公开(公告)号：US09350339B2

公开(公告)日：2016-05-24

申请号：US14335681

申请日：2014-07-18

Applicant: QUALCOMM Incorporated

Inventor： Thomas Clark Bryan ,  Alvin Leng Sun Loke ,  Stephen Knol ,  Gregory Francis Lynch ,  Tin Tin Wee ,  LuVerne Ray Peterson ,  Yue Li

IPC: H03K3/00 ,  H03K5/15 ,  H01L23/538 ,  G06F1/10 ,  G11C7/22 ,  H01L25/065

CPC classification number: H03K5/15013 ,  G06F1/10 ,  G11C7/22 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/15311

Abstract: Circuits for die-to-die clock distribution are provided. A system includes a transmit clock tree on a first die and a receive clock tree on a second die. The transmit clock tree and the receive clock tree are the same, or very nearly the same, so that the insertion delay for a given bit on the transmit clock tree is the same as an insertion delay for a bit corresponding to the given bit on the receive clock tree. While there may be clock skew from bit-to-bit within the same clock tree, corresponding bits on the different die experience the same clock insertion delays.

Abstract translation: 提供了芯片到芯片时钟分配的电路。 系统包括第一管芯上的传输时钟树和第二管芯上的接收时钟树。 发送时钟树和接收时钟树是相同的或非常接近相同的，所以发送时钟树上的给定位的插入延迟与对应于给定位的位的插入延迟相同 接收时钟树。 虽然在同一个时钟树中可能存在从位到位的时钟偏差，但是不同芯片上的相应位具有相同的时钟插入延迟。

公开(公告)号：US09654090B2

公开(公告)日：2017-05-16

申请号：US15138142

申请日：2016-04-25

Applicant: QUALCOMM Incorporated

Inventor： Thomas Clark Bryan ,  Alvin Leng Sun Loke ,  Stephen Knol ,  Gregory Francis Lynch ,  Tin Tin Wee ,  LuVerne Ray Peterson ,  Yue Li

IPC: H03K3/00 ,  H03K5/15 ,  H01L23/538 ,  G06F1/10 ,  G11C7/22 ,  H01L25/065

CPC classification number: H03K5/15013 ,  G06F1/10 ,  G11C7/22 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/15311

Abstract: Circuits for die-to-die clock distribution are provided. A system includes a transmit clock tree on a first die and a receive clock tree on a second die. The transmit clock tree and the receive clock tree are the same, or very nearly the same, so that the insertion delay for a given bit on the transmit clock tree is the same as an insertion delay for a bit corresponding to the given bit on the receive clock tree. While there may be clock skew from bit-to-bit within the same clock tree, corresponding bits on the different die experience the same clock insertion delays.

公开(公告)号：US20160308519A1

公开(公告)日：2016-10-20

申请号：US15138142

申请日：2016-04-25

Applicant: QUALCOMM Incorporated

Inventor： Thomas Clark Bryan ,  Alvin Leng Sun Loke ,  Stephen Knol ,  Gregory Francis Lynch ,  Tin Tin Wee ,  LuVerne Ray Peterson ,  Yue Li

IPC: H03K5/15 ,  H01L23/538 ,  H01L25/065

CPC classification number: H03K5/15013 ,  G06F1/10 ,  G11C7/22 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/15311

Abstract: Circuits for die-to-die clock distribution are provided. A system includes a transmit clock tree on a first die and a receive clock tree on a second die. The transmit clock tree and the receive clock tree are the same, or very nearly the same, so that the insertion delay for a given bit on the transmit clock tree is the same as an insertion delay for a bit corresponding to the given bit on the receive clock tree. While there may be clock skew from bit-to-bit within the same clock tree, corresponding bits on the different die experience the same clock insertion delays.

公开(公告)号：US10424921B2

公开(公告)日：2019-09-24

申请号：US15434285

申请日：2017-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Kenneth Dubowski ,  Luverne Ray Peterson ,  Thomas Bryan ,  Stephen Knol ,  Sreeker Dundigal ,  Alvin Loke

IPC: H02H9/04 ,  H01L23/00 ,  H01L27/02 ,  H01L23/485 ,  H01L23/50 ,  H01L25/065 ,  H03K19/0175

Abstract: A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.

公开(公告)号：US20150042401A1

公开(公告)日：2015-02-12

申请号：US13962742

申请日：2013-08-08

Applicant: QUALCOMM INCORPORATED

Inventor： Stephen Knol ,  Michael Brunolli ,  Chiew-Guan Tan ,  Damen Redelings

IPC: G05F3/24

CPC classification number: H03K17/04123 ,  H03K2217/0054

Abstract: An input receiver includes a first pass transistor coupled between an input pad and an internal receiver node. The first pass transistor includes a controlled floating gate capacitively coupled to the input pad. A source follower transistor couples between the internal receiver node and a power supply. A gate for the source follower transistor couples to the input pad.

Abstract translation: 输入接收机包括耦合在输入焊盘和内部接收器节点之间的第一传输晶体管。 第一传输晶体管包括电容耦合到输入焊盘的受控浮动栅极。 源极跟随器晶体管耦合在内部接收器节点和电源之间。 源极跟随器晶体管的栅极耦合到输入焊盘。

公开(公告)号：US20180233907A1

公开(公告)日：2018-08-16

申请号：US15434285

申请日：2017-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Kenneth Dubowski ,  Luverne Ray Peterson ,  Thomas Bryan ,  Stephen Knol ,  Sreeker Dundigal ,  Alvin Loke

IPC: H02H9/04 ,  H01L23/00 ,  H01L27/02 ,  H01L23/485 ,  H01L23/50 ,  H01L25/065

Abstract: A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.

公开(公告)号：US20160020759A1

公开(公告)日：2016-01-21

申请号：US14335681

申请日：2014-07-18

Applicant: QUALCOMM Incorporated

Inventor： Thomas Clark Bryan ,  Alvin Leng Sun Loke ,  Stephen Knol ,  Gregory Francis Lynch ,  Tin Tin Wee ,  LuVerne Ray Peterson ,  Yue Li

IPC: H03K5/15 ,  H01L23/538

CPC classification number: H03K5/15013 ,  G06F1/10 ,  G11C7/22 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/15311

Abstract: Circuits for die-to-die clock distribution are provided. A system includes a transmit clock tree on a first die and a receive clock tree on a second die. The transmit clock tree and the receive clock tree are the same, or very nearly the same, so that the insertion delay for a given bit on the transmit clock tree is the same as an insertion delay for a bit corresponding to the given bit on the receive clock tree. While there may be clock skew from bit-to-bit within the same clock tree, corresponding bits on the different die experience the same clock insertion delays.

Abstract translation: 提供了芯片到芯片时钟分配的电路。 系统包括第一管芯上的传输时钟树和第二管芯上的接收时钟树。 发送时钟树和接收时钟树是相同的或非常接近相同的，所以发送时钟树上的给定位的插入延迟与对应于给定位的位的插入延迟相同 接收时钟树。 虽然在同一个时钟树中可能存在从位到位的时钟偏差，但是不同芯片上的相应位具有相同的时钟插入延迟。