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公开(公告)号：US20210175636A1
公开(公告)日：2021-06-10
申请号：US16704405
申请日：2019-12-05
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Donald William KIDWELL, JR. , Ravindra Vaman SHENOY , Mohammad Ali TASSOUDJI , Jeremy Darren DUNWORTH , Vladimir Aparin , Yu-Chin OU , Seong Heon JEONG
Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.
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公开(公告)号：US20190267713A1
公开(公告)日：2019-08-29
申请号：US15903065
申请日：2018-02-23
Applicant: QUALCOMM Incorporated
Inventor： Seong Heon JEONG , Mohammad Ali TASSOUDJI
Abstract: A multi-layer laminate antenna includes: a feed line configured to convey electricity; a radiator coupled to the feed line, comprising metal disposed in a first layer of the antenna, and having an edge of a length to radiate energy at a radiating frequency; and dummy metal disposed in a second layer of the antenna that is different from the first layer of the antenna; where a first portion of the dummy metal is configured such that any linear edge of the first portion of the dummy metal disposed outside an area of the second layer overlapped by the radiator is less than half of a radiating wavelength corresponding to the radiating frequency.
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公开(公告)号：US20190103653A1
公开(公告)日：2019-04-04
申请号：US16145100
申请日：2018-09-27
Applicant: QUALCOMM Incorporated
Inventor： Seong Heon JEONG , Rajneesh KUMAR , Mohammad Ali TASSOUDJI , Darryl JESSIE , Gurkanwal SAHOTA , Kevin Hsi Huai WANG , Jeong KIM, II , Taesik YANG , Thomas MYERS , Neil BURNS , Julio ZEGARRA , Clinton James WILBER , Jordan SZABO
Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
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Patent Agency Ranking
公开(公告)号：US20180054090A1
公开(公告)日：2018-02-22
申请号：US15241394
申请日：2016-08-19
Applicant: QUALCOMM Incorporated
Inventor： William Henry VON NOVAK, III , Linda Stacey IRISH , Cody Burton WHEELAND , Seong Heon JEONG
Abstract: Certain aspects of the present disclosure relate to methods and apparatus for controlling a power level of wireless power transfer. Certain aspects provide a wireless power receiver. The wireless power receiver includes an antenna and a rectifier. The rectifier includes a first diode and a second diode. The wireless power receiver further includes a resistor in parallel with the first diode. A first terminal of the resistor is coupled to a first terminal of the first diode. A second terminal of the resistor is coupled to a second terminal of the first diode.
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公开(公告)号：US20220166127A1
公开(公告)日：2022-05-26
申请号：US17666549
申请日：2022-02-07
Applicant: QUALCOMM Incorporated
Inventor： Seong Heon JEONG , Rajneesh KUMAR , Mohammad Ali TASSOUDJI , Darryl JESSIE , Gurkanwal SAHOTA , Kevin Hsi Huai WANG , Jeong IL KIM , Taesik YANG , Thomas MYERS , Neil BURNS , Julio ZEGARRA , Clinton James WILBER , Jordan SZABO
IPC: H01Q1/22 , H01L25/065 , H01Q1/24 , H01L23/28 , H01L23/552 , H01L23/64 , H01L23/66 , H01Q1/52
Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
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公开(公告)号：US20180337546A1
公开(公告)日：2018-11-22
申请号：US15597944
申请日：2017-05-17
Applicant: QUALCOMM Incorporated
Inventor： William Henry VON NOVAK, III , Mark WHITE, II , Seong Heon JEONG
CPC classification number: H02J7/025 , A61N1/3787 , H01F38/14 , H02J50/12 , H02J50/80 , H02J2007/0096
Abstract: Certain aspects of the present disclosure are generally directed to apparatus and techniques for wireless charging. One example apparatus generally includes a plurality of inductive elements and signal generation circuitry coupled to the plurality of inductive elements and configured to generate a plurality of signals, where at least two signals of the plurality of signals have different magnitudes. In certain aspects, the signal generation circuitry is configured to drive the plurality of inductive elements using the plurality of signals, where at least one first inductive element of the plurality of inductive elements is driven using at least one first signal of the plurality of signals having a first phase and at least one second inductive element of the plurality of inductive elements is driven using at least one second signal of the plurality of signals having a second phase different from the first phase.
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公开(公告)号：US20200006846A1
公开(公告)日：2020-01-02
申请号：US16022851
申请日：2018-06-29
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Seong Heon JEONG , Ravindra Vaman SHENOY , Jeremy Darren DUNWORTH , Mohammad Ali TASSOUDJI
Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.
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公开(公告)号：US20190067221A1
公开(公告)日：2019-02-28
申请号：US15839831
申请日：2017-12-12
Applicant: QUALCOMM Incorporated
Inventor： Jon Bradley LASITER , Ravindra Vaman SHENOY , Donald William KIDWELL, JR. , Mohammad Ali TASSOUDJI , Vladimir APARIN , Seong Heon JEONG , Jeremy DUNWORTH , Alireza MOHAMMADIAN , Mario Francisco VELEZ , Chin-Kwan KIM
IPC: H01L23/66 , H01L23/00 , H01L23/498 , H01L23/552 , H01L23/31 , H01L21/50 , H01Q1/22 , H01Q1/24
Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.
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