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8 条记录 (耗时 0.012 秒)

    Method of manufacture of encapsulated package
    1.
    发明授权
    Method of manufacture of encapsulated package 有权
    封装包装的制造方法

    公开(公告)号：US07674657B2

    公开(公告)日：2010-03-09

    申请号：US12046969

    申请日：2008-03-12

    申请人： Chai Wei Heng ,  Yang Hong Heng ,  Yong Chern Poh

    发明人： Chai Wei Heng ,  Yang Hong Heng ,  Yong Chern Poh

    IPC分类号： H01L21/00 ,  H01L23/28

    CPC分类号： H01L21/56 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/1815 ,  H01L2924/00

    摘要： There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.

    摘要翻译： 提供了一种制造封装的组件封装的方法，包括在封装期间提供用于支撑封装的部件的支撑件，所述支撑件包括延伸超过最终封装的周边的支腿，使支撑腿破裂并覆盖暴露的端部 腿用绝缘材料。 还提供了根据该方法形成的包装。

    Method of Manufacture of Encapsulated Package
    2.
    发明申请
    Method of Manufacture of Encapsulated Package 有权
    封装包装制造方法

    公开(公告)号：US20080157433A1

    公开(公告)日：2008-07-03

    申请号：US12046969

    申请日：2008-03-12

    申请人： Chai Wei Heng ,  Yang Hong Heng ,  Yong Chern Poh

    发明人： Chai Wei Heng ,  Yang Hong Heng ,  Yong Chern Poh

    IPC分类号： B29C39/10 ,  B29C45/14

    CPC分类号： H01L21/56 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/1815 ,  H01L2924/00

    摘要： There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.

    摘要翻译： 提供了一种制造封装的组件封装的方法，包括在封装期间提供用于支撑封装的部件的支撑件，所述支撑件包括延伸超过最终封装的周边的支腿，使支撑腿破裂并覆盖暴露的端部 腿用绝缘材料。 还提供了根据该方法形成的包装。

    Electronic component and a method of fabricating an electronic component
    3.
    发明授权
    Electronic component and a method of fabricating an electronic component 有权
    电子元件及其制造方法

    公开(公告)号：US08207601B2

    公开(公告)日：2012-06-26

    申请号：US12145832

    申请日：2008-06-25

    申请人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

    发明人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.

    摘要翻译： 电子部件包括引线框架组件，插入件，半导体芯片和封装化合物。 引线框架组件包括安装孔，管芯焊盘，多个接合指以及多个引线指。 插入件包括中空中心并且设置在引线框架组件的安装孔处。 半导体芯片布置在管芯焊盘上并且包括其表面上的接触区域。 多个电触点分别将半导体芯片的接触区域与引线框架组件的接合指状物连接。 封装化合物封装插入件，半导体芯片和电触点，然而，使得插入件的空心中心未被覆盖。

    Electronic Component and a Method of Fabricating an Electronic Component
    8.
    发明申请
    Electronic Component and a Method of Fabricating an Electronic Component 有权
    电子元件及其制造方法

    公开(公告)号：US20090001536A1

    公开(公告)日：2009-01-01

    申请号：US12145832

    申请日：2008-06-25

    申请人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

    发明人： Khai Huat Jeffrey Low ,  Chai Wei Heng ,  Wae Chet Yong

    IPC分类号： H01L23/495 ,  H01L21/56

    CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.

    摘要翻译： 电子部件包括引线框架组件，插入件，半导体芯片和封装化合物。 引线框架组件包括安装孔，管芯焊盘，多个接合指以及多个引线指。 插入件包括中空中心并且设置在引线框架组件的安装孔处。 半导体芯片布置在管芯焊盘上并且包括其表面上的接触区域。 多个电触点分别将半导体芯片的接触区域与引线框架组件的接合指状物连接。 封装化合物封装插入件，半导体芯片和电触点，然而，使得插入件的空心中心未被覆盖。