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公开(公告)号：US08237268B2
公开(公告)日：2012-08-07
申请号：US11725973
申请日：2007-03-20
IPC分类号： H01L23/48
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US08022558B2
公开(公告)日：2011-09-20
申请号：US12371066
申请日：2009-02-13
申请人： Chee Soon Law , Fong Lim , Zakaria Abdullah
发明人： Chee Soon Law , Fong Lim , Zakaria Abdullah
IPC分类号： H01L23/48 , H01L23/495
CPC分类号： H01L23/49575 , H01L23/49524 , H01L24/16 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/84 , H01L24/85 , H01L25/0657 , H01L2224/04042 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/2919 , H01L2224/37147 , H01L2224/40091 , H01L2224/40245 , H01L2224/45014 , H01L2224/45032 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83855 , H01L2224/85 , H01L2224/92 , H01L2224/92247 , H01L2225/06579 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.
摘要翻译： 半导体封装包括第一半导体芯片，第二半导体芯片和带。 带包括第一金属层和第二金属层。 将第一金属层焊接到第一芯片，并且将第二金属层附接到第二芯片。
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公开(公告)号：US08633102B2
公开(公告)日：2014-01-21
申请号：US13548120
申请日：2012-07-12
IPC分类号： H01L21/44
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US20080230928A1
公开(公告)日：2008-09-25
申请号：US11725973
申请日：2007-03-20
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US20120276693A1
公开(公告)日：2012-11-01
申请号：US13548120
申请日：2012-07-12
IPC分类号： H01L21/50
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US20100207279A1
公开(公告)日：2010-08-19
申请号：US12371066
申请日：2009-02-13
申请人： Chee Soon Law , Fong Lim , Abdullah Zakaria
发明人： Chee Soon Law , Fong Lim , Abdullah Zakaria
CPC分类号： H01L23/49575 , H01L23/49524 , H01L24/16 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/84 , H01L24/85 , H01L25/0657 , H01L2224/04042 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/2919 , H01L2224/37147 , H01L2224/40091 , H01L2224/40245 , H01L2224/45014 , H01L2224/45032 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83855 , H01L2224/85 , H01L2224/92 , H01L2224/92247 , H01L2225/06579 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.
摘要翻译： 半导体封装包括第一半导体芯片，第二半导体芯片和带。 带包括第一金属层和第二金属层。 将第一金属层焊接到第一芯片，并且将第二金属层附接到第二芯片。
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