公开(公告)号：US09135976B2

公开(公告)日：2015-09-15

申请号：US14104443

申请日：2013-12-12

Applicant: QUALCOMM Incorporated

Inventor： Wenqing Wu ,  Kendrick Hoy Leong Yuen ,  Xiaochun Zhu ,  Seung Hyuk Kang ,  Matthew Michael Nowak ,  Jeffrey Alexander Levin ,  Robert P. Gilmore ,  Nicholas Ka Ming Yu

IPC: G11C11/00 ,  G11C11/16 ,  G11C11/56 ,  G11C11/54

CPC classification number: G11C11/1675 ,  G11C11/16 ,  G11C11/161 ,  G11C11/1659 ,  G11C11/1673 ,  G11C11/54 ,  G11C11/5607

Abstract: A probabilistic programming current is injected into a cluster of bi-stable probabilistic switching elements, the probabilistic programming current having parameters set to result in a less than unity probability of any given bi-stable switching element switching, and a resistance of the cluster of bi-stable switching elements is detected. The probabilistic programming current is injected and the resistance of the cluster state detected until a termination condition is met. Optionally the termination condition is detecting the resistance of the cluster of bi-stable switching elements at a value representing a multi-bit data.

Abstract translation: 将概率编程电流注入到双稳定概率开关元件簇中，概率编程电流具有设置为导致任何给定双稳态开关元件切换的小于一概率的参数，以及bi的簇的电阻 - 检测到稳定的开关元件。 注入概率编程电流，并检测到簇状态的电阻，直到满足终止条件。 可选地，终止条件是以表示多位数据的值检测双稳态开关元件群的电阻。

公开(公告)号：US09318405B2

公开(公告)日：2016-04-19

申请号：US14702276

申请日：2015-05-01

Applicant: QUALCOMM Incorporated

Inventor： Jianwen Xu ,  Lizabeth Ann Keser ,  William Stone ,  Steve Joseph Bezuk ,  Nicholas Ka Ming Yu

IPC: H01L23/12 ,  H01L21/00 ,  H01L23/31 ,  H01L23/528 ,  H01L23/532 ,  H01L23/498 ,  H01L21/78 ,  H01L23/28 ,  H01L21/56

CPC classification number: H01L23/3114 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/525 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5329 ,  H01L29/0657 ,  H01L2224/11

Abstract: A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer. The molding compound may eliminate sidewall chipping and cracking as well as reduce the need for back side lamination.

Abstract translation: 晶片级封装器件可以包括封装衬底，衬底的后端和衬底上的线层前端的模制化合物以及再分配层的钝化层，而不在钝化层上封装金属层。 模塑料可以消除侧壁碎裂和破裂，并且减少对背面层压的需要。

公开(公告)号：US20140098602A1

公开(公告)日：2014-04-10

申请号：US14104443

申请日：2013-12-12

Applicant: QUALCOMM Incorporated

Inventor： Wenqing Wu ,  Kendrick Hoy Leong Yuen ,  Xiaochun Zhu ,  Seung Hyuk Kang ,  Matthew Michael Nowak ,  Jeffrey Alexander Levin ,  Robert P. Gilmore ,  Nicholas Ka Ming Yu

IPC: G11C11/16

CPC classification number: G11C11/1675 ,  G11C11/16 ,  G11C11/161 ,  G11C11/1659 ,  G11C11/1673 ,  G11C11/54 ,  G11C11/5607

Abstract: A probabilistic programming current is injected into a cluster of bi-stable probabilistic switching elements, the probabilistic programming current having parameters set to result in a less than unity probability of any given bi-stable switching element switching, and a resistance of the cluster of bi-stable switching elements is detected. The probabilistic programming current is injected and the resistance of the cluster state detected until a termination condition is met. Optionally the termination condition is detecting the resistance of the cluster of bi-stable switching elements at a value representing a multi-bit data.

Abstract translation: 将概率编程电流注入到双稳定概率开关元件簇中，概率编程电流具有设置为导致任何给定双稳态开关元件切换的小于一概率的参数，以及bi的簇的电阻 - 检测到稳定的开关元件。 注入概率编程电流，并检测到簇状态的电阻，直到满足终止条件。 可选地，终止条件是以表示多位数据的值检测双稳态开关元件群的电阻。