Abstract:
A DRAM includes a package, a semiconductor chip housed in the package, and a plurality of leads each disposed from the outside of the package over the periphery of the semiconductor chip. The power supply potential is applied to some of the leads. Corresponding to one power supply lead, one power supply pad and one selection pad are formed. Corresponding to another power supply lead, another power supply pad and another selection pad are formed. Each of these two selection pads is connected or not connected to the corresponding power supply lead by bonding. As a result, one of four word configurations is selected. Since these two selection pads are disposed in the vicinity of the corresponding power supply leads, respectively, the number of times of bonding to one power supply lead is reduced.
Abstract:
A power-on-reset signal is generated at a proper timing according to an object to which the power-on-reset signal is sent. A POR signal generating circuit for generating the power-on-reset signal is caused to operate with the voltage of an internal voltage generating circuit.
Abstract:
In a semiconductor memory device selectively implementing one of a 4K refresh cycle and a 8K refresh cycle, the positions of externally applied address signal bits are switched internally by address switching circuits such that memory cells at the same positions are selected regardless of whether the 4K refresh cycle or the 8K refresh cycle is specified according to a refresh cycle mode specify signal. As a result, by testing the device in one refresh cycle mode, the device can be checked in both refresh cycle operations, reducing the test time and making the test easier.
Abstract:
In a semiconductor memory device selectively implementing one of a 4K refresh cycle and a 8K refresh cycle, the positions of externally applied address signal bits are switched internally by address switching circuits such that memory cells at the same positions are selected regardless of whether the 4K refresh cycle or the 8K refresh cycle is specified according to a refresh cycle mode specify signal. As a result, by testing the device in one refresh cycle mode, the device can be checked in both refresh cycle operations, reducing the test time and making the test easier.
Abstract:
A .phi..sub.C generation circuit provides a column address buffer control signal to a column address buffer so that the column address buffer maintains a latch operation during the operation period of a differential amplifier. The column address buffer responds to a column address buffer control signal to latch an input address signal for providing a column address signal to a .phi..sub.D and PAE generation circuit. The .phi..sub.D and PAE generation circuit provides a differential amplifier activation signal to the differential amplifier according to a column address signal and a column access activation signal. The differential amplifier responds to a differential amplifier activation signal for amplifying data applied from a data input and output line to provide the same to a selector via a readout data line.
Abstract:
In a memory cell array, data lines are formed into a hierarchical arrangement of sub data lines provided for every block and a main data line common to each block, and a sub data line selected by a column address among sub data lines belonging a block which are simultaneously selected by a row address is connected to a bit line. Accordingly, the sub data line length is reduced, which reduces floating capacitance, reading and writing operations can be conducted at a high speed, and sub data lines can be selectively operated. In addition, power required for charging the sub data lines can be reduced, and entire power consumption by the semiconductor memory device can be reduced as well.
Abstract:
A .phi..sub.C generation circuit provides a column address buffer control signal to a column address buffer so that the column address buffer maintains a latch operation during the operation period of a differential amplifier. The column address buffer responds to a column address buffer control signal to latch an input address signal for providing a column address signal to a .phi..sub.D and PAE generation circuit. The .phi..sub.D and PAE generation circuit provides a differential amplifier activation signal to the differential amplifier according to a column address signal and a column access activation signal. The differential amplifier responds to a differential amplifier activation signal for amplifying data applied from a data input and output line to provide the same to a selector via a readout data line.
Abstract:
A .phi..sub.C generation circuit provides a column address buffer control signal to a column address buffer so that the column address buffer maintains a latch operation during the operation period of a differential amplifier. The column address buffer responds to a column address buffer control signal to latch an input address signal for providing a column address signal to a .phi..sub.D and PAE generation circuit. The .phi..sub.D and PAE generation circuit provides a differential amplifier activation signal to the differential amplifier according to a column address signal and a column access activation signal. The differential amplifier responds to a differential amplifier activation signal for amplifying data applied from a data input and output line to provide the same to a selector via a readout data line.
Abstract:
Read data supplied from one of a plurality of differential amplifier circuits is transmitted to a read data bus driver circuit via one of a plurality of CMOS transfer gates and a data latch circuit. The potential of read data bus pair is forcedly set to a low level in response to a control signal until the read data is transmitted to the read data bus driver circuit. Thereafter, the read data bus driver circuit drives the read data bus pair in accordance with the transmitted read data. Thereby, a speed of the address access operation can be increased without outputting invalid data.
Abstract:
A semiconductor device which has a sense amplifier and is supplied with an external power supply voltage includes a drive signal line connected to the sense amplifier, a step up circuit generating a first voltage from the external power supply voltage, the first voltage being higher than the external power supply voltage, and a step down circuit lowering the external power supply voltage into a second voltage. For enabling the sense amplifier to perform sensing operation in a normal mode involving external access, the first voltage is applied to the drive signal line in an initial stage of the sensing operation, and thereafter the second voltage is applied to the drive signal line. In a refresh mode not involving external access, the step up circuit is shut down, and the second voltage is applied to the drive signal line from the initial stage of the sensing operation.