公开(公告)号：US20190019774A1

公开(公告)日：2019-01-17

申请号：US16138074

申请日：2018-09-21

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L21/48 ,  H05K3/32 ,  H05K3/40 ,  H05K3/06

CPC分类号： H01L24/14 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20105 ,  H01L2924/20106 ,  H05K3/06 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00012

摘要： A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.

公开(公告)号：US20150008577A1

公开(公告)日：2015-01-08

申请号：US14201031

申请日：2014-03-07

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L23/00 ,  H01L23/48

CPC分类号： H01L24/14 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20105 ,  H01L2924/20106 ,  H05K3/06 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00012

摘要： A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.

摘要翻译： 公开了建立导电连接的方法。 该方法包括提供具有多个焊球的集成电路管芯，每个焊球在焊球的外表面上具有氧化物层。 该方法还包括执行加热过程以至少加热焊球并且施加一种力，使得将多个穿孔结合结构中的每一个穿在基底上以刺穿焊球中的一个及其相关联的氧化物层，从而在 焊球和穿孔结合结构。

公开(公告)号：US20140326488A1

公开(公告)日：2014-11-06

申请号：US14331722

申请日：2014-07-15

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee ,  David Yih Ming Chai ,  Hong Wan Ng

IPC分类号： H01L23/12

CPC分类号： H01L23/12 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15787 ,  Y10T29/49826 ,  H01L2924/00 ,  H01L2224/05552

摘要： Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.

摘要翻译： 本文公开了微电子器件，相关联的组件和相关联的方法。 例如，本发明的某些方面涉及一种微电子器件，该微电子器件包括具有侧面和孔侧的微特征工件。 该装置还可包括具有表面的工件接触件。 工件接触面的至少一部分表面可以通过孔径和通过在孔和表面之间延伸的通道而接近。 本发明的其它方面涉及一种微电子支撑装置，其包括支撑构件，所述支撑构件具有承载能够连接到微特征工件的工件接触件的支撑触点的侧面。 该装置还可以包括由支撑构件承载的凹进的支撑接触装置。 凹入的支撑接触装置可以连接到微特征工件的第二工件接触件。

公开(公告)号：US08742572B2

公开(公告)日：2014-06-03

申请号：US13675523

申请日：2012-11-13

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L23/34 ,  H01L21/00 ,  H05K13/00 ,  H01L23/522 ,  H01L23/00 ,  H01L21/312 ,  H01L23/48 ,  H01L21/56 ,  H01R43/16

CPC分类号： H01L23/5226 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5384 ,  H01L24/19 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01R43/16 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49204 ,  H01L2224/82 ,  H01L2924/00

摘要： Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate.

摘要翻译： 本文公开了用于制造微电子器件的微电子器件和方法。 一种这样的方法的实施例包括在基板中形成多个通孔，其中通孔排列成阵列，并且将多个单独的微电子管芯附着到基板上，其中各个管芯的活动侧面向基板，并且具有 在各个模具的活动侧上的多个端子与衬底中的相应的孔对准。 在形成基板中的孔之后，单片模具附接到基板。

公开(公告)号：US10163840B2

公开(公告)日：2018-12-25

申请号：US14201031

申请日：2014-03-07

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L23/498 ,  H01L21/60 ,  H01L23/00 ,  H01L21/48 ,  H05K3/32 ,  H05K3/40 ,  H01L23/48 ,  H05K3/06

摘要： A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.

公开(公告)号：US08669173B2

公开(公告)日：2014-03-11

申请号：US13873509

申请日：2013-04-30

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L21/44

CPC分类号： H01L24/14 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20105 ,  H01L2924/20106 ,  H05K3/06 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00012

摘要： A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.

摘要翻译： 公开了建立导电连接的方法。 该方法包括提供具有多个焊球的集成电路管芯，每个焊球在焊球的外表面上具有氧化物层。 该方法还包括执行加热过程以至少加热焊球并且施加一种力，使得将多个穿孔结合结构中的每一个穿在基底上以刺穿焊球中的一个及其相关联的氧化物层，从而在 焊球和穿孔结合结构。

公开(公告)号：US20140332938A1

公开(公告)日：2014-11-13

申请号：US14100110

申请日：2013-12-09

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L23/4952 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. One such method includes forming a plurality of apertures in a substrate with the apertures arranged in an array, and, after forming the apertures, attaching the substrate to a lead frame having a plurality of pads with the apertures in the substrate aligned with corresponding pads in the lead frame. Another method includes providing a partially cured substrate, coupling the partially cured substrate to a plurality of leads, attaching a microelectronic die to the leads, and electrically connecting the microelectronic die to the leads.

摘要翻译： 本文公开了用于制造微电子器件的微电子器件和方法。 一种这样的方法包括在衬底中形成多个孔，其中孔布置成阵列，并且在形成孔之后，将衬底附接到具有多个衬垫的引线框架，衬底中的孔与衬底中的孔对准， 引线框架。 另一种方法包括提供部分固化的基板，将部分固化的基板耦合到多个引线，将微电子管芯附接到引线，以及将微电子管芯电连接到引线。

公开(公告)号：US09153526B2

公开(公告)日：2015-10-06

申请号：US14100110

申请日：2013-12-09

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L23/02 ,  H01L23/495 ,  H01L21/48 ,  H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/28 ,  H01L23/00

CPC分类号： H01L23/4952 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. One such method includes forming a plurality of apertures in a substrate with the apertures arranged in an array, and, after forming the apertures, attaching the substrate to a lead frame having a plurality of pads with the apertures in the substrate aligned with corresponding pads in the lead frame. Another method includes providing a partially cured substrate, coupling the partially cured substrate to a plurality of leads, attaching a microelectronic die to the leads, and electrically connecting the microelectronic die to the leads.

摘要翻译： 本文公开了用于制造微电子器件的微电子器件和方法。 一种这样的方法包括在衬底中形成多个孔，其中孔布置成阵列，并且在形成孔之后，将衬底附接到具有多个衬垫的引线框架，衬底中的孔与衬底中的孔对准， 引线框架。 另一种方法包括提供部分固化的基板，将部分固化的基板耦合到多个引线，将微电子管芯附接到引线，以及将微电子管芯电连接到引线。

公开(公告)号：US08536046B2

公开(公告)日：2013-09-17

申请号：US13757295

申请日：2013-02-01

申请人： Micron Technology, Inc.

发明人： Teck Kheng Lee

IPC分类号： H01L21/44

CPC分类号： H05K13/00 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/09854 ,  H01L2924/00

摘要： Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole.

摘要翻译： 包括这种通孔和互连的分隔的过孔，互连和衬底在本文中公开。 在一个实施例中，衬底具有形成在非导电层的一部分中的非导电层和分隔通孔。 非导电层包括顶侧，底侧和在顶侧和底侧之间延伸的通孔，并且包括具有第一部分和第二部分的侧壁。 分隔通孔包括在侧壁的第一部分上的通孔内的第一金属互连和在侧壁的第二部分上的通孔内的第二金属互连，并与第一金属互连电隔离。 在另一个实施例中，第一金属互连通过通孔内的间隙与第二金属互连分开。

公开(公告)号：US20130234328A1

公开(公告)日：2013-09-12

申请号：US13873509

申请日：2013-04-30

申请人： MICRON TECHNOLOGY, INC.

发明人： Teck Kheng Lee

IPC分类号： H01L23/00

CPC分类号： H01L24/14 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20105 ,  H01L2924/20106 ,  H05K3/06 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00012

摘要： A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.