Abstract:
A memory is provided in which a scan chain covers the redundancy logic for column redundancy as well as the redundancy multiplexers in each column. The redundancy logic includes a plurality of redundancy logic circuits arranged in series. Each redundancy logic circuit corresponds to a respective column in the memory. Each column is configured to route a shift-in signal through its redundancy multiplexers during a scan mode of operation.
Abstract:
In an embodiment, an error detection and correction apparatus includes a positive edge triggered flip-flop that receives syndrome input based on a syndrome output a syndrome generator indicating whether or not input data includes an error, whereby the positive edge triggered flip-flop further provides a syndrome output to an error location decoder.
Abstract:
An enhanced multi chip package (eMCP) is provided including a unified memory controller. The UMC is configured to manage different types of memory, such as NAND flash memory and DRAM on the eMCP. The UMC provides storage memory management, DRAM management, DRAM accessibility for storage memory management, and storage memory accessibility for DRAM management. The UMC also facilitates direct data copying from DRAM to storage memory and vice versa. The direct copying may be initiated by the UMC without interaction from a host, or may be initiated by a host.
Abstract:
A method of sensing a data value stored at a memory cell according to a dual mode sensing scheme includes determining, at a sensing circuit, whether a resistance of a magnetic tunnel junction (MTJ) element is within a first range of resistance values, within a second range of resistance values, or within a third range of resistance values. The MTJ element is included in the memory cell. The method also includes determining the data value stored at the memory cell according to a first mode of operation if the resistance of the MTJ element is within the first range of resistance values or within the third range of resistance values. The method further includes determining the data value stored at the memory cell according to a second mode of operation if the resistance of the MTJ element is within the second range of resistance values.
Abstract:
Aspects of the disclosure involve memory data scrubber circuits configured to perform memory data scrubbing operations in a processor-based memory to provide data error correction in response to periodic memory controller wake-up periods. Memory data scrubbing is performed to correct errors in data words stored in memory. Memory data scrubbing is initiated in the memory to conserve power in response to periodic memory controller wake-up periods during processor idle periods. Further, in certain aspects disclosed herein, the memory data scrubber circuit is provided as a separate system outside of the memory controller in the memory system. In this manner, power consumption can be further reduced, because the memory data scrubber circuit can continue with memory data scrubbing operations in the memory independent of the memory controller operation, and after the memory controller access commands issued during the wake-up period are completed and the memory controller is powered-down.
Abstract:
Aspects of adjusting resistive memory write driver strength based on a mimic resistive memory write operation are disclosed. In one aspect, a write driver adjustment circuit is provided to adjust a write current provided by a write driver to a resistive memory for write operations. The write driver adjustment circuit includes a mimic write driver configured to provide a mimic write current that mimics the write current provided to the resistive memory. The mimic write current is applied to a mimic resistive memory that contains mimic resistive memory elements that mimic a resistance distribution of the resistive memory. When the mimic write current is applied, a mimic voltage is generated across the mimic resistive memory elements. The write driver adjustment circuit is configured to adjust the write current based on the mimic voltage so that the write current is sufficient for write operations, but low enough to reduce breakdown.
Abstract:
Systems and methods relate to providing a constant sensing current for reading a resistive memory element. A load voltage generator provides a load voltage based on a current mirror configured to supply a constant current that is invariant with process-voltage-temperature variations. A data voltage is generated based on the generated load voltage, by passing a sensing current mirrored from the constant current, through the resistive memory element. A reference voltage is generated, also based on the generated load voltage and by passing reference current mirrored from the constant current, through reference cells. A logical value stored in the resistive memory element is determined based on a comparison of the data voltage and the reference voltage, where the determination is free from effects of process-voltage-temperature variations.
Abstract:
A system and method of refreshing dynamic random access memory (DRAM) are disclosed. A device includes a DRAM, a bus, and a system-on-chip (SOC) coupled via the bus to the DRAM. The SOC is configured to refresh the DRAM at a particular refresh rate based on a temperature of the DRAM and based on calibration data determined based on one or more calibration tests performed while the SOC is coupled to the DRAM.
Abstract:
A memory has a plurality of non-volatile resistive (NVR) memory arrays, each with an associated reference voltage generating circuit coupled by a reference circuit coupling link to a reference line, the reference coupled to a sense amplifier for that NVR memory array. Reference line coupling links couple the reference lines of different NVR memory arrays. Optionally, different ones of the reference coupling links are removed or opened, obtaining respective different average and isolated reference voltages on the different reference lines. Optionally, different ones of the reference circuit coupling links are removed or opened, obtaining respective different averaged voltages on the reference lines, and uncoupling and isolating different reference circuits.
Abstract:
Aspects disclosed in the detailed description include write driver circuits for resistive random access memory (RAM) arrays. In one aspect, a write driver circuit is provided to facilitate writing data into a resistive RAM array in a memory system. The write driver circuit is coupled to a selector circuit configured to select a memory bitcell(s) in the resistive RAM array for a write operation. An isolation circuit is provided in the write driver circuit to couple a current source to the selector circuit to provide a write voltage during the write operation and to isolate the current source from the selector circuit when the selector circuit is not engaged in the write operation. By isolating the selector circuit from the current source when the selector circuit is on standby, it is possible to reduce leakage current in the selector circuit, thus reducing standby power consumption in the memory system.