Abstract:
A sigma delta modulator (350) can be utilized in the Digital-to-Analog (DAC) portion (144) of a modem (120) to achieve a desired level of gain programming. A set of step coefficients (GP2, GP4) are utilized to determined the step size and thereby the overall gain of the modulator (350). A feedback path is provided and configured to deliver the output of the modulator to a gain control block (355) which provides control and stability across the entire transmission bandwidth. A multilevel digital output (320) is provided which represents levels of signal in the digital domain and reduces the number of discrete components required to achieve a particular amount of gain.
Abstract:
A sigma delta modulator (350) can be utilized in the Digital-to-Analog (DAC) portion (144) of a modem (120) to achieve a desired level of gain programming. A set of step coefficients (GP2, GP4) are utilized to determined the step size and thereby the overall gain of the modulator (350). A feedback path is provided and configured to deliver the output of the modulator to a gain control block (355) which provides control and stability across the entire transmission bandwidth. A multilevel digital output (320) is provided which represents levels of signal in the digital domain and reduces the number of discrete components required to achieve a particular amount of gain.
Abstract:
High voltage silicon carbide (SiC) devices, for example, thyristors, are provided. A first SiC layer having a first conductivity type is provided on a first surface of a voltage blocking SiC substrate having a second conductivity type. A first region of SiC is provided on the first SiC layer and has the second conductivity type. A second region of SiC is provided in the first SiC layer, has the first conductivity type and is adjacent to the first region of SiC. A second SiC layer having the first conductivity type is provided on a second surface of the voltage blocking SiC substrate. A third region of SiC is provided on the second SiC layer and has the second conductivity type. A fourth region of SiC is provided in the second SiC layer, has the first conductivity type and is adjacent to the third region of SiC. First and second contacts are provided on the first and third regions of SiC, respectively. Related methods of fabricating high voltage SiC devices are also provided.
Abstract:
Silicon carbide high voltage semiconductor devices and methods of fabricating such devices are provided. The devices include a voltage blocking substrate. Insulated gate bipolar transistors are provided that have a voltage blocking substrate. Planar and beveled edge termination may be provided.
Abstract:
A system for signal boosting includes a capacitance boosting component that contains a first and second transistor and a capacitor, wherein a positive terminal of the capacitor is electrically connected to a drain of the second transistor and a negative terminal of the capacitor is electrically connected to a source of the first transistor. The system also includes a third transistor operable to receive a clock signal. A drain of the third transistor is electrically connected to the positive terminal of the capacitor. A fourth transistor is operable to receive an inverse of the clock signal. A drain of the fourth transistor is electrically connected to the positive terminal of the capacitor. The system further includes a boost component electrically connected to the capacitance boosting component wherein an output of the boost component is within a selected boost voltage range.
Abstract:
Silicon Carbide (SiC) PiN Diodes are provided having a reverse blocking voltage (VR) from about 3.0 kV to about 10.0 kV and a forward voltage (VF) of less than about 4.3 V.
Abstract:
A process is described for producing silicon carbide crystals having increased minority carrier lifetimes. The process includes the steps of heating and slowly cooling a silicon carbide crystal having a first concentration of minority carrier recombination centers such that the resultant concentration of minority carrier recombination centers is lower than the first concentration.
Abstract:
By implementing the sampling process at an AC ground node, rather than at a signal side, and adding a gated transistor (610 and 620) in the signal path, the present invention reduces the interdependency between gain and linearity in a switched capacitor mixer circuit, supplies higher power without sacrificing area and simplifies the implementation of the RF switch. Charge boosting circuitry (630) allows a reduction in the effective size of a series switch (610 and 620) that follows a transconductance element (115).
Abstract:
Silicon Carbide (SiC) PiN Diodes are provided having a reverse blocking voltage (VR) from about 3.0 kV to about 10.0 kV and a forward voltage (VF) of less than about 4.3 V.
Abstract translation:提供具有约3.0kV至约10.0kV的反向阻断电压(V SUB R N)的碳化硅 比约4.3 V.
Abstract:
MOS channel devices and methods of fabricating such devices having a hybrid channel are provided. Exemplary devices include vertical power MOSFETs that include a hybrid well region of silicon carbide and methods of fabricating such devices are provided. The hybrid well region may include an implanted p-type silicon carbide well portion in a p-type silicon carbide epitaxial layer, an implanted p-type silicon carbide contact portion that contacts the implanted p-type silicon carbide well portion and extends to a surface of the p-type epitaxial layer and/or an epitaxial p-type silicon carbide portion, at least a portion of the epitaxial p-type silicon carbide well portion corresponding to a p-type channel region of the MOSFET.