公开(公告)号：US10424921B2

公开(公告)日：2019-09-24

申请号：US15434285

申请日：2017-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Kenneth Dubowski ,  Luverne Ray Peterson ,  Thomas Bryan ,  Stephen Knol ,  Sreeker Dundigal ,  Alvin Loke

IPC: H02H9/04 ,  H01L23/00 ,  H01L27/02 ,  H01L23/485 ,  H01L23/50 ,  H01L25/065 ,  H03K19/0175

Abstract: A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.

公开(公告)号：US20180233907A1

公开(公告)日：2018-08-16

申请号：US15434285

申请日：2017-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Kenneth Dubowski ,  Luverne Ray Peterson ,  Thomas Bryan ,  Stephen Knol ,  Sreeker Dundigal ,  Alvin Loke

IPC: H02H9/04 ,  H01L23/00 ,  H01L27/02 ,  H01L23/485 ,  H01L23/50 ,  H01L25/065

Abstract: A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.