公开(公告)号：US20180123532A1

公开(公告)日：2018-05-03

申请号：US15421282

申请日：2017-01-31

Applicant: QUALCOMM Incorporated

Inventor： Jeremy GOLDBLATT ,  Darryl JESSIE

IPC: H03F1/56 ,  H03F3/21 ,  H03F3/193

CPC classification number: H03F1/56 ,  H03F1/223 ,  H03F3/193 ,  H03F3/245 ,  H03F3/505 ,  H03F2200/222 ,  H03F2200/318 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/534 ,  H03F2200/69

Abstract: A power amplification device includes a power amplifier core stage and a power amplifier driver stage. The power amplifier driver stage receives a radio frequency signal to be amplified by the power amplification device. The power amplifier driver stage includes a first source follower input transistor and a first current source transistor. A source of the first source follower input transistor is coupled to a drain of the first current source transistor. The source of the first source follower input transistor is directly coupled to the power amplifier core stage to drive the power amplifier core stage. An input match and passive voltage gain device is coupled to the power amplifier driver stage to generate a voltage gain at an input of the power amplifier driver stage. A first bias source is configured to generate a first bias signal to bias the power amplifier driver stage.

公开(公告)号：US20220166127A1

公开(公告)日：2022-05-26

申请号：US17666549

申请日：2022-02-07

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon JEONG ,  Rajneesh KUMAR ,  Mohammad Ali TASSOUDJI ,  Darryl JESSIE ,  Gurkanwal SAHOTA ,  Kevin Hsi Huai WANG ,  Jeong IL KIM ,  Taesik YANG ,  Thomas MYERS ,  Neil BURNS ,  Julio ZEGARRA ,  Clinton James WILBER ,  Jordan SZABO

IPC: H01Q1/22 ,  H01L25/065 ,  H01Q1/24 ,  H01L23/28 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/52

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

公开(公告)号：US20160125995A1

公开(公告)日：2016-05-05

申请号：US14530068

申请日：2014-10-31

Applicant: QUALCOMM INCORPORATED

Inventor： Miena ARMANIOUS ,  Darryl JESSIE ,  Thomas Andrew MYERS

IPC: H01F19/00 ,  H01F17/00

CPC classification number: H01F19/00 ,  H01F17/0006 ,  H01F27/2804 ,  H01F2017/0073 ,  H01F2019/085 ,  H01F2027/2809 ,  H01F2027/2819

Abstract: An apparatus configured to isolate a direct current component voltage of a first circuit from a direct current component voltage of a second circuit in which the apparatus includes a first conductor and a second conductor. The first conductor has a first portion disposed to substantially enclose a first area, a second portion disposed within the first area, a third portion disposed to substantially enclose a second area, and a fourth portion disposed within the second area, the second area lacking an intersection with the first area. The second conductor is configured to be magnetically coupled to the first conductor and has a fifth portion disposed between the first portion and the second portion and a sixth portion disposed between the third portion and the fourth portion.

Abstract translation: 一种被配置为将第一电路的直流分量电压与其中所述装置包括第一导体和第二导体的第二电路的直流分量电压隔离的装置。 第一导体具有设置成基本上包围第一区域的第一部分，设置在第一区域内的第二部分，设置成基本上封闭第二区域的第三部分和设置在第二区域内的第四部分， 与第一区交叉。 第二导体被配置为磁耦合到第一导体，并且具有设置在第一部分和第二部分之间的第五部分和设置在第三部分和第四部分之间的第六部分。

公开(公告)号：US20190103653A1

公开(公告)日：2019-04-04

申请号：US16145100

申请日：2018-09-27

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon JEONG ,  Rajneesh KUMAR ,  Mohammad Ali TASSOUDJI ,  Darryl JESSIE ,  Gurkanwal SAHOTA ,  Kevin Hsi Huai WANG ,  Jeong KIM, II ,  Taesik YANG ,  Thomas MYERS ,  Neil BURNS ,  Julio ZEGARRA ,  Clinton James WILBER ,  Jordan SZABO

IPC: H01Q1/22 ,  H01Q1/52 ,  H01L23/552 ,  H01L23/66 ,  H01L23/64 ,  H01L23/28

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

公开(公告)号：US20160164158A1

公开(公告)日：2016-06-09

申请号：US14559503

申请日：2014-12-03

Applicant: QUALCOMM Incorporated

Inventor： Darryl JESSIE ,  Lan NAN

IPC: H01P3/02 ,  H01P11/00 ,  H01L23/528 ,  H01L23/66 ,  H01L21/768 ,  H01P3/08 ,  H01L23/00

CPC classification number: H01P3/006 ,  H01L21/768 ,  H01L23/5225 ,  H01L23/525 ,  H01L23/528 ,  H01L23/66 ,  H01L24/11 ,  H01L24/14 ,  H01L2223/6605 ,  H01L2223/6627 ,  H01P3/003 ,  H05K1/0219 ,  H05K2201/0305 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.

Abstract translation: 在使用晶片级封装（WLP）容纳射频（RF）电路或部件的集成电路封装中，RF信号传输结构包括位于接地导线之间的信号承载导线，以避免信号之间的不期望的耦合 - 同一封装中的导线和其他RF电路或组件。