公开(公告)号：US09360644B2

公开(公告)日：2016-06-07

申请号：US14480461

申请日：2014-09-08

Applicant: International Business Machines Corporation

Inventor： Benjamin V. Fasano ,  Paul F. Fortier

IPC: G02B6/12 ,  G02B6/26 ,  H01L21/00 ,  G02B6/43 ,  G02B6/122 ,  G02B6/13

CPC classification number: G02B6/43 ,  G02B6/12 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/13 ,  G02B6/4224 ,  G02B6/4249 ,  G02B2006/12097 ,  G02B2006/121 ,  G02B2006/12121

Abstract: A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die.

Abstract translation: 多半导体器件封装包括激光管芯和光子管芯。 激光裸片产生光并且包括从发光表面发射光的激光小面。 光子管芯调制从激光发射表面发射的光，并且包括暴露与激光小面光学连接的嵌入式波导的器件侧空腔。 激光管芯和光子管芯附接方法包括相对于光子管芯的器件侧定位激光管芯的器件侧，将光子管芯的对准特征与激光器管芯的对准特征接合，将激光器管芯安装在 光电子器件侧凹槽裸片，将激光管芯与光子管芯电连接，并将激光管芯的激光刻面光学连接到拼音模具的嵌入式波导管。

公开(公告)号：US09278401B2

公开(公告)日：2016-03-08

申请号：US13764254

申请日：2013-02-11

Applicant: International Business Machines Corporation

Inventor： Glen N. Biggs ,  Russell A. Budd ,  Benjamin V. Fasano ,  John J. Garant ,  Peter A. Gruber ,  John P. Karidis ,  Bouwe W. Leenstra ,  Phillip W. Palmatier ,  Kevin M. Prettyman ,  Christopher L. Tessler ,  Thomas Weiss

IPC: B23K3/06

CPC classification number: B23K3/0607 ,  B23K3/0638

Abstract: A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet.

Abstract translation: 填充头装置包括用于保持流体的至少一个室。 该腔室具有排出流体的出口。 真空装置具有用于与流体出口相邻的抽吸装置的入口。 多个柔性和弹性密封装置接触工件的顶表面。 密封装置定位在室出口的相对侧和真空装置入口的相对侧上，使得密封装置在由工件限定的空腔周围产生至少一个局部密封，并且空腔位于室出口和 真空出口。

公开(公告)号：US20160070061A1

公开(公告)日：2016-03-10

申请号：US14480461

申请日：2014-09-08

Applicant: International Business Machines Corporation

Inventor： Benjamin V. Fasano ,  Paul F. Fortier

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/43 ,  G02B6/12 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/13 ,  G02B6/4224 ,  G02B6/4249 ,  G02B2006/12097 ,  G02B2006/121 ,  G02B2006/12121

Abstract: A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die.

Abstract translation: 多半导体器件封装包括激光管芯和光子管芯。 激光裸片产生光并且包括从发光表面发射光的激光小面。 光子管芯调制从激光发射表面发射的光，并且包括暴露与激光小面光学连接的嵌入式波导的器件侧空腔。 激光管芯和光子管芯附接方法包括相对于光子管芯的器件侧定位激光管芯的器件侧，将光子管芯的对准特征与激光器管芯的对准特征接合，将激光管芯安装在 光电子器件侧凹槽裸片，将激光管芯与光子管芯电连接，并将激光管芯的激光刻面光学连接到拼音模具的嵌入式波导管。

公开(公告)号：US20140203945A1

公开(公告)日：2014-07-24

申请号：US13746207

申请日：2013-01-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Alan F. Benner ,  Benjamin V. Fasano

IPC: G08B21/18

CPC classification number: G08B21/18 ,  H01R13/641

Abstract: A connection validation apparatus includes a connector engagement mechanism configured to physically engage a connector to connect the connector to a connector interface. The apparatus further includes a connection indication detector located on the connector engagement mechanism and configured to detect at least one of a sound and a vibration corresponding to a secure connection of the connector with the connector interface. The apparatus also includes a connection indicator output unit configured to provide an indication to a user that the connector is securely connected with the connector interface based on the detection of the at least one of the sound and the vibration by the connection indication detector.

Abstract translation: 连接验证装置包括被配置为物理地接合连接器以将连接器连接到连接器接口的连接器接合机构。 该装置还包括位于连接器接合机构上并被配置为检测与连接器与连接器接口的安全连接相对应的声音和振动中的至少一个的连接指示检测器。 该装置还包括连接指示器输出单元，其被配置为基于通过连接指示检测器检测到声音和振动中的至少一个来向用户提供连接器与连接器接口牢固连接的指示。

公开(公告)号：US20170170148A1

公开(公告)日：2017-06-15

申请号：US14969905

申请日：2015-12-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin V. Fasano ,  Mark W. Kapfhammer ,  David J. Lewison ,  Thomas E. Lombardi ,  Thomas Weiss

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2225/06513

Abstract: A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.

公开(公告)号：US20160172288A1

公开(公告)日：2016-06-16

申请号：US14571352

申请日：2014-12-16

Applicant: International Business Machines Corporation

Inventor： Jean Audet ,  Benjamin V. Fasano ,  Shidong Li

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L21/486 ,  H01L21/0274 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lattice structure is formed in a non-silicon interposer substrate to create large cells that are multiples of through hole pitches to act as islands for dielectric fields. Each unit cell is then filled with a dielectric material. Thereafter, holes (i.e., through holes or blind holes) are created within the dielectric material in the cells. After hole formation, a conductive metal is formed into each of the holes providing an interposer. This method can enable fine pitch processing in organic-based materials, isolates the thermal coefficient of expansion (TCE) stress from metal vias to low TCE carriers and creates a path to high volume, low costs components in panel form.

公开(公告)号：US08981961B2

公开(公告)日：2015-03-17

申请号：US13746207

申请日：2013-01-21

Applicant: International Business Machines Corporation

Inventor： Alan F. Benner ,  Benjamin V. Fasano

IPC: G08C17/00 ,  G08B21/00 ,  G08B21/18

CPC classification number: G08B21/18 ,  H01R13/641

Abstract: A connection validation apparatus includes a connector engagement mechanism configured to physically engage a connector to connect the connector to a connector interface. The apparatus further includes a connection indication detector located on the connector engagement mechanism and configured to detect at least one of a sound and a vibration corresponding to a secure connection of the connector with the connector interface. The apparatus also includes a connection indicator output unit configured to provide an indication to a user that the connector is securely connected with the connector interface based on the detection of the at least one of the sound and the vibration by the connection indication detector.

Abstract translation: 连接验证装置包括被配置为物理地接合连接器以将连接器连接到连接器接口的连接器接合机构。 该装置还包括位于连接器接合机构上并被配置为检测与连接器与连接器接口的安全连接相对应的声音和振动中的至少一个的连接指示检测器。 该装置还包括连接指示器输出单元，其被配置为基于通过连接指示检测器检测到声音和振动中的至少一个来向用户提供连接器与连接器接口牢固连接的指示。

公开(公告)号：US08940550B1

公开(公告)日：2015-01-27

申请号：US13972981

申请日：2013-08-22

Applicant: International Business Machines Corporation

Inventor： Benjamin V. Fasano ,  Shidong Li ,  Thomas Weiss

IPC: H01L21/603 ,  H01L23/00 ,  H01L21/48 ,  H01L23/492

CPC classification number: H01L24/11 ,  H01L21/4878 ,  H01L23/492 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75272 ,  H01L2224/75733 ,  H01L2224/75735 ,  H01L2224/75744 ,  H01L2224/81011 ,  H01L2224/81075 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/92125 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Methods for preventing warpage of a laminate may include placing the laminate on a back plate and applying a magnetic force to the laminate to hold the laminate flat against the back plate. In some embodiments, the magnetic force may be applied by placing a first magnet above the laminate so that an attractive force generated between the first magnet and a ferromagnetic region of the back plate pulls the first magnet against the laminate, thereby holding the laminate flat against the back plate. In other embodiments, the magnetic force may be applied by placing a first magnet above the laminate and placing a second magnet above the first magnet so that a repulsive force generated between the first magnet and the magnet pushes the first magnet against the laminate, thereby holding the laminate flat against the back plate.

Abstract translation: 用于防止层压体翘曲的方法可以包括将层压板放置在背板上并向层压板施加磁力，以将层压板平坦地抵靠在背板上。 在一些实施例中，可以通过将第一磁体放置在层压板上方来施加磁力，使得在第一磁体和后板的铁磁区域之间产生的吸引力将第一磁体拉到层压板上，从而将层压板保持抵靠 背板。 在其他实施例中，可以通过将第一磁体放置在层压板上方并将第二磁体放置在第一磁体上方来施加磁力，使得在第一磁体和磁体之间产生的排斥力将第一磁体推到层压板上，从而保持 层压板与背板平齐。

公开(公告)号：US09947204B2

公开(公告)日：2018-04-17

申请号：US14501279

申请日：2014-09-30

Applicant: International Business Machines Corporation

Inventor： Alan F. Benner ,  Benjamin V. Fasano

IPC: G08C17/00 ,  G08B21/18 ,  H01R13/641

CPC classification number: G08B21/18 ,  H01R13/641

Abstract: A connection validation apparatus includes a connector engagement mechanism configured to physically engage a connector to connect the connector to a connector interface. The apparatus further includes a connection indication detector located on the connector engagement mechanism and configured to detect at least one of a sound and a vibration corresponding to a secure connection of the connector with the connector interface. The apparatus also includes a connection indicator output unit configured to provide an indication to a user that the connector is securely connected with the connector interface based on the detection of the at least one of the sound and the vibration by the connection indication detector.

公开(公告)号：US09673177B1

公开(公告)日：2017-06-06

申请号：US14969905

申请日：2015-12-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin V. Fasano ,  Mark W. Kapfhammer ,  David J. Lewison ,  Thomas E. Lombardi ,  Thomas Weiss

IPC: H01L23/31 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2225/06513

Abstract: A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.