公开(公告)号：US20240022008A1

公开(公告)日：2024-01-18

申请号：US18174470

申请日：2023-02-24

Applicant: QUALCOMM Incorporated

Inventor： Julio ZEGARRA ,  Peter LIEN ,  Sang-June PARK ,  Darryl Sheldon JESSIE ,  Alberto CICALINI ,  Sean OAK ,  Neil BURNS

IPC: H01Q23/00 ,  H01Q1/52 ,  H01Q1/48 ,  H05K1/18

CPC classification number: H01Q23/00 ,  H01Q1/526 ,  H01Q1/48 ,  H05K1/189

Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US20210175152A1

公开(公告)日：2021-06-10

申请号：US16704789

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi ZHANG ,  Rajneesh KUMAR ,  Li-Sheng WENG ,  Darryl Sheldon JESSIE ,  Suhyung HWANG ,  Jeahyeong HAN ,  Xiaoming CHEN ,  Jaehyun YEON

IPC: H01L23/48 ,  H01L23/31 ,  H01L21/67 ,  H01L21/56

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

公开(公告)号：US20250079716A1

公开(公告)日：2025-03-06

申请号：US18460480

申请日：2023-09-01

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Sang-June PARK ,  Sanjaya Kumar KHATUA ,  Darryl Sheldon JESSIE ,  Rajneesh KUMAR

IPC: H01Q13/10 ,  H01Q1/38 ,  H01Q21/06

Abstract: A package comprising a substrate, an integrated device coupled to a first surface of the substrate through at least a first plurality of solder interconnects; and an antenna device coupled to a second surface of the substrate through at least a second plurality of solder interconnects. The antenna device comprises an antenna device dielectric layer; at least one antenna located on a first surface of the antenna device dielectric layer; a shield located on at least one lateral surface of the antenna device; and a slot opening on the first surface of the antenna device.

公开(公告)号：US20210226340A1

公开(公告)日：2021-07-22

申请号：US16748707

申请日：2020-01-21

Applicant: QUALCOMM Incorporated

Inventor： Darryl Sheldon JESSIE ,  Mina ISKANDER ,  Avantika SODHI

IPC: H01Q21/00 ,  H01Q19/02

Abstract: A transmission line network is provided that includes a slow-wave transmission line to couple a first terminal to a first antenna. The transmission line network also includes a conventional transmission line to couple a second terminal to a second antenna.

公开(公告)号：US20210091017A1

公开(公告)日：2021-03-25

申请号：US16870642

申请日：2020-05-08

Applicant: QUALCOMM Incorporated

Inventor： Jaehyun YEON ,  Suhyung HWANG ,  Chin-Kwan KIM ,  Rajneesh KUMAR ,  Darryl Sheldon JESSIE

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q5/307 ,  H01Q9/16

Abstract: A package comprising a substrate, a first antenna device, and an integrated device. The substrate comprising a first surface and a second surface, where the substrate comprises a plurality of interconnects. The first antenna device is coupled to the first surface of the substrate, through a first plurality of solder interconnects. The integrated device is coupled to the second surface of the substrate. The package may include an encapsulation layer located over the second surface of the substrate, where the encapsulation layer encapsulates the integrated device. The package may include a shield formed over a surface of the encapsulation layer, where the shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US20240396205A1

公开(公告)日：2024-11-28

申请号：US18321879

申请日：2023-05-23

Applicant: QUALCOMM Incorporated

Inventor： Jorge FABREGA SANCHEZ ,  Chinmaya MISHRA ,  Darryl Sheldon JESSIE ,  Bhushan Shanti ASURI ,  Allen Minh-Triet TRAN ,  Mohammad Ali TASSOUDJI ,  Jeongil Jay KIM ,  Gurkanwal Singh SAHOTA ,  Kevin Hsi-Huai WANG

IPC: H01Q1/24 ,  H01Q5/307 ,  H01Q9/04 ,  H01Q21/08

Abstract: A method of transducing signals includes: transducing first signals, of frequencies above at least 24 GHz, between first wireless signals and first guided signals, using a plurality of first antenna elements comprising at least one first substrate and at least one ground conductor; and transducing second signals, of frequencies within at least a portion of a frequency range between 8 GHz and 24 GHz, between second wireless signals and second guided signals, using at least one second antenna element each comprising a transducer disposed on a second substrate that at least partially overlaps an active component set and the at least one first substrate, or disposed on at least one of the at least one first substrate, the active component set being configured to provide signals for wireless transmission, or configured to process wirelessly-received signals, or a combination thereof.

公开(公告)号：US20240106124A1

公开(公告)日：2024-03-28

申请号：US17951924

申请日：2022-09-23

Applicant: QUALCOMM Incorporated

Inventor： Mahmoud NIROO JAZI ,  Mohammad Ali TASSOUDJI ,  Taesik YANG ,  Jeongil Jay KIM ,  Darryl Sheldon JESSIE ,  Kevin Hsi-Huai WANG ,  Jorge FABREGA SANCHEZ ,  Hong-Ming LEE

IPC: H01Q9/04 ,  H01Q9/16

CPC classification number: H01Q9/0407 ,  H01Q9/16 ,  H01Q1/243

Abstract: An antenna system includes: a patch antenna element disposed at a first level of the antenna system; an energy coupler configured and coupled to the patch antenna element to transfer energy between the patch antenna element and a front-end circuit; a ground conductor disposed at a second level of the antenna system, the patch antenna element and the ground conductor being disposed a separation distance away from each other and bounding respective sides of a volume defined by a projection, normal to a surface of the patch antenna element, of the patch antenna element to the ground conductor; and a floating conductor that is displaced from the ground conductor and the patch antenna element, the floating conductor comprising a body extending over a portion of the separation distance outside of, and in close proximity to, the volume.

公开(公告)号：US20220192006A1

公开(公告)日：2022-06-16

申请号：US17122820

申请日：2020-12-15

Applicant: QUALCOMM Incorporated

Inventor： Xiaoming CHEN ,  Darryl Sheldon JESSIE

IPC: H05K1/02 ,  H05K1/11

Abstract: Certain aspects of the present disclosure generally relate to a circuit board with ground vias offset from associated ground bumps. One example circuit board generally includes a first signal connection terminal configured to connect a signal line of the circuit board to an integrated circuit (IC); a ground plane having a first ground connection terminal disposed adjacent to the first signal connection terminal, the first ground connection terminal being configured to provide a ground connection between the ground plane and the IC; and a first ground via associated with and disposed adjacent to the first ground connection terminal and coupled to the ground plane, wherein, from an overhead view of the circuit board, the first ground via is located at a position that is offset from a first axis on which the first signal connection terminal and the first ground connection terminal are disposed.

公开(公告)号：US20230155273A1

公开(公告)日：2023-05-18

申请号：US17981176

申请日：2022-11-04

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Rajneesh KUMAR ,  Suhyung HWANG ,  Jaehyun YEON ,  Mohammad Ali TASSOUDJI ,  Darryl Sheldon JESSIE ,  Ameya GALINDE

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/36 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01Q1/2283 ,  H01L21/565 ,  H01L23/66 ,  H01L23/552 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01Q1/36 ,  H01Q1/526 ,  H05K1/185 ,  H05K9/0081 ,  H01L21/4857

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US20220190485A1

公开(公告)日：2022-06-16

申请号：US17119638

申请日：2020-12-11

Applicant: QUALCOMM Incorporated

Inventor： Taesik YANG ,  Mohammad Ali TASSOUDJI ,  Jeongil Jay KIM ,  Darryl Sheldon JESSIE ,  Kevin Hsi-Huai WANG

IPC: H01Q21/06 ,  H01Q5/307 ,  H01Q1/48 ,  H01Q19/10 ,  H01Q1/24

Abstract: Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.