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公开(公告)号:US20190103653A1
公开(公告)日:2019-04-04
申请号:US16145100
申请日:2018-09-27
Applicant: QUALCOMM Incorporated
Inventor: Seong Heon JEONG , Rajneesh KUMAR , Mohammad Ali TASSOUDJI , Darryl JESSIE , Gurkanwal SAHOTA , Kevin Hsi Huai WANG , Jeong KIM, II , Taesik YANG , Thomas MYERS , Neil BURNS , Julio ZEGARRA , Clinton James WILBER , Jordan SZABO
Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
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公开(公告)号:US20240022008A1
公开(公告)日:2024-01-18
申请号:US18174470
申请日:2023-02-24
Applicant: QUALCOMM Incorporated
Inventor: Julio ZEGARRA , Peter LIEN , Sang-June PARK , Darryl Sheldon JESSIE , Alberto CICALINI , Sean OAK , Neil BURNS
Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.
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公开(公告)号:US20220166127A1
公开(公告)日:2022-05-26
申请号:US17666549
申请日:2022-02-07
Applicant: QUALCOMM Incorporated
Inventor: Seong Heon JEONG , Rajneesh KUMAR , Mohammad Ali TASSOUDJI , Darryl JESSIE , Gurkanwal SAHOTA , Kevin Hsi Huai WANG , Jeong IL KIM , Taesik YANG , Thomas MYERS , Neil BURNS , Julio ZEGARRA , Clinton James WILBER , Jordan SZABO
IPC: H01Q1/22 , H01L25/065 , H01Q1/24 , H01L23/28 , H01L23/552 , H01L23/64 , H01L23/66 , H01Q1/52
Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
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公开(公告)号:US20210119350A1
公开(公告)日:2021-04-22
申请号:US16825615
申请日:2020-03-20
Applicant: QUALCOMM Incorporated
Inventor: Julio ZEGARRA , Peter LIEN , Sang-June PARK , Darryl Sheldon JESSIE , Alberto CICALINI , Sean OAK , Neil BURNS
Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.
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公开(公告)号:US20190260127A1
公开(公告)日:2019-08-22
申请号:US16276957
申请日:2019-02-15
Applicant: QUALCOMM Incorporated
Inventor: Guining SHI , Young Jun SONG , Allen Minh-Triet TRAN , Mohammad Ali TASSOUDJI , Elizabeth WYRWICH , Julio ZEGARRA , Clinton James WILBER , Neil BURNS , Jorge FABREGA SANCHEZ
Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.
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