公开(公告)号：US09111848B1

公开(公告)日：2015-08-18

申请号：US14272324

申请日：2014-05-07

Applicant: QUALCOMM Incorporated

Inventor： Kenneth Dubowski ,  Thomas Clark Bryan ,  Mark Wayland

IPC: H01L23/58 ,  H01L21/66 ,  H01L27/118 ,  G01R31/28 ,  G01R31/3185

CPC classification number: H01L22/20 ,  G01R31/2884 ,  G01R31/31701 ,  G01R31/31724 ,  G01R31/318541 ,  G01R31/318547 ,  G01R31/318555 ,  H01L27/11807

Abstract: A control circuit generates data signals and configuration commands that are provided to an interface circuit. The interface circuit includes a configuration circuit that generates configuration signals according to the configuration commands and a drive component that generates interface signals according to the data signals. The interface signals are generated with a drive characteristic determined according to the configuration signals applied to configuration devices that selectively activate a configuration of drive devices. A diagnostic circuit is coupled to the control circuit and the interface circuit and is configured to receive a test state indication and acquire a corresponding portion of the configuration signals. The diagnostic circuit compares the test state indication and the portion of the configuration signals to diagnose a stuck-at fault condition within a faulty configuration circuit and propagate a fault indication to the control circuit.

Abstract translation: 控制电路产生提供给接口电路的数据信号和配置命令。 接口电路包括根据配置命令产生配置信号的配置电路和根据数据信号产生接口信号的驱动组件。 通过根据施加到选择性地激活驱动装置的配置的配置装置的配置信号确定的驱动特性来生成接口信号。 诊断电路耦合到控制电路和接口电路，并且被配置为接收测试状态指示并获取配置信号的相应部分。 诊断电路比较测试状态指示和配置信号的部分，以诊断故障配置电路内的故障状态，并将故障指示传播到控制电路。

公开(公告)号：US20180233907A1

公开(公告)日：2018-08-16

申请号：US15434285

申请日：2017-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Kenneth Dubowski ,  Luverne Ray Peterson ,  Thomas Bryan ,  Stephen Knol ,  Sreeker Dundigal ,  Alvin Loke

IPC: H02H9/04 ,  H01L23/00 ,  H01L27/02 ,  H01L23/485 ,  H01L23/50 ,  H01L25/065

Abstract: A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.

公开(公告)号：US10424921B2

公开(公告)日：2019-09-24

申请号：US15434285

申请日：2017-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Kenneth Dubowski ,  Luverne Ray Peterson ,  Thomas Bryan ,  Stephen Knol ,  Sreeker Dundigal ,  Alvin Loke

IPC: H02H9/04 ,  H01L23/00 ,  H01L27/02 ,  H01L23/485 ,  H01L23/50 ,  H01L25/065 ,  H03K19/0175

Abstract: A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.

公开(公告)号：US09767889B1

公开(公告)日：2017-09-19

申请号：US15433814

申请日：2017-02-15

Applicant: QUALCOMM Incorporated

Inventor： Scott Powers ,  Thomas Bryan ,  Andrew Tohmc ,  Subrahmanya Pradeep Morusupalli ,  Tin Tin Wee ,  Kenneth Dubowski

IPC: G11C11/40 ,  G11C11/4096 ,  G11C11/408 ,  G11C11/4094 ,  H01L25/18 ,  H01L25/065 ,  H01L23/66 ,  H03H7/38

CPC classification number: G11C11/4096 ,  G11C7/1084 ,  G11C11/4093 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H03K19/00346 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A die is provided having an unterminated endpoint that capacitively loads its input impedance with a capacitance from capacitor while acting as a receiving endpoint and that isolates its output impedance from the capacitance while acting as a transmitting endpoint.