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1.发明授权Method of fabricating a semiconductor device having a resin with warpage compensated structures 有权具有具有翘曲补偿结构的树脂的半导体器件的制造方法公开(公告)号：US08377753B2
公开(公告)日：2013-02-19
申请号：US13293844
申请日：2011-11-10
IPC分类号： H01L23/29
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。
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公开(公告)号：US08207601B2
公开(公告)日：2012-06-26
申请号：US12145832
申请日：2008-06-25
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.
摘要翻译： 电子部件包括引线框架组件，插入件，半导体芯片和封装化合物。 引线框架组件包括安装孔，管芯焊盘，多个接合指以及多个引线指。 插入件包括中空中心并且设置在引线框架组件的安装孔处。 半导体芯片布置在管芯焊盘上并且包括其表面上的接触区域。 多个电触点分别将半导体芯片的接触区域与引线框架组件的接合指状物连接。 封装化合物封装插入件，半导体芯片和电触点，然而，使得插入件的空心中心未被覆盖。
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3.发明授权公开(公告)号：US08067841B2
公开(公告)日：2011-11-29
申请号：US12036930
申请日：2008-02-25
IPC分类号： H01L23/29
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。
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公开(公告)号：US20090212446A1
公开(公告)日：2009-08-27
申请号：US12036930
申请日：2008-02-25
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。
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5.发明申请Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures 有权制造具有翘曲补偿结构的树脂的半导体器件的方法公开(公告)号：US20120058606A1
公开(公告)日：2012-03-08
申请号：US13293844
申请日：2011-11-10
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置用于安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。
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公开(公告)号：US20090001536A1
公开(公告)日：2009-01-01
申请号：US12145832
申请日：2008-06-25
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49562 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.
摘要翻译： 电子部件包括引线框架组件，插入件，半导体芯片和封装化合物。 引线框架组件包括安装孔，管芯焊盘，多个接合指以及多个引线指。 插入件包括中空中心并且设置在引线框架组件的安装孔处。 半导体芯片布置在管芯焊盘上并且包括其表面上的接触区域。 多个电触点分别将半导体芯片的接触区域与引线框架组件的接合指状物连接。 封装化合物封装插入件，半导体芯片和电触点，然而，使得插入件的空心中心未被覆盖。
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公开(公告)号：US20120276693A1
公开(公告)日：2012-11-01
申请号：US13548120
申请日：2012-07-12
IPC分类号： H01L21/50
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US08633102B2
公开(公告)日：2014-01-21
申请号：US13548120
申请日：2012-07-12
IPC分类号： H01L21/44
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US20080230928A1
公开(公告)日：2008-09-25
申请号：US11725973
申请日：2007-03-20
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US08237268B2
公开(公告)日：2012-08-07
申请号：US11725973
申请日：2007-03-20
IPC分类号： H01L23/48
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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