公开(公告)号：US20120058606A1

公开(公告)日：2012-03-08

申请号：US13293844

申请日：2011-11-10

申请人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

发明人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

IPC分类号： H01L21/50 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.

摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置用于安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

公开(公告)号：US20090001536A1

公开(公告)日：2009-01-01

申请号：US12145832

申请日：2008-06-25

申请人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

发明人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.

摘要翻译： 电子部件包括引线框架组件，插入件，半导体芯片和封装化合物。 引线框架组件包括安装孔，管芯焊盘，多个接合指以及多个引线指。 插入件包括中空中心并且设置在引线框架组件的安装孔处。 半导体芯片布置在管芯焊盘上并且包括其表面上的接触区域。 多个电触点分别将半导体芯片的接触区域与引线框架组件的接合指状物连接。 封装化合物封装插入件，半导体芯片和电触点，然而，使得插入件的空心中心未被覆盖。

公开(公告)号：US08207601B2

公开(公告)日：2012-06-26

申请号：US12145832

申请日：2008-06-25

申请人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

发明人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.

摘要翻译： 电子部件包括引线框架组件，插入件，半导体芯片和封装化合物。 引线框架组件包括安装孔，管芯焊盘，多个接合指以及多个引线指。 插入件包括中空中心并且设置在引线框架组件的安装孔处。 半导体芯片布置在管芯焊盘上并且包括其表面上的接触区域。 多个电触点分别将半导体芯片的接触区域与引线框架组件的接合指状物连接。 封装化合物封装插入件，半导体芯片和电触点，然而，使得插入件的空心中心未被覆盖。

公开(公告)号：US08067841B2

公开(公告)日：2011-11-29

申请号：US12036930

申请日：2008-02-25

申请人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

发明人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

IPC分类号： H01L23/29

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.

摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

公开(公告)号：US20090212446A1

公开(公告)日：2009-08-27

申请号：US12036930

申请日：2008-02-25

申请人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

发明人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

IPC分类号： H01L23/31 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.

摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

公开(公告)号：US08377753B2

公开(公告)日：2013-02-19

申请号：US13293844

申请日：2011-11-10

申请人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

发明人： Chai Wei Heng ,  Wae Chet Yong ,  Stanley Job Doraisamy ,  Khai Huat Jeffrey Low ,  Gerhard Deml

IPC分类号： H01L23/29

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.

摘要翻译： 一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面， 具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

公开(公告)号：US20090045493A1

公开(公告)日：2009-02-19

申请号：US12067113

申请日：2005-09-27

申请人： Wae Chet Yong ,  Mohd Fauzi HJ Mahat ,  Stanley Job Doraisamy ,  Tien Lai Tan

发明人： Wae Chet Yong ,  Mohd Fauzi HJ Mahat ,  Stanley Job Doraisamy ,  Tien Lai Tan

IPC分类号： H01L21/66 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/0603 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20757 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and the orientation of electrically conductive members with respect to the semiconductor device and inner contact areas of the leadframe is altered so as to maximize the interfacial bonding area. The constraints of the standard package dimensions and the component assembly method are taken into account.

摘要翻译： 半导体元件及其制造方法。 半导体部件包括半导体器件和引线框架。 定义封装布局，改变导电构件相对于半导体器件和引线框架的内部接触区域的取向，从而最大化界面结合面积。 考虑到标准包尺寸和组件装配方法的约束。

公开(公告)号：US20090212417A1

公开(公告)日：2009-08-27

申请号：US12035972

申请日：2008-02-22

申请人： Wae Chet Yong ,  Teck Sim Lee ,  Erich Griebl ,  Mario Feldvoss ,  Juergen Schredl

发明人： Wae Chet Yong ,  Teck Sim Lee ,  Erich Griebl ,  Mario Feldvoss ,  Juergen Schredl

IPC分类号： H01L23/36 ,  H01L21/56

CPC分类号： H01L23/49562 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49568 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device.

摘要翻译： 一种半导体器件，包括：散热器，散热器上的裸片，封装所述裸片的树脂和所述树脂中的安装孔，所述树脂中的安装孔至少具有在所述散热器和所述树脂的第一端之间的部分，其中， 散热器不得大于设备厚度的35％。

公开(公告)号：US07821141B2

公开(公告)日：2010-10-26

申请号：US12035972

申请日：2008-02-22

申请人： Wae Chet Yong ,  Teck Sim Lee ,  Erich Griebl ,  Mario Feldvoss ,  Juergen Schredl

发明人： Wae Chet Yong ,  Teck Sim Lee ,  Erich Griebl ,  Mario Feldvoss ,  Juergen Schredl

IPC分类号： H01L23/28

CPC分类号： H01L23/49562 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49568 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device.

摘要翻译： 一种半导体器件，包括：散热器，散热器上的管芯，封装所述管芯的树脂，以及所述树脂中的安装孔，其具有在所述散热器和所述树脂的第一端之间的至少一段，其中， 散热器不得大于设备厚度的35％。

公开(公告)号：US20100227436A1

公开(公告)日：2010-09-09

申请号：US12779367

申请日：2010-05-13

申请人： Bernd Goller ,  Markus Dinkel ,  Wae Chet Yong ,  Teck Sim Lee ,  Boon Kian Lim

发明人： Bernd Goller ,  Markus Dinkel ,  Wae Chet Yong ,  Teck Sim Lee ,  Boon Kian Lim

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L23/49548 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.

摘要翻译： 一种半导体封装的制造方法。 在一个实施例中，该方法包括在引线框架的第一主表面的一部分周围形成模腔，包括在第一主表面和第二主表面之间延伸穿过引线框架的模具锁定开口。 插入间隔件以填充模具锁定开口的至少一部分。 模腔填充有包封材料，包括填充未被间隔件占据的模具锁定开口的一部分。