 ,  H03H9/02 ,  H03H9/17 ,  H03H9/58 ,  H01L41/08

CPC分类号： H03H9/174 ,  H03H3/04 ,  H03H9/02133 ,  H03H9/02236 ,  H03H9/583 ,  H03H9/588 ,  H03H2009/02181 ,  Y10T29/42

摘要： An acoustical resonator comprising top and bottom electrodes that sandwich a PZ layer. The resonance frequency of the acoustical resonator may be adjusted after fabrication by utilizing heating elements included in the acoustical resonator and/or by adjusting the thickness of a tuning layer. In the preferred embodiment of the present invention, the electrodes comprise Mo layers. One embodiment of the present invention is constructed on a Si.sub.3 N.sub.4 membrane. A second embodiment of the present invention is constructed such that it is suspended over a substrate on metallic columns. In the preferred embodiment of the present invention, the electrodes are deposited by a method that minimizes the stress in the electrodes.

摘要翻译： 包括夹着PZ层的顶部和底部电极的声学谐振器。 可以通过利用声谐振器中包含的加热元件和/或通过调节调谐层的厚度来调整声学谐振器的共振频率。 在本发明的优选实施例中，电极包括Mo层。 本发明的一个实施方案构造在Si 3 N 4膜上。 本发明的第二实施例构造成使得其悬挂在金属柱上的基板上。 在本发明的优选实施例中，通过使电极中的应力最小化的方法来沉积电极。

公开(公告)号：US06930368B2

公开(公告)日：2005-08-16

申请号：US10630769

申请日：2003-07-31

申请人： Peter G. Hartwell ,  Storrs T. Hoen ,  David Horsley ,  Chung Ching Yang ,  Paul P. Merchant ,  Carl P. Taussig

发明人： Peter G. Hartwell ,  Storrs T. Hoen ,  David Horsley ,  Chung Ching Yang ,  Paul P. Merchant ,  Carl P. Taussig

IPC分类号： G01P15/125 ,  B81B3/00 ,  B81B5/00 ,  B81B7/00 ,  B81B7/02 ,  H01L29/82 ,  H01L33/00

CPC分类号： B81B7/0041 ,  B81B2201/0235 ,  B81C2201/019 ,  B81C2203/019 ,  G01P2015/082

摘要： A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.

公开(公告)号：US06647171B1

公开(公告)日：2003-11-11

申请号：US09728474

申请日：2000-12-01

申请人： Xiaodong R. Fu ,  David W. Lambert ,  Paul P. Merchant

发明人： Xiaodong R. Fu ,  David W. Lambert ,  Paul P. Merchant

IPC分类号： G02B626

CPC分类号： G02B6/3518 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/357 ,  G02B6/358 ,  G02B6/3584 ,  G02B6/3596

摘要： A micro-electro-mechanical system (MEMS) optical switch actuator and method for fabricating the actuator provide an anchor assembly that functions as a second electrode. The actuator has a reflective element assembly and a first electrode assembly for moving the reflective element assembly from a first position to a second position based on a switching signal. The actuator further includes an anchor assembly coupled to the reflective element assembly such that a spring force is generated in the reflective element assembly when the reflective element assembly is in the second position. The anchor assembly is electrically conductive such that the switching signal generates an electrostatic force between the anchor assembly and the first electrode assembly. The method for fabricating the actuator includes the step of coupling a multi-level reflection assembly to an optical circuit. The reflection assembly has an electrically conductive anchor assembly positioned at a first level with respect to the optical circuit and a mirror positioned at a second level with respect to the optical circuit. An insulative mirror beam layer is then coupled to the reflection assembly, and an electrode assembly is coupled to the mirror beam layer. The electrode assembly is coupled such that a voltage potential between the anchor assembly and the electrode assembly causes the electrode assembly to force the mirror beam layer and the mirror from the first switching position to the second switching position.

摘要翻译： 微机电系统（MEMS）光开关致动器和用于制造致动器的方法提供用作第二电极的锚组件。 致动器具有反射元件组件和用于基于切换信号将反射元件组件从第一位置移动到第二位置的第一电极组件。 致动器还包括联接到反射元件组件的锚组件，使得当反射元件组件处于第二位置时，在反射元件组件中产生弹簧力。 锚固组件是导电的，使得切换信号在锚固组件和第一电极组件之间产生静电力。 制造致动器的方法包括将多层反射组件耦合到光电路的步骤。 反射组件具有相对于光电路定位在第一电平的导电锚固组件和相对于光电路定位在第二电平的反射镜。 然后将绝缘镜光束层耦合到反射组件，并且电极组件耦合到镜面光束层。 电极组件被联接成使得锚固组件和电极组件之间的电压电位使得电极组件将镜射束层和反射镜从第一切换位置强制到第二切换位置。

公开(公告)号：US6090687A

公开(公告)日：2000-07-18

申请号：US124311

申请日：1998-07-29

申请人： Paul P. Merchant ,  Storrs Hoen

发明人： Paul P. Merchant ,  Storrs Hoen

IPC分类号： H01L25/18 ,  H01L21/50 ,  H01L23/02 ,  H01L23/10 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L21/30

CPC分类号： H01L21/50 ,  H01L23/10 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079

摘要： A palladium contact and a gasket are formed on a first wafer. The gasket and contact are simultaneously engaged with a silicon layer of a second wafer. The wafers are then heated to a temperature that both forms a bond between the palladium contact of the first wafer with the silicon layer of the second wafer and that fuses the gasket to the second wafer. Therefore, when the temperature is decreased, the palladium-silicon bond maintains the alignment of the two wafers with respect to one another, and the gasket hardens to form seal around a periphery of the two wafers. By placing the two wafers in a vacuum environment prior to engaging the two wafers, the space encompassed by the gasket and the two wafers forms a sealed vacuum during the heating process. Therefore, the heating process not only forms a palladium-silicon bond between the two wafers, but it also forms a vacuum seal around selected components included within either of the two wafers.

摘要翻译： 在第一晶片上形成钯触点和垫圈。 垫圈和接触件同时与第二晶片的硅层接合。 然后将晶片加热到两者都形成第一晶片的钯接触与第二晶片的硅层之间的接合并且将衬垫熔合到第二晶片的温度。 因此，当温度降低时，钯 - 硅键保持两个晶片相对于彼此的对准，并且衬垫硬化以在两个晶片的周边周围形成密封。 通过在接合两个晶片之前将两个晶片置于真空环境中，垫圈和两个晶片所包围的空间在加热过程中形成密封真空。 因此，加热过程不仅在两个晶片之间形成钯 - 硅键，而且还在包括在两个晶片之一内的所选组件周围形成真空密封。

公开(公告)号：US6118181A

公开(公告)日：2000-09-12

申请号：US124099

申请日：1998-07-29

申请人： Paul P. Merchant ,  Storrs Hoen

发明人： Paul P. Merchant ,  Storrs Hoen

IPC分类号： H01L21/20 ,  H01L21/762 ,  H01L21/30

CPC分类号： H01L21/2026 ,  H01L21/76251

摘要： Two wafers are bonded together through an annealing process that maintains temperatures at CMOS compatible levels (i.e., below 500 degrees Celsius). A layer of palladium (Pd) is formed on a first wafer. Preferably an adhesion layer of chromium (Cr) attaches the palladium layer to the first wafer. The palladium layer is engaged with silicon (Si) from a second wafer, and the engaged wafers are annealed to form a palladium-silicide (PdSi) bond between the palladium layer of the first wafer and the silicon of the second wafer. In addition to bonding the first wafer to the second wafer, the palladium-silicon bond may be used to form an electrical connection between the two wafers so that circuits on both wafers may communicate to one another through the palladium-silicon bond.

摘要翻译： 通过退火工艺将两个晶片结合在一起，该退火工艺将温度保持在CMOS兼容水平（即低于500摄氏度）。 在第一晶片上形成钯（Pd）层。 优选地，铬（Cr）的粘合层将钯层附着到第一晶片。 钯层与第二晶片的硅（Si）接合，并且接合的晶片被退火以在第一晶片的钯层和第二晶片的硅之间形成钯 - 硅化物（PdSi）键。 除了将第一晶片接合到第二晶片之外，钯 - 硅键可以用于在两个晶片之间形成电连接，使得两个晶片上的电路可以通过钯 - 硅键彼此连通。

公开(公告)号：US5969736A

公开(公告)日：1999-10-19

申请号：US116427

申请日：1998-07-14

申请人： Leslie A. Field ,  Phillip Barth ,  David J. Waller ,  George D. Zuras, Jr. ,  Paul P. Merchant ,  Storrs Hoen ,  Channing R. Robertson

发明人： Leslie A. Field ,  Phillip Barth ,  David J. Waller ,  George D. Zuras, Jr. ,  Paul P. Merchant ,  Storrs Hoen ,  Channing R. Robertson

IPC分类号： B41J2/055 ,  B41J2/175

CPC分类号： B41J2/17556 ,  B41J2/055 ,  B41J2202/05

摘要： A pressure regulator that sets the pressure of a liquid to a predetermined pressure differential below a reference pressure, such as atmospheric pressure. The pressure regulator comprises a liquid delivery channel and a capillary array. The liquid delivery channel includes a liquid input and a liquid output. The liquid flows through the liquid delivery channel from the liquid input to the liquid output. The capillary array is composed of ones of an elongate capillary. The capillary includes a first end in fluid communication with the liquid delivery channel and a second end in pressure communication with a source of the reference pressure. The liquid flows through the first end into the capillary to form a liquid surface in the capillary. The second end is remote from the first end. The capillary has cross-sectional dimensions in relation to the surface tension of the liquid and the angle of contact between the liquid and the capillary such that the pressure drop across the liquid surface in the capillary is equal to the predetermined pressure differential.

摘要翻译： 一种压力调节器，其将液体的压力设定为低于参考压力（例如大气压）的预定压差。 压力调节器包括液体输送通道和毛细管阵列。 液体输送通道包括液体输入和液体输出。 液体通过液体输送通道从液体输入流到液体输出。 毛细管阵列由细长毛细管组成。 毛细管包括与液体输送通道流体连通的第一端和与参考压力的源压力连通的第二端。 液体通过第一端流入毛细管，以在毛细管中形成液体表面。 第二端远离第一端。 毛细管具有与液体的表面张力和液体和毛细管之间的接触角相关的横截面尺寸，使得毛细管中的液体表面上的压降等于预定的压力差。

公开(公告)号：US06735008B2

公开(公告)日：2004-05-11

申请号：US09919325

申请日：2001-07-31

申请人： Christopher P. Brophy ,  Xiaodong R. Fu ,  David W. Lambert ,  Paul P. Merchant

发明人： Christopher P. Brophy ,  Xiaodong R. Fu ,  David W. Lambert ,  Paul P. Merchant

IPC分类号： G02B2600

CPC分类号： G02B26/0841 ,  B81B3/0051 ,  B81B2201/042 ,  B81B2203/058 ,  B81C1/00174 ,  B81C1/00214 ,  B81C2201/0132 ,  B81C2203/036

摘要： A moveable micromirror includes a supporting structure, a flexible post extending from the supporting structure, and a table extending radially from the end of the post along a plane generally perpendicular to the post, the table having a reflective surface facing away from the supporting structure. The post, preferably formed of single-crystal silicon, is dimensioned to be sufficiently flexible to allow the reflective surface to be selectively moveable and positionable, with at least two degrees of freedom, when urged by a suitable actuating force. A method of making an array of moveable micromirrors of this type includes deep etching a silicon substrate so as to form posts surrounded by trenches, etching back the surface of the substrate around the posts so as to allow the posts to protrude beyond the surface of the substrate, and affixing a table with a reflective surface thereon to the tops of a plurality of the posts.

摘要翻译： 可移动微镜包括支撑结构，从支撑结构延伸的柔性柱，以及从柱的端部沿着大致垂直于柱的平面径向延伸的台，该台具有背离支撑结构的反射表面。 优选地由单晶硅形成的柱的尺寸被设计成足够柔性，以允许反射表面在被合适的致动力推动时具有至少两个自由度选择性地可移动和定位。 制造这种类型的可移动微镜阵列的方法包括深刻蚀硅衬底，以便形成由沟槽包围的柱状物，在柱周围蚀刻衬底的表面以允许柱突出超过表面 衬底，并将其上具有反射表面的桌子固定到多个柱的顶部。

公开(公告)号：US06411589B1

公开(公告)日：2002-06-25

申请号：US09126004

申请日：1998-07-29

申请人： Storrs Hoen ,  Paul P. Merchant ,  Carl P. Taussig

发明人： Storrs Hoen ,  Paul P. Merchant ,  Carl P. Taussig

IPC分类号： G11B900

CPC分类号： B82Y10/00 ,  G11B9/14 ,  G11B9/1418 ,  G11B19/00 ,  G11B19/20 ,  G11B33/1446

摘要： Data storage media are integrated into a microfabricated data storage system. Each data storage medium is located on one surface of a movable support. Flexures connected to the movable support allow the medium to move within a plane so that data can be stored at different locations on the medium, but significantly resist any out of the plane motion of the medium. Therefore, tips or other devices for writing or reading to or from the medium can be placed a small distance from the medium, thereby facilitating microfabrication of the data storage system. First electrodes are coupled to a second surface of the movable support opposite the medium. Second electrodes are located opposite the first electrodes to form an electrostatic surface actuator. Electric fields generated by the second electrodes interact with an electric field generated by the first electrodes to apply a force to the first electrodes and, hence, the movable support and the medium. After forming the media on a microfabricated wafer, the wafer can be bonded to another microfabricated wafer, and the resulting structure can thereby be sealed by a gasket to seal the media within the data storage system. Preferably the bonding process to join the microfabricated wafers is CMOS (complementary metal-oxide semiconductor) compatible by using elements such as palladium and silicon that bond at relatively low temperatures.

摘要翻译： 数据存储介质被集成到微型数据存储系统中。 每个数据存储介质位于可移动支撑件的一个表面上。 连接到可移动支撑件的挠曲允许介质在平面内移动，使得数据可以存储在介质上的不同位置，但是显着抵抗介质的平面运动之外的任何一种。 因此，用于向介质进行写入或读取的提示或其他设备可以距离介质放置一小段距离，从而便于数据存储系统的微细加工。 第一电极耦合到可移动支撑件与介质相对的第二表面。 第二电极与第一电极相对设置，以形成静电表面致动器。 由第二电极产生的电场与由第一电极产生的电场相互作用，以对第一电极以及因此的可移动支撑件和介质施加力。 在微制造的晶片上形成介质之后，晶片可以结合到另一个微细晶片，并且所得到的结构因此可以被垫圈密封，以密封数据存储系统内的介质。 优选地，结合微加工晶片的接合工艺是通过使用在较低温度下结合的元素如钯和硅来兼容的CMOS（互补金属氧化物半导体）。

公开(公告)号：US5882532A

公开(公告)日：1999-03-16

申请号：US656624

申请日：1996-05-31

申请人： Leslie A. Field ,  Paul P. Merchant

发明人： Leslie A. Field ,  Paul P. Merchant

IPC分类号： B81B3/00 ,  B81C1/00 ,  B81C99/00 ,  H01L21/00

CPC分类号： B81C99/008

摘要： A thin micromechanical device is fabricated in a way that is mechanically compatible with wafer handling for conventional-thickness wafers. A removable bonding layer bonds a fabrication wafer to a substantially conventional-thickness handle wafer to form a bonded wafer pair. The micromechanical device is formed in the fabrication wafer by subjecting the bonded wafer pair to processing including wafer handling for conventional-thickness wafers. The micromechanical device is formed to include part of the fabrication wafer. Finally, the bonding layer underlying the micromechanical device is removed to release the micromechanical device from the handle wafer.

摘要翻译： 以与常规厚度晶片的晶片处理机械相容的方式制造薄的微机械器件。 可移除的粘合层将制造晶片结合到基本上常规的厚度的处理晶片上以形成键合晶片对。 微机电器件通过使接合晶片对经受包括常规厚度晶片的晶片处理的处理而形成在制造晶片中。 微机械装置形成为包括制造晶片的一部分。 最后，去除微机械装置下面的粘合层，以从处理晶片释放微机械装置。