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公开(公告)号：US12002700B2
公开(公告)日：2024-06-04
申请号：US17346743
申请日：2021-06-14
Applicant: Kioxia Corporation
Inventor： Sho Kawadahara
IPC: H01L21/683 , H01L23/00
CPC classification number: H01L21/683 , H01L24/74 , H01L24/741 , H01L24/743 , H01L24/744 , H01L24/80 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/84 , H01L24/94 , H01L24/95 , H01L2224/75733 , H01L2224/75734 , H01L2224/76733 , H01L2224/77733 , H01L2224/8022 , H01L2224/8122 , H01L2224/8221 , H01L2224/8322 , H01L2224/8421 , H01L2224/9512 , H01L2224/95133 , H01L2224/95144 , H01L2224/95145
Abstract: According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate.
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公开(公告)号：US09245875B2
公开(公告)日：2016-01-26
申请号：US14394501
申请日：2013-04-19
Applicant: Rensselaer Polytechnic Institute
Inventor： Robert F. Karlicek , James Jian-Qiang Lu , Charles Sanford Goodwin , Anton Tkachenko
IPC: H01L25/075 , H01L23/00 , H01L21/683
CPC classification number: H01L25/50 , H01L21/6836 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/83 , H01L24/95 , H01L24/96 , H01L25/0753 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/04026 , H01L2224/05655 , H01L2224/13101 , H01L2224/24225 , H01L2224/245 , H01L2224/291 , H01L2224/32225 , H01L2224/75252 , H01L2224/75283 , H01L2224/75655 , H01L2224/75701 , H01L2224/75733 , H01L2224/75801 , H01L2224/76655 , H01L2224/76701 , H01L2224/76733 , H01L2224/76801 , H01L2224/82002 , H01L2224/82102 , H01L2224/82143 , H01L2224/83002 , H01L2224/83143 , H01L2224/83191 , H01L2224/8323 , H01L2224/83801 , H01L2224/9202 , H01L2224/95101 , H01L2224/95144 , H01L2924/00011 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/3511 , H01L2933/0066 , H01L2924/014 , H01L2924/01047 , H01L2924/00 , H01L2224/83205 , H01L2924/00014
Abstract: Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
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公开(公告)号：US09418979B2
公开(公告)日：2016-08-16
申请号：US14967629
申请日：2015-12-14
Applicant: RENSSELAER POLYTECHNIC INSTITUTE
IPC: H01L25/00 , H01L23/00 , H01L21/683 , H01L25/075
CPC classification number: H01L25/50 , H01L21/6836 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/83 , H01L24/95 , H01L24/96 , H01L25/0753 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/04026 , H01L2224/05655 , H01L2224/13101 , H01L2224/24225 , H01L2224/245 , H01L2224/291 , H01L2224/32225 , H01L2224/75252 , H01L2224/75283 , H01L2224/75655 , H01L2224/75701 , H01L2224/75733 , H01L2224/75801 , H01L2224/76655 , H01L2224/76701 , H01L2224/76733 , H01L2224/76801 , H01L2224/82002 , H01L2224/82102 , H01L2224/82143 , H01L2224/83002 , H01L2224/83143 , H01L2224/83191 , H01L2224/8323 , H01L2224/83801 , H01L2224/9202 , H01L2224/95101 , H01L2224/95144 , H01L2924/00011 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/3511 , H01L2933/0066 , H01L2924/014 , H01L2924/01047 , H01L2924/00 , H01L2224/83205 , H01L2924/00014
Abstract: Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
Abstract translation: 本文公开了一种在衬底上组装发光二极管（LED）管芯的阵列的方法，包括：将管芯定位在流体中; 将模具暴露于磁力以将模具吸引到布置在基板上或附近的预定位置的磁体上; 并且在所述管芯和所述衬底之间形成永久连接，从而在衬底上构成LED管芯阵列。
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公开(公告)号：US09073158B2
公开(公告)日：2015-07-07
申请号：US14096263
申请日：2013-12-04
Inventor： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
IPC: H01L23/34 , B23Q3/18 , H01L21/50 , H01L23/00 , H01L21/56 , H01L23/498 , H01L23/538
CPC classification number: B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
Abstract: A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
Abstract translation: 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。 通孔位于下夹具中并在第一包装部件下方。 底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。 通过执行选自抽真空和通过通孔的空气吹扫的动作来施加力。
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公开(公告)号：US20150050761A1
公开(公告)日：2015-02-19
申请号：US14394501
申请日：2013-04-19
Applicant: Rensselaer Polytechnic Institute
Inventor： Robert F. Karlicek , James Jian-Qiang Lu , Charles Sanford Goodwin , Anton Tkachenko
IPC: H01L25/075
CPC classification number: H01L25/50 , H01L21/6836 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/83 , H01L24/95 , H01L24/96 , H01L25/0753 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/04026 , H01L2224/05655 , H01L2224/13101 , H01L2224/24225 , H01L2224/245 , H01L2224/291 , H01L2224/32225 , H01L2224/75252 , H01L2224/75283 , H01L2224/75655 , H01L2224/75701 , H01L2224/75733 , H01L2224/75801 , H01L2224/76655 , H01L2224/76701 , H01L2224/76733 , H01L2224/76801 , H01L2224/82002 , H01L2224/82102 , H01L2224/82143 , H01L2224/83002 , H01L2224/83143 , H01L2224/83191 , H01L2224/8323 , H01L2224/83801 , H01L2224/9202 , H01L2224/95101 , H01L2224/95144 , H01L2924/00011 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/3511 , H01L2933/0066 , H01L2924/014 , H01L2924/01047 , H01L2924/00 , H01L2224/83205 , H01L2924/00014
Abstract: Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
Abstract translation: 本文公开了一种在衬底上组装发光二极管（LED）管芯的阵列的方法，包括：将管芯定位在流体中; 将模具暴露于磁力以将模具吸引到布置在基板上或附近的预定位置的磁体上; 并且在所述管芯和所述衬底之间形成永久连接，从而在衬底上构成LED管芯阵列。
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Patent Agency Ranking
6.发明申请Semiconductor Chips for TAG Applications, Devices for Mounting the Same, and Mounting Method 有权用于TAG应用的半导体芯片，用于安装其的设备和安装方法公开(公告)号：US20080121724A1
公开(公告)日：2008-05-29
申请号：US11938857
申请日：2007-11-13
Applicant: Gottfried Beer , Werner Weber
Inventor： Gottfried Beer , Werner Weber
CPC classification number: H01L21/67144 , G06K19/07718 , H01L21/67132 , H01L23/49855 , H01L24/95 , H01L2224/75733 , H01L2224/95144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01072 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00
Abstract: A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or electrostatic lifter, which picks up singulated semiconductor chips of a semiconductor wafer with a magnetic coating or including an electrostatically chargeable structure from a wafer position and deposits them in a collecting position. A mounting device includes a conveying roller with conveying receptacles for semiconductor chips, which pick up the semiconductor chips in a pick-up position with electromagnetically or electrostatically activatable conveying receptacles and, in a discharge position will discharge, via deactivation of the conveying receptacles, the semiconductor chips onto a corresponding liner or an object.
Abstract translation: TAG芯片包括磁性涂层或静电电荷结构。 用于包装半导体芯片的装置包括电磁或静电提升器，其利用磁性涂层拾取半导体晶片的单个半导体芯片，或者从晶片位置拾取可静电充电的结构，并将它们沉积在收集位置。 安装装置包括具有用于半导体芯片的输送容器的输送辊，其利用电磁或静电可激活的输送容器拾取拾取位置中的半导体芯片，并且在放电位置将通过输送容器的失活将其排出， 半导体芯片到相应的衬里或物体上。
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公开(公告)号：US20140091509A1
公开(公告)日：2014-04-03
申请号：US14096263
申请日：2013-12-04
Inventor： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
IPC: B23Q3/18
CPC classification number: B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
Abstract: A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
Abstract translation: 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。 通孔位于下夹具中并在第一包装部件下方。 底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。 通过执行选自抽真空和通过通孔的空气吹扫的动作来施加力。
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公开(公告)号：US20130095608A1
公开(公告)日：2013-04-18
申请号：US13272032
申请日：2011-10-12
Applicant: Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
Inventor： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
CPC classification number: B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
Abstract: A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
Abstract translation: 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。 通孔位于下夹具中并在第一包装部件下方。 底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。 通过执行从通过通孔的抽真空和空气吹扫的组中选择的动作来施加力。
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公开(公告)号：US08042593B2
公开(公告)日：2011-10-25
申请号：US12174771
申请日：2008-07-17
Applicant: Cheal-Sang Yoon , Yong-Dae Ha , Jae-Ryoung Lee , Jeong-Soon Cho , Bum-Woo Lee , Pil-June Kim
Inventor： Cheal-Sang Yoon , Yong-Dae Ha , Jae-Ryoung Lee , Jeong-Soon Cho , Bum-Woo Lee , Pil-June Kim
IPC: B32B37/00
CPC classification number: H01L24/95 , H01L21/6838 , H01L24/28 , H01L24/75 , H01L24/83 , H01L2224/2919 , H01L2224/75733 , H01L2224/83192 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T156/17 , H01L2924/00
Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.
Abstract translation: 当施加接合负载时，半导体芯片接合装置将半导体芯片相对于引线框架保持在并联状态。
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10.发明授权Semiconductor chips for TAG applications, devices for mounting the same, and mounting method 有权用于TAG应用的半导体芯片，用于安装其的装置和安装方法公开(公告)号：US07922093B2
公开(公告)日：2011-04-12
申请号：US11938857
申请日：2007-11-13
Applicant: Gottfried Beer , Werner Weber
Inventor： Gottfried Beer , Werner Weber
CPC classification number: H01L21/67144 , G06K19/07718 , H01L21/67132 , H01L23/49855 , H01L24/95 , H01L2224/75733 , H01L2224/95144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01072 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00
Abstract: A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or electrostatic lifter, which picks up singulated semiconductor chips of a semiconductor wafer with a magnetic coating or including an electrostatically chargeable structure from a wafer position and deposits them in a collecting position. A mounting device includes a conveying roller with conveying receptacles for semiconductor chips, which pick up the semiconductor chips in a pick-up position with electromagnetically or electrostatically activatable conveying receptacles and, in a discharge position will discharge, via deactivation of the conveying receptacles, the semiconductor chips onto a corresponding liner or an object.
Abstract translation: TAG芯片包括磁性涂层或静电电荷结构。 用于包装半导体芯片的装置包括电磁或静电提升器，其利用磁性涂层拾取半导体晶片的单个半导体芯片，或者从晶片位置拾取可静电充电的结构，并将它们沉积在收集位置。 安装装置包括具有用于半导体芯片的输送容器的输送辊，其利用电磁或静电可激活的输送容器拾取拾取位置中的半导体芯片，并且在放电位置将通过输送容器的失活将其排出， 半导体芯片到相应的衬里或物体上。
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