摘要:
A gas sensor including a detection element having a detection portion; a metal shell that surrounds the detection element so as to expose the detection portion to a measured atmosphere; an outer tube that is fixed to the metal shell so as to cover a rear end side of the detection element; and a seal member that is contained inside the outer tube, the seal member having a lead wire insertion hole and a through hole that penetrates in the axial direction; a tubular holding member made of a resin having a lower coefficient of thermal expansion than the seal member, the tubular holding member being held inside the through hole, the tubular holding member having a ventilation hole; and a filter that covers the ventilation hole, the filter being joined to the holding member, the filter blocking water from passing therethrough, and the filter having air permeability.
摘要:
A semiconductor device includes a semiconductor region, a source region, a drain region, a source extension region a drain extension region, a first gate insulation film, a second gate insulation film, and a gate electrode. The source region, drain region, source extension region and drain extension region are formed in a surface portion of the semiconductor region. The first gate insulation film is formed on the semiconductor region between the source extension region and the drain extension region. The first gate insulation film is formed of a silicon oxide film or a silicon oxynitride film having a nitrogen concentration of 15 atomic % or less. The second gate insulation film is formed on the first gate insulation film and contains nitrogen at a concentration of between 20 atomic % and 57 atomic %. The gate electrode is formed on the second gate insulation film.
摘要:
A manufacturing method for semiconductor device includes: forming an opening, in a surface of a semiconductor substrate being composed of first atom, the opening having an opening ratio y to an area of the surface of the semiconductor substrate ranging from 5 to 30%; forming an epitaxial layer in the opening, the epitaxial layer being made of a mixed crystal containing a second atom in a concentration ranging from 15 to 25%, and the second atom having a lattice constant different from a lattice constant of the first atom; implanting impurity ion into the epitaxial layer; and performing activation annealing at a predetermined temperature T, the predetermined temperature T being equal to or higher than 1150° C. and satisfies a relationship of y≦1E-5exp(21541/T).
摘要:
A sensor having a terminal connection structure in which an elongated sensor element (21) is inserted, from its rear end through relative movement, into a metallic-terminal-member retainer. Metallic terminal members (51) are elastically deformed and pressed against corresponding electrode terminals (25) formed on side surfaces (26) of the sensor element. A chamfer (28) is formed on a rear edge of sensor element (21). Rear ends (25b) of the electrode terminals (25) are biased from the chamfer (28) toward a front end of the element (21). A flat surface (26b) is present between the rear ends (25b) of the electrode terminals (25) and a front end (28a) of the chamfer (28). During insertion of the element (21), a large force generated when the metallic terminal members (51) pass over the chamfer (28) is not directly applied to the rear ends (25b) of the electrode terminals (25), thereby preventing damage to the electrode terminals (25).
摘要:
A semiconductor device includes an isolation region, a semiconductor element region defined by the isolation region, and having a channel forming portion and a recessed portion, the recessed portion being formed between the isolation region and the channel forming portion, and an epitaxial semiconductor portion formed in the recessed portion, wherein the semiconductor element region has a wall portion between the isolation region and the epitaxial semiconductor portion.
摘要:
A semiconductor device includes a semiconductor substrate which has a cavity and has a source region, a drain region, and a channel region above the cavity, a gate electrode which is formed on the channel region with a gate insulating film interposed between the gate electrode and the channel region, and a stress generating film which has a first portion formed on the upper surface of the cavity and which gives a strain to the channel region.
摘要:
A semiconductor device comprises a semiconductor substrate, an N-channel MISFET and a P-channel MISFET provided on the semiconductor substrate, each of the N- and P-channel MISFETs being isolated by an isolation region and having a gate insulating film, a first gate electrode film provided on the gate insulating film of the N-channel MISFET and composed of a first metal silicide, a second gate electrode film provided on the gate insulating film of the P-channel MISFET and composed of a second metal silicide made of a second metal material different from a first metal material composing the first metal silicide, and a work function of the first gate electrode film being lower than that of the second gate electrode film.
摘要:
A semiconductor device comprises an n-type MIS transistor comprising a first gate insulating film and a first gate electrode including an MSix film formed on the first gate insulating film, where M represents a metal element selected from tungsten and molybdenum and x is greater than 1, i.e., x>1; and a p-type MIS transistor comprising a second gate insulating film and a second gate electrode including an MSiy film formed on the second gate insulating film, where y is not less than 0 and less than 1, i.e., 0≦y
摘要翻译:半导体器件包括n型MIS晶体管,其包括第一栅极绝缘膜和第一栅电极,所述第一栅极包括形成在第一栅极绝缘膜上的MSi膜,其中M表示选自钨的金属元素 钼和x大于1,即x> 1; 以及p型MIS晶体管,其包括第二栅极绝缘膜和第二栅电极,所述第二栅电极包括形成在所述第二栅极绝缘膜上的MSi膜,其中y不小于0且小于1, 即0 <= y <1。
摘要:
A sensor having a terminal connection structure in which an elongated sensor element (21) is inserted, from its rear end through relative movement, into a metallic-terminal-member retainer. Metallic terminal members (51) are elastically deformed and pressed against corresponding electrode terminals (25) formed on side surfaces (26) of the sensor element. A chamfer (28) is formed on a rear edge of sensor element (21). Rear ends (25b) of the electrode terminals (25) are biased from the chamfer (28) toward a front end of the element (21). A flat surface (26b) is present between the rear ends (25b) of the electrode terminals (25) and a front end (28a) of the chamfer (28). During insertion of the element (21), a large force generated when the metallic terminal members (51) pass over the chamfer (28) is not directly applied to the rear ends (25b) of the electrode terminals (25), thereby preventing damage to the electrode terminals (25).
摘要:
A semiconductor device comprises a semiconductor substrate, an N-channel MISFET and a P-channel MISFET provided on the semiconductor substrate, each of the N- and P-channel MISFETs being isolated by an isolation region and having a gate insulating film, a first gate electrode film provided on the gate insulating film of the N-channel MISFET and composed of a first metal silicide, a second gate electrode film provided on the gate insulating film of the P-channel MISFET and composed of a second metal silicide made of a second metal material different from a first metal material composing the first metal silicide, and a work function of the first gate electrode film being lower than that of the second gate electrode film.