公开(公告)号：US20220166127A1

公开(公告)日：2022-05-26

申请号：US17666549

申请日：2022-02-07

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon JEONG ,  Rajneesh KUMAR ,  Mohammad Ali TASSOUDJI ,  Darryl JESSIE ,  Gurkanwal SAHOTA ,  Kevin Hsi Huai WANG ,  Jeong IL KIM ,  Taesik YANG ,  Thomas MYERS ,  Neil BURNS ,  Julio ZEGARRA ,  Clinton James WILBER ,  Jordan SZABO

IPC: H01Q1/22 ,  H01L25/065 ,  H01Q1/24 ,  H01L23/28 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/52

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

公开(公告)号：US20180331714A1

公开(公告)日：2018-11-15

申请号：US15976711

申请日：2018-05-10

Applicant: QUALCOMM Incorporated

Inventor： Andrew Puayhoe SEE ,  David MALDONADO ,  Gurkanwal SAHOTA

IPC: H04B1/44 ,  H04B7/06 ,  H04B7/08 ,  H01Q5/50 ,  H04B1/00

CPC classification number: H04B1/44 ,  H01Q5/50 ,  H04B1/0057 ,  H04B1/006 ,  H04B1/0064 ,  H04B1/0067 ,  H04B1/525 ,  H04B1/58 ,  H04B7/0602 ,  H04B7/0693 ,  H04B7/0814 ,  H04B7/0877

Abstract: A method includes: controllably configuring at least one antenna diversity switch in a wireless device to establish conductive paths between at least one transceiver of the wireless device and multiple antennas each disposed at a respective one of a multiple areas of a housing of the wireless device; and routing signals between the at least one transceiver and the multiple antennas, via the at least one antenna diversity switch, such that a signal is routed to either of at least two of the multiple antennas disposed at a first end area of the multiple areas of the housing of the wireless device or to either of at least two other antennas disposed at a second end area of the multiple areas of the housing of the wireless device.

公开(公告)号：US20190103653A1

公开(公告)日：2019-04-04

申请号：US16145100

申请日：2018-09-27

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon JEONG ,  Rajneesh KUMAR ,  Mohammad Ali TASSOUDJI ,  Darryl JESSIE ,  Gurkanwal SAHOTA ,  Kevin Hsi Huai WANG ,  Jeong KIM, II ,  Taesik YANG ,  Thomas MYERS ,  Neil BURNS ,  Julio ZEGARRA ,  Clinton James WILBER ,  Jordan SZABO

IPC: H01Q1/22 ,  H01Q1/52 ,  H01L23/552 ,  H01L23/66 ,  H01L23/64 ,  H01L23/28

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.