Abstract:
Disclosed are a method and an apparatus for repairing composite materials using a solvation process, in which, in the repair of composite materials comprising a matrix resin and a filler fiber, a solution capable of depolymerizing the matrix resin is provided to a portion to be repaired of the composite material to depolymerize the matrix resin. By removing the matrix resin constituting the composite material by solvating it with a solvent while leaving the internal filler fibers, it is possible to secure continuity of the fiber skeleton of the composite material even after the repair, perform very easy repair, and minimize damage to the fiber skeleton.
Abstract:
Disclosed is a composite of filler and polymer resin and a method for preparing the same, including preparing a thermoplastic resin composition by mixing a polymerization catalyst with a polymerizable thermoplastic resin, preparing a pre-pellet including a filler and a polymer resin by mixing a filler with the thermoplastic resin composition and heating to perform in-situ polymerization of the polymerizable thermoplastic resin to the polymer resin, and compounding the pre-pellet or the pre-pellet to which a polymer resin is further added to be pelletized.
Abstract:
For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.
Abstract:
Disclosed are a method and an apparatus for recovering a fiber assembly by decomposing a thermosetting resin composite material, such as carbon fiber reinforced plastic (CFRP) in such a manner the fiber assembly used for the thermosetting composite material, such as CFRP, retains its original organizational shape after decomposition, and a fiber assembly recovered by the method.
Abstract:
Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.
Abstract:
Provided are a composition for swelling pretreatment of a cured thermosetting resin material before decomposition, including a surfactant and an acidic material, and a method for swelling pretreatment of a cured thermosetting resin material before decomposition by using the same. When carrying out swelling pretreatment of a cured thermosetting resin material before decomposition by using the composition, it is possible to accelerate infiltration of the acidic material into the cured thermosetting resin material and swelling of the cured thermosetting resin material by virtue of the surfactant, and thus to increase the decomposition reactive surface area. Therefore, it is possible to increase reaction efficiency during the subsequent decomposition process, and to increase the decomposition ratio during the same period of time.
Abstract:
Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.
Abstract:
A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≤m≤8 and n is a number satisfying 1≤n≤6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.
Abstract:
A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≦m≦8 and n is a number satisfying 1≦n≦6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at 200° C., specifically 100° C. or lower, and to reduce a processing cost and an energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.
Abstract:
Provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, a carbonaceous material post-treated by the method, and a polymer composite material including the carbonaceous material. More particularly, provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, including subjecting the carbonaceous material to dehydrocyclization at room temperature to heal structural defects in the carbonaceous material, while increasing the effective conjugated length of the carbonaceous material to improve the electrical conductivity thereof, as well as a carbonaceous material post-treated by the method and a polymer composite material including the carbonaceous material.