公开(公告)号：US09260622B2

公开(公告)日：2016-02-16

申请号：US13638715

申请日：2011-03-30

Applicant: Kentaro Yoshida ,  Ryoichi Sasaki ,  Mamoru Omoda ,  Wataru Hirose ,  Manabu Shibata ,  Tatsuya Oshita

Inventor： Kentaro Yoshida ,  Ryoichi Sasaki ,  Mamoru Omoda ,  Wataru Hirose ,  Manabu Shibata ,  Tatsuya Oshita

IPC: B32B1/02 ,  C09D123/02 ,  C09D123/08 ,  B32B7/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  C09D1/00 ,  C08J7/06 ,  C23C18/12 ,  C09D133/02 ,  B32B1/08

CPC classification number: B05D3/007 ,  B32B7/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/28 ,  B32B2307/31 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2307/514 ,  B32B2307/714 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2439/46 ,  B32B2439/70 ,  C08J7/045 ,  C08J7/06 ,  C08J2367/02 ,  C08J2377/00 ,  C08K2201/008 ,  C09D1/00 ,  C09D123/02 ,  C09D123/0846 ,  C09D133/02 ,  C23C18/1216 ,  Y10T428/1303 ,  Y10T428/1334 ,  Y10T428/1393 ,  Y10T428/31993

Abstract: The composite structural material of the present invention includes a base (X) and a layer (Y) stacked on the base (X). The layer (Y) includes a reaction product (R) of a metal oxide (A) and a phosphorus compound (B). In the infrared absorption spectrum of the layer (Y) in the range of 800 to 1400 cm−1, the wave number (n1) at which the infrared absorption reaches maximum is in the range of 1080 to 1130 cm−1.

Abstract translation: 本发明的复合结构材料包括基材（X）和层叠在基材（X）上的层（Y）。 层（Y）包括金属氧化物（A）和磷化合物（B）的反应产物（R）。 在800〜1400cm -1范围内的层（Y）的红外吸收光谱中，红外线吸收达到最大的波数（n1）为1080〜1130cm -1的范围。

公开(公告)号：US08039071B2

公开(公告)日：2011-10-18

申请号：US12768485

申请日：2010-04-27

Applicant: Tatsuya Oshita ,  Goki Uehara ,  Atsuhiro Nakahara ,  Osamu Kazeto ,  Manabu Shibata ,  Takehiro Miyamoto

Inventor： Tatsuya Oshita ,  Goki Uehara ,  Atsuhiro Nakahara ,  Osamu Kazeto ,  Manabu Shibata ,  Takehiro Miyamoto

IPC: B32B27/10 ,  B32B27/08 ,  B32B9/04 ,  B32B29/00 ,  B05D3/10 ,  B05D3/02 ,  C08K5/54

CPC classification number: C08J7/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/28 ,  B32B27/30 ,  B32B27/308 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/105 ,  B32B2307/412 ,  B32B2307/7244 ,  B32B2439/70 ,  B32B2439/80 ,  B32B2553/00 ,  C08J7/047 ,  C08J2367/00 ,  C08J2433/00 ,  Y10T428/1334 ,  Y10T428/1341 ,  Y10T428/1352 ,  Y10T428/24802 ,  Y10T428/31504 ,  Y10T428/31663 ,  Y10T428/31993

Abstract: Provided is a gas barrier layered product including a base material and a layer stacked on at least one surface of the base material, wherein the layer is formed of a composition including: a hydrolyzed and condensed product of at least one compound (L) containing a metal atom to which at least one characteristic group selected from a halogen atom and an alkoxy group has been bonded, wherein the compound (L) contains at least one compound (A) and at least one compound (B), wherein a mole ratio of the compound (A) / the compound (B) is in a range of 0.5/99.5 to 40/60; and a neutralized product of a polymer containing at least one functional group selected from a carboxyl group and a carboxylic anhydride group, wherein at least 55 mol % of a —COO— group contained in the at least one functional group has been neutralized with a metal ion having a valence of two or more. Also provided is a method for producing the gas barrier layered product.

Abstract translation: 本发明提供一种阻气性层叠体，其包含基材和层叠在基材的至少一个表面上的层，其中，所述层由以下组合物形成，所述组合物包含：至少一种化合物（L）的水解缩合产物， 其中至少一个选自卤素原子和烷氧基的特征基团已经键合的金属原子，其中化合物（L）含有至少一种化合物（A）和至少一种化合物（B），其中摩尔比 化合物（A）/化合物（B）在0.5 / 99.5〜40/60的范围内; 和含有至少一个选自羧基和羧酸酐基团的官能团的聚合物的中和产物，其中至少一个官能团中所含的至少55mol％的-COO-基团已被金属中和 化合价为2以上的离子。 还提供了一种制造阻气性层压体的方法。

公开(公告)号：US20110210034A1

公开(公告)日：2011-09-01

申请号：US13127556

申请日：2009-11-04

Applicant: Manabu Shibata ,  Tatsuya Oshita ,  Wataru Hirose

Inventor： Manabu Shibata ,  Tatsuya Oshita ,  Wataru Hirose

IPC: B65D85/00

CPC classification number: B32B27/08 ,  B32B7/12 ,  B32B27/10 ,  B32B27/28 ,  B32B27/286 ,  B32B27/288 ,  B32B27/30 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B29/00 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/308 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2307/558 ,  B32B2307/581 ,  B32B2307/7242 ,  B32B2307/732 ,  B32B2439/40 ,  B32B2439/70 ,  B32B2553/00 ,  Y10T428/1334 ,  Y10T428/1341

Abstract: The formed product of the present invention is a formed product selected from the group consisting of a vertical form fill seal pouch, a container cover and a vacuum packaging pouch. The formed product is formed using a gas barrier layered product. The gas barrier layered product includes a base, and at least one layer with gas barrier properties that is stacked on the base. The layer is formed of a composition that includes a hydrolyzed condensate of a compound (L) and a neutralized product of a polymer (X) containing a carboxyl group or a carboxylic acid anhydride group. The compound (L) includes a compound (A) that contains M1 (Al, Ti or Zr) to which a hydrolyzable characteristic group is bonded and a compound (B) that contains Si to which a hydrolyzable characteristic group is bonded. At least part of —COO— group of the polymer (X) is neutralized with a metal ion having a valence of at least two. At least 80 mol % of the compound (B) is a compound expressed by a specific formula. The ratio of [the number of moles of M1 in the compound (A)]/[the number of moles Si in the compound (B)] is in the range of 0.1/99.9 to 35.0/65.0.

Abstract translation: 本发明的成型产品是选自垂直成型填充密封袋，容器盖和真空包装袋的成形制品。 形成的产品使用阻气性层压体形成。 阻气性层叠体包含基材和至少一层层叠在基材上的阻气性的层。 该层由包含化合物（L）的水解缩合物和含有羧基或羧酸酐基的聚合物（X）的中和产物的组合物形成。 化合物（L）包括含有可水解特征基团键合的M1（Al，Ti或Zr）的化合物（A）和含有可水解特征基团键合的Si的化合物（B）。 聚合物（X）的-COO-基团的至少一部分用至少二价的金属离子中和。 至少80mol％的化合物（B）是由具体的式表示的化合物。 [化合物（A）中的M1的摩尔数] / [化合物（B）中的Si的摩尔数]的比例为0.1 / 99.9〜35.0 / 65.0的范围。

公开(公告)号：US07775186B2

公开(公告)日：2010-08-17

申请号：US11987344

申请日：2007-11-29

Applicant: Masahide Sakurai ,  Katsuhiko Motosugi ,  Manabu Shibata

Inventor： Masahide Sakurai ,  Katsuhiko Motosugi ,  Manabu Shibata

IPC: F01L1/04

CPC classification number: F01L1/053 ,  B21D53/845 ,  F01L1/047 ,  F01L2001/0476 ,  Y10T29/49293

Abstract: A cam lobe is formed as a single part, not formed together with a shaft body. The shaft body penetrates through bearing holes, as well as a mounting hole provided in the cam lobe, which is arranged in between adjacent bearing holes. The bearing holes each in a perfect circular shape can be achieved, since there is no need to divide the bearing holes into two semi-circular arc shaped concave portions. Consequently, a camshaft can be supported so as to rotate smoothly.

Abstract translation: 凸轮凸角形成为不与轴体一起形成的单个部件。 轴体穿过轴承孔，以及设置在凸轮凸角中的安装孔，其布置在相邻的轴承孔之间。 由于不需要将轴承孔分成两个半圆弧状的凹部，所以能够实现圆形的正圆形的轴承孔。 因此，可以支撑凸轮轴以平滑地旋转。

公开(公告)号：US07647912B2

公开(公告)日：2010-01-19

申请号：US11987345

申请日：2007-11-29

Applicant: Manabu Shibata ,  Katsuhiko Motosugi ,  Masahide Sakurai ,  Mitsuyoshi Teramura

Inventor： Manabu Shibata ,  Katsuhiko Motosugi ,  Masahide Sakurai ,  Mitsuyoshi Teramura

IPC: F01L55/02

CPC classification number: F01L1/02 ,  F01L1/053 ,  F01L2001/0476

Abstract: In a process of mounting a camshaft 20 to a supporting member 10, a shaft body 21 is firstly inserted into a first bearing hole 13F in the front side of the supporting member 10, before the shaft body 21 is axially moved toward the second bearing hole 13R. In order to get a cam lobe 22 through a concave bearing portion 13M in a semicircular arc shape, rotation of the camshaft 20 enables a cam nose 22b to be directed downward, which is opposite from the concave bearing portion 13M. This enables avoiding the interference between the cam nose 22b and the concave bearing portion 13M, even when the curvature radius of the concave bearing portion 13M is reduced. Consequently, reduction of the curvature radius of the concave bearing portion 13M achieves the downsizing of the supporting member 10.

Abstract translation: 在将凸轮轴20安装在支撑部件10上的过程中，在轴体21朝向第二轴承孔轴向移动之前，首先将轴体21插入支撑部件10的前侧的第一轴承孔13F 13R。 为了通过半圆弧形状的凹入轴承部分13M获得凸轮凸角22，凸轮轴20的旋转使得凸轮端头22b能够向下指向与凹入轴承部分13M相反的向下。 这样，即使凹入轴承部13M的曲率半径减小，也能够避免凸轮凸起22b与凹入轴承部13M之间的干涉。 因此，凹入轴承部13M的曲率半径的减小实现了支撑部件10的小型化。

公开(公告)号：US20090030126A1

公开(公告)日：2009-01-29

申请号：US11916371

申请日：2006-05-29

Applicant: Goki Uehara ,  Manabu Shibata ,  Tatsuya Oshita

Inventor： Goki Uehara ,  Manabu Shibata ,  Tatsuya Oshita

IPC: C08K5/5415 ,  B05D3/10

CPC classification number: B32B27/308 ,  B32B27/30 ,  B32B2307/7242 ,  B32B2553/00 ,  C08K3/22 ,  C08K5/057 ,  C08K2201/008 ,  C08L33/02 ,  C08L83/04 ,  C09D133/04 ,  C09D183/04 ,  C09D183/10 ,  Y10T428/1334 ,  Y10T428/1352 ,  Y10T428/31993 ,  C08L83/00 ,  C08L2666/04

Abstract: The present invention provides a gas barrier layered product exhibiting a high oxygen barrier property independent of humidity and having excellent transparency, and a method of manufacturing the same. The gas barrier layered product includes a base material and a layer stacked on the base material. The layer is formed of a composition includes: a hydrolyzed and condensed product of a compound (L) containing a metal atom to which at least one group selected from a halogen atom and an alkoxy group is bonded; a neutralized product of a polymer containing a functional group selected from a carboxyl group and a carboxylic anhydride group; and a compound (D). At least a part of a —COO— group contained in the at least one functional group is neutralized by a metal ion having a valence of two or more. The compound (L) includes at least one compound (A) in which an organic group having at least one characteristic group, selected from a halogen atom, a mercapto group and a hydroxyl group, further bonded to the metal atom. The compound (D) is a compound bonding to both the —COO— group of the neutralized product of the polymer and a group on the surface of the hydrolyzed and condensed product.

Abstract translation: 本发明提供一种表现出与湿度无关并具有优异透明性的高氧阻隔性的阻气性层压体及其制造方法。 阻气性层叠体包括基材和层叠在基材上的层。 该层由组合物形成，包括：含有至少一个选自卤素原子和烷氧基的基团键合的金属原子的化合物（L）的水解和缩合产物; 含有选自羧基和羧酸酐基团的官能团的聚合物的中和产物; 和化合物（D）。 包含在至少一个官能团中的-COO-基团的至少一部分被二价以上的金属离子中和。 化合物（L）包括至少一种化合物（A），其中具有至少一个选自卤素原子，巯基和羟基的特征基团的有机基团还与金属原子键合。 化合物（D）是与聚合物的中和产物的-COO-基团和水解和缩合产物的表面上的基团结合的化合物。

公开(公告)号：US20060286714A1

公开(公告)日：2006-12-21

申请号：US11506574

申请日：2006-08-18

Applicant: Manabu Shibata

Inventor： Manabu Shibata

IPC: H01L21/00

CPC classification number: H05K3/3463 ,  H01L23/055 ,  H01L23/24 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85444 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15331 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2203/047 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There is provided a semiconductor device that is capable of reducing wring density of the wiring pattern on a mounting board on which it is mounted, thereby facilitating routing of the wiring pattern. Pads are formed which are connected to pads on a bare chip by bonding wires. There are formed vias extending from the respective pads to a bottom surface of a package, and vias extending from the respective pads to a top surface of the package. This makes it possible to connect the mounting boards to the top and bottom surfaces of the package, thereby enabling reduction of the wiring density of wiring patterns on the mounting boards, thereby facilitating routing of the wiring patterns on the mounting boards.

Abstract translation: 提供一种半导体器件，其能够减少安装在其上的安装板上的布线图案的拧紧密度，从而便于布线图案的布线。 形成通过接合线连接到裸芯片上的焊盘的焊盘。 形成有从相应的焊盘延伸到封装的底表面的通孔，以及从相应的焊盘延伸到封装的顶表面的通孔。 这使得可以将安装板连接到封装的顶表面和底表面，从而能够减少安装板上的布线图案的布线密度，从而便于布线图案在安装板上的布线。

公开(公告)号：US5556213A

公开(公告)日：1996-09-17

申请号：US219904

申请日：1994-03-30

Applicant: Yasunori Kudo ,  Manabu Shibata ,  Takahisa Misawa

Inventor： Yasunori Kudo ,  Manabu Shibata ,  Takahisa Misawa

IPC: B41J2/325 ,  B26D3/08 ,  B26D7/26 ,  B41J3/36 ,  B41J3/407 ,  B41J11/66 ,  B41J11/70 ,  B41J17/00 ,  B41J31/05 ,  D41J11/70

CPC classification number: B41J3/4075 ,  B26D3/085 ,  B26D7/26 ,  Y10T156/1082 ,  Y10T83/0581

Abstract: A tape printer including: a printer head for printing characters, figures, etc. on a laminated tape which is formed by laminating a printing tape and a separate paper a tape releasing section for feeding the laminated tape from the tape printer and a cutter for cutting the laminated tape. A half-cut mechanism for cutting only the printing tape of the laminated tape is provided on the tape out-going side of the cutter.

Abstract translation: 一种带式打印机，包括：打印头，用于在层压带上打印字符，图形等，其通过层压打印带和单独的纸形成，用于从带式打印机供给层压带的带释放部分和用于切割的切割器 层压胶带。 仅切割层压带的打印带的半切机构设置在切割器的带外侧。

公开(公告)号：US5265045A

公开(公告)日：1993-11-23

申请号：US793315

申请日：1991-11-15

Applicant: Yoji Nishio ,  Fumio Murabayashi ,  Shoichi Kotoku ,  Akira Uragami ,  Manabu Shibata ,  Yoshitatsu Kojima ,  Fumiaki Matsuzaki

Inventor： Yoji Nishio ,  Fumio Murabayashi ,  Shoichi Kotoku ,  Akira Uragami ,  Manabu Shibata ,  Yoshitatsu Kojima ,  Fumiaki Matsuzaki

IPC: G11C5/06 ,  G11C8/16 ,  G11C7/00 ,  G11C5/00 ,  G11C8/00

CPC classification number: G11C8/16 ,  G11C5/063

Abstract: A semiconductor integrated circuit device with a built-in memory circuit group is disclosed, wherein wiring is started from a data terminal position near a data exchange portion of a memory circuit group to reduce the length of a wiring. Accordingly, an operation speed can be improved by the reduction of wiring capacitance and a ratio of unwired wirings can be reduced by reduction of an occupying ratio of wiring channels.

Abstract translation: 公开了一种具有内置存储器电路组的半导体集成电路器件，其中从存储器电路组的数据交换部分附近的数据终端位置开始布线以减少布线的长度。 因此，可以通过减少布线电容来提高操作速度，并且可以通过降低布线通道的占有率来减少退绕布线的比率。

公开(公告)号：US5168342A

公开(公告)日：1992-12-01

申请号：US707974

申请日：1991-05-23

Applicant: Manabu Shibata

Inventor： Manabu Shibata

IPC: H01L23/528 ,  H01L27/118

CPC classification number: H01L27/11896 ,  H01L23/528 ,  H01L2924/0002

Abstract: In a semiconductor integrated circuit device adopting a master slice system, a plurality of lattice points of an X-Y lattice-shaped channel region set by an automatic arrangement and routing system correspond to one input/output terminal of a prescribed basic cell (or logic circuit), thereby a plurality of signal wirings can be connected to the one input/output terminal.

Abstract translation: 在采用主切片系统的半导体集成电路装置中，由自动布置和布线系统设置的XY格状通道区域的多个点阵对应于规定的基本单元（或逻辑电路）的一个输入/输出端子， 从而多个信号布线可以连接到一个输入/输出端子。